Patents by Inventor Keeseok Kim

Keeseok Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic device and method for providing notification related to image displayed through display and image stored in memory based on image analysis
    Patent number: 10924677
    Abstract: An electronic device including is disclosed. The electronic device includes at least one camera, at least one memory, a display, and at least one processor. The at least one processor is configured to acquire an image through the at least one camera. The at least one processor is also configured to acquire a plurality of parameters related to acquiring the image. The at least one processor is additionally configured to identify a feedback of a plurality of feedbacks to be provided to a user according to priorities associated with the plurality of feedbacks that are provided to the user, based on a portion of the plurality of acquired parameters. The at least one processor is further configured to display a guidance corresponding to the identified feedback through the display.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: February 16, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Keeseok Kim, Yunson Yoo, Kwangkyu Park, Yongho You, Chanhee Yoon, Jinwon Jang, Kyoungsu Cho, Wooyong Lee
  • ELECTRONIC DEVICE AND METHOD FOR PROVIDING NOTIFICATION RELATED TO IMAGE DISPLAYED THROUGH DISPLAY AND IMAGE STORED IN MEMORY BASED ON IMAGE ANALYSIS
    Publication number: 20200053288
    Abstract: An electronic device including is disclosed. The electronic device includes at least one camera, at least one memory, a display, and at least one processor. The at least one processor is configured to acquire an image through the at least one camera. The at least one processor is also configured to acquire a plurality of parameters related to aquringing the image. The at least one processor is additionally configured to identify a feedback of a plurality of feedbacks to be provided to a user according to priorities associated with the plurality of feedbacks that are provided to the user, based on a portion of the plurality of acquired parameters. The at least one processor is further configured to display a guidance corresponding to the identified feedback through the display.
    Type: Application
    Filed: August 8, 2019
    Publication date: February 13, 2020
    Inventors: Keeseok KIM, Yunson YOO, Kwangkyu PARK, Yongho YOU, Chanhee YOON, Jinwon JANG, Kyoungsu CHO, Wooyong LEE
  • Semiconductor package and method of manufacturing the same
    Patent number: 8125042
    Abstract: Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semiconductor chip. The adhesive pattern is disposed between the semiconductor chip and the transparent substrate and provides a space on the pixel area. At least one dew-proofer is disposed between the semiconductor chip and the transparent substrate and spaced from the adhesive pattern.
    Type: Grant
    Filed: November 13, 2009
    Date of Patent: February 28, 2012
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-Hwan Kim, Un-Byoung Kang, Dong-Hun Yi, Woonseong Kwon, Hyung-Sun Jang, Jongkeun Jeon, Yongjin Lee, Keeseok Kim
  • SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20100117181
    Abstract: Provided are a semiconductor package and a method of manufacturing the same. The semiconductor package includes a semiconductor chip, a transparent substrate, an adhesive pattern, and at least one dew-proofer. The semiconductor includes a pixel area. The transparent substrate is disposed on the semiconductor chip. The adhesive pattern is disposed between the semiconductor chip and the transparent substrate and provides a space on the pixel area. At least one dew-proofer is disposed between the semiconductor chip and the transparent substrate and spaced from the adhesive pattern.
    Type: Application
    Filed: November 13, 2009
    Publication date: May 13, 2010
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jung-Hwan Kim, Un-Byoung Kang, Dong-Hun Yi, Woonseong Kwon, Hyung-Sun Jang, Jongkeun Jeon, Yongjin Lee, Keeseok Kim