Patents by Inventor Kees VAN Steensel

Kees VAN Steensel has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 3942187
    Abstract: Improved metal interconnections for a semiconductor device is described. The interconnections comprise a first metal layer, eg. aluminum, connected to the semiconductor, a second metal layer, eg. gold, for external connection, and a third metal layer interconnecting the first and second metal layers such that the junction areas of interconnection are laterally spaced from one another.
    Type: Grant
    Filed: December 29, 1969
    Date of Patent: March 2, 1976
    Assignee: U.S. Philips Corporation
    Inventors: Richardus Johannes Henricus Gelsing, Kees VAN Steensel