Patents by Inventor Keehong Um

Keehong Um has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6674346
    Abstract: A evanescent resonator device includes a short-circuited evanescent waveguide and loading capacitor. The evanescent waveguide of the resonator includes a single length of evanescent transmission line terminated in short circuit, a first support substrate having a predetermined dielectric constant, the first support substrate having a top surface and a bottom surface; a dielectrically loaded feed network including: (a) a second substrate arranged on the top surface of the first support substrate, the second substrate having a predetermined dielectric constant that is higher than the first support substrate; and (b) a metal strip arranged on an upper surface of the second substrate, so that the second substrate is arranged between the first support substrate and the second substrate. A ground plane is arranged on the bottom surface of the first support substrate, the support substrate includes a hollow metalized center area being open on an upper end closest to the second substrate.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: January 6, 2004
    Assignee: New Jersey Institute of Technology
    Inventors: Richard V. Snyder, Edip Niver, Keehong Um, Sanghoon Shin
  • Publication number: 20030189469
    Abstract: A evanescent resonator device includes a short-circuited evanescent waveguide and loading capacitor. The evanescent waveguide of the resonator includes a single length of evanescent transmission line terminated in short circuit, a first support substrate having a predetermined dielectric constant, the first support substrate having a top surface and a bottom surface; a dielectrically loaded feed network including: (a)a second substrate arranged on the top surface of the first support substrate, the second substrate having a predetermined dielectric constant that is higher than the first support substrate; and (b) a metal strip arranged on an upper surface of the second substrate, so that the second substrate is arranged between the first support substrate and the second substrate. A ground plane is arranged on the bottom surface of the first support substrate, the support substrate includes a hollow metalized center area being open on an upper end closest to the second substrate.
    Type: Application
    Filed: May 31, 2002
    Publication date: October 9, 2003
    Inventors: Richard V. Snyder, Edip Niver, Keehong Um, Sanghoon Shin