Patents by Inventor Kee Yun Han
Kee Yun Han has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11389922Abstract: The present embodiments provide a mechanism for computing a thickness of a scanned wafer shape to determine a profile, and computing a delta correction value and a polishing end point time by using a computed PV value by the profile and a set predicted PV value and reflecting the same on the polishing time of each wafer which is under polishing. Accordingly, excellent flatness of a wafer surface can be achieved and simultaneously, a plurality of controllers can be controlled simultaneously to reduce equipment cost.Type: GrantFiled: January 11, 2017Date of Patent: July 19, 2022Assignee: SK Siltron Co., Ltd.Inventors: Kee Yun Han, Suk Jin Jung
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Publication number: 20210205948Abstract: The present embodiments provide a mechanism for computing a thickness of a scanned wafer shape to determine a profile, and computing a delta correction value and a polishing end point time by using a computed PV value by the profile and a set predicted PV value and reflecting the same on the polishing time of each wafer which is under polishing. Accordingly, excellent flatness of a wafer surface can be achieved and simultaneously, a plurality of controllers can be controlled simultaneously to reduce equipment cost.Type: ApplicationFiled: January 11, 2017Publication date: July 8, 2021Inventors: Kee Yun HAN, Suk Jin JUNG
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Patent number: 10255669Abstract: Provided is a device for measuring wafer defects, which prevents damage of a wafer and also measures defects at upper, lower and side surfaces of the wafer simultaneously. The device for measuring wafer defects includes a lower blower configured to inject air to a lower surface of a wafer to float the wafer; an upper blower provided to be moved up and down with respect to the lower blower and configured to inject the air to an upper surface of the wafer to fix the wafer; an upper contamination measuring part provided at an upper side of the upper blower and configured to detect contamination on the upper surface of the wafer; a lower contamination measuring part provided at a lower side of the lower blower and configured to detect contamination on the lower surface of the wafer; and a side contamination measuring part provided between the upper and lower blowers and configured to detect contamination on a side surface of the wafer.Type: GrantFiled: July 28, 2015Date of Patent: April 9, 2019Assignee: SK Siltron Co., Ltd.Inventors: Chi-Hun Kang, Kee-Yun Han
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Patent number: 10062574Abstract: A wafer polishing apparatus capable of maintaining a drive ring in a flat state and a wafer polishing method are provided. In the wafer polishing apparatus and method according to an embodiment, when the head assembly moves to the initial descending position by the wafer elevation unit, the shape of the drive ring inside the head assembly may be measured by using the sensor, and thus the polishing process may be performed in the state where the descending position of the head assembly is automatically adjusted by using the head auxiliary elevation unit to maintain the drive ring in the flat state. Therefore, since the wafer polishing process is performed in the state the balance of the wafer mounting part is automatically adjusted by using the drive ring, the polishing quality of the wafer may be uniformly maintained, and also the polishing performance may be improved.Type: GrantFiled: August 25, 2015Date of Patent: August 28, 2018Assignee: SK SILTRON CO., LTD.Inventors: Jin-Woo Ahn, Kee-Yun Han
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Patent number: 9744641Abstract: A wafer polishing apparatus includes a lower surface plate, an upper surface plate disposed over the lower surface plate, a carrier disposed between the lower surface plate and the upper surface plate and containing a wafer, and a lift unit lifting the carrier such that an upper surface of the carrier contacts a lower surface of the upper surface plate or lowering the carrier such that a lower surface of the carrier contacts an upper surface of the lower surface plate.Type: GrantFiled: July 21, 2015Date of Patent: August 29, 2017Assignee: LG SILTRON INCORPORATEDInventor: Kee Yun Han
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Patent number: 9724800Abstract: Disclosed is a wafer polishing apparatus including a base, a lower surface plate disposed on the upper surface of the base, an upper surface plate disposed on the lower surface plate and a first shape adjustment unit configured to deform the shape of the lower surface of the upper surface plate so that the lower surface of the upper surface plate has one of a concave shape, a flat shape and a convex shape in a first direction, and the first direction is a direction from the lower surface plate to the upper surface plate.Type: GrantFiled: June 29, 2015Date of Patent: August 8, 2017Assignee: LG Siltron IncorporatedInventors: Kee Yun Han, Eun Suck Choi
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Publication number: 20170213333Abstract: Provided is a device for measuring wafer defects, which prevents damage of a wafer and also measures defects at upper, lower and side surfaces of the wafer simultaneously. The device for measuring wafer defects includes a lower blower configured to inject air to a lower surface of a wafer to float the wafer; an upper blower provided to be moved up and down with respect to the lower blower and configured to inject the air to an upper surface of the wafer to fix the wafer; an upper contamination measuring part provided at an upper side of the upper blower and configured to detect contamination on the upper surface of the wafer; a lower contamination measuring part provided at a lower side of the lower blower and configured to detect contamination on the lower surface of the wafer; and a side contamination measuring part provided between the upper and lower blowers and configured to detect contamination on a side surface of the wafer.Type: ApplicationFiled: July 28, 2015Publication date: July 27, 2017Inventors: Chi-Hun KANG, Kee-Yun HAN
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Publication number: 20160189972Abstract: A wafer polishing apparatus capable of maintaining a drive ring in a flat state and a wafer polishing method are provided. In the wafer polishing apparatus and method according to an embodiment, when the head assembly moves to the initial descending position by the wafer elevation unit, the shape of the drive ring inside the head assembly may be measured by using the sensor, and thus the polishing process may be performed in the state where the descending position of the head assembly is automatically adjusted by using the head auxiliary elevation unit to maintain the drive ring in the flat state. Therefore, since the wafer polishing process is performed in the state the balance of the wafer mounting part is automatically adjusted by using the drive ring, the polishing quality of the wafer may be uniformly maintained, and also the polishing performance may be improved.Type: ApplicationFiled: August 25, 2015Publication date: June 30, 2016Inventors: Jin-Woo AHN, Kee-Yun HAN
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Patent number: 9358666Abstract: Disclosed is a slurry supply device including a nozzle configured to eject slurry, a slurry supply unit configured to receive the slurry from the nozzle and to discharge the slurry through at least one slurry hole, a receiving unit configured to allow the slurry supply unit to be mounted, inserted, seated, coupled, supported, or placed therein so as to enable discharge of the slurry from the slurry supply unit, the receiving unit being configured to receive a flowing material around the slurry supply unit and a slurry protection unit configured to enclose a space for passage of the slurry from an exit of the nozzle to an entrance of the slurry supply unit in conjunction with the flowing material.Type: GrantFiled: December 16, 2014Date of Patent: June 7, 2016Assignee: LG SILTRON INCORPORATEDInventors: Jae Hyun Bae, Kee Yun Han
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Publication number: 20160074990Abstract: A wafer polishing apparatus includes a lower surface plate, an upper surface plate disposed over the lower surface plate, a carrier disposed between the lower surface plate and the upper surface plate and containing a wafer, and a lift unit lifting the carrier such that an upper surface of the carrier contacts a lower surface of the upper surface plate or lowering the carrier such that a lower surface of the carrier contacts an upper surface of the lower surface plate.Type: ApplicationFiled: July 21, 2015Publication date: March 17, 2016Inventor: Kee Yun HAN
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Publication number: 20160045999Abstract: Disclosed is a slurry supply device including a nozzle configured to eject slurry, a slurry supply unit configured to receive the slurry from the nozzle and to discharge the slurry through at least one slurry hole, a receiving unit configured to allow the slurry supply unit to be mounted, inserted, seated, coupled, supported, or placed therein so as to enable discharge of the slurry from the slurry supply unit, the receiving unit being configured to receive a flowing material around the slurry supply unit and a slurry protection unit configured to enclose a space for passage of the slurry from an exit of the nozzle to an entrance of the slurry supply unit in conjunction with the flowing material.Type: ApplicationFiled: December 16, 2014Publication date: February 18, 2016Inventors: Jae Hyun Bae, Kee Yun Han