Patents by Inventor Keeny Chang

Keeny Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flip chip test structure
    Patent number: 7141996
    Abstract: A flip chip test structure is disclosed. The flip chip test structure utilizes a substrate used in flip chip package to replace the conventional transformer of a flip chip wafer probe card. The substrate-transformer replacement reduces the cost and simplifies the flip chip wafer probe card manufacturing process since the substrate is already available and matches the chip being tested while the transformer needs additional design and custom fabrication which are expensive and time-wasting for corresponding chip being tested.
    Type: Grant
    Filed: May 6, 2003
    Date of Patent: November 28, 2006
    Assignee: Via Technologies, Inc.
    Inventors: Keeny Chang, Shelton Lu
  • Flip chip test structure
    Publication number: 20040061515
    Abstract: A flip chip test structure is disclosed. The flip chip test structure utilizes a substrate used in flip chip package to replace the conventional transformer of a flip chip wafer probe card. The substrate-transformer replacement reduces the cost and simplifies the flip chip wafer probe card manufacturing process since the substrate is already available and matches the chip being tested while the transformer needs additional design and custom fabrication which are expensive and time-wasting for corresponding chip being tested.
    Type: Application
    Filed: May 6, 2003
    Publication date: April 1, 2004
    Inventors: Keeny Chang, Shelton Lu