Patents by Inventor Kee W. Park

Kee W. Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8054696
    Abstract: A method and apparatus are disclosed for improving reliability in a memory circuit. The method includes coupling a pull-down element to a word line, the pull-down element coupled distal to a word line driver. The method further includes, when the word line exhibits a defect causing a first portion of the word line to be electrically isolated from a second portion of the word line, holding the second portion of the word line at a logically low value using the pull-down element. A memory device is disclosed that includes a word line coupled to a memory cell, a word line driver coupled to one end of the word line, and a pull-down element coupled proximate the other end of the word line. The pull-down element is operable, when the word line exhibits a defect causing a first portion of the word line to be electrically isolated from a second portion of the word line, to hold the second portion of the word line at a logical low value.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: November 8, 2011
    Assignee: NetLogic Microsystems, Inc.
    Inventor: Kee W. Park
  • Patent number: 7847404
    Abstract: A packaged integrated circuit device and a circuit board assembly are disclosed that include a semiconductor die and a package substrate that includes a first grid array of contact pads that are electrically coupled to corresponding contact pads on the semiconductor die. The first grid array of contact pads includes a first set of adjacent rows or columns of contact pads that are coupled to a first channel that extends within a ground plane of the package substrate. The first grid array of contact pads includes a second set of adjacent rows or columns of contact pads that are electrically coupled to a second channel that extends within a power plane of the package substrate. The contact pads in the first set of adjacent rows or columns of contact pads directly overlie a portion of the first channel and the contact pads in the second set of adjacent rows or columns of contact pads directly overlie a portion of the second channel.
    Type: Grant
    Filed: March 20, 2008
    Date of Patent: December 7, 2010
    Assignee: Integrated Device Technology, Inc.
    Inventors: Bruce Schwegler, Kee W. Park, Jeff Vesey
  • Patent number: 7565597
    Abstract: A novel method for scanning bit parity in a memory array, and a circuit for implementing it, are disclosed. In a memory array that has one or more rows of memory cells, the method for checking data parity includes storing a plurality of data bits in the memory cells, scanning a row of memory cells independently of a memory read operation to ascertain the stored data bits; and determining parity for the row of memory cells by the results of the scanning. The method is accomplished by means of a dedicated parity scanning circuit.
    Type: Grant
    Filed: December 21, 2005
    Date of Patent: July 21, 2009
    Assignee: Integrated Device Technology, Inc.
    Inventors: Kenneth Branth, Kee W. Park
  • Patent number: 5596533
    Abstract: A method and an apparatus for reading/writing data from/into a semiconductor memory device. In a read mode, a memory cell array block from which data is to be read is selected in response to a row address signal and a column of the selected memory cell array block is selected in response to a column address signal. Data are transferred from a memory cell of the selected column to a pair of bit lines of the selected column and then sense-amplified. A read signal is decoded and a pair of column decoding lines of the selected column become a desired logic state in accordance with the decoded result. A current path is formed between one of the column decoding lines and a ground terminal in response to the sense-amplified data on the bit lines. Data on the column decoding lines are selected and sense-amplified. The sense-amplified data are transferred externally.
    Type: Grant
    Filed: April 2, 1996
    Date of Patent: January 21, 1997
    Assignee: Hyundai Electronics Industries Co., Ltd.
    Inventor: Kee W. Park
  • Patent number: 5512854
    Abstract: A data output buffer for a semiconductor memory device having a plurality of memory cells, each of the memory cells storing a data signal. The data output buffer comprises: an input line for inputting the data signal from each of the memory cells; a pull-up driver connected between a supply voltage source and an output line, the pull-up driver being driven in response to a first logic of the data signal from the input line; a pull-down driver connected between a ground voltage source and the output line, the pull-down driver being driven complementarily to the pull-up driver in response to a second logic of the data signal from the input line; at least one auxiliary pull-up driver connected in parallel to the pull-up driver; and a controller for driving the at least one auxiliary pull-up driver for a predetermined time period from a start portion of the first logic of the data signal from the input line.
    Type: Grant
    Filed: December 28, 1994
    Date of Patent: April 30, 1996
    Assignee: Hyundai Electronics Industries Co., Inc.
    Inventor: Kee W. Park