Abstract: The present invention relates to a tape for semiconductor package used to attach a chip and a lead frame or a chip and a substrate, method of manufacturing the same, and method of manufacturing the package using the tape. The tape of the present invention is manufactured by applying a release film at one side of a base film having a sheet type or a roll type, forming a plurality of alignment holes, at a given distance, along the edge of the base film by means of punching or etching process, for exact position alignment, and forming a thermoplastic pattern on the release film so that it can match to a lead frame or the portion to which a chip of a substrate is attached, by means of screen printing process using a mask. Also, the tape of the present invention can be used in manufacturing all the packages such as a package for attaching the chip to the lead frame as the package of a lead on chip (LOC) type, and the package for attaching the chip to the substrate as the chip scale package (CSP), etc.