Patents by Inventor Ke Hong Fang

Ke Hong Fang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resin compound, preparation method thereof, prepreg made therefrom, and copper cladded laminate made therefrom
    Patent number: 8629219
    Abstract: The present invention relates to an epoxy resin compound, a preparation method thereof, a prepreg made therefrom, and a copper cladded laminate made therefrom. The epoxy resin compound comprises: 30-80 parts by weight of epoxy resin; 20-50 parts by weight of polyphenylene ether resin of new structure with the number average molecular weight thereof being 1000-5000, which is prepared via the redistribution reaction of polyphenylene ether and phenolic resin with the existing of initiator agent; 0-50 parts by weight of filler; 1-20 parts by weight of ingredient. The epoxy resin compound of the present invention, has good heat resistance and dielectric property, and has a simple preparation process, which is good for batch production.
    Type: Grant
    Filed: June 22, 2010
    Date of Patent: January 14, 2014
    Assignee: Guangdong Shengyi Sci. Tech Co., Ltd.
    Inventors: Dong Wei, Ke Hong Fang
  • EPOXY RESIN COMPOUND, PREPARATION METHOD THEREOF, PREPREG MADE THEREFROM, AND COPPER CLADDED LAMINATE MADE THEREFROM
    Publication number: 20110143618
    Abstract: The present invention relates to an epoxy resin compound, a preparation method thereof, a prepreg made therefrom, and a copper cladded laminate made therefrom. The epoxy resin compound comprises: 30-80 parts by weight of epoxy resin; 20-50 parts by weight of polyphenylene ether resin of new structure with the number average molecular weight thereof being 1000-5000, which is prepared via the redistribution reaction of polyphenylene ether and phenolic resin with the existing of initiator agent; 0-50 parts by weight of filler; 1-20 parts by weight of ingredient. The epoxy resin compound of the present invention, has good heat resistance and dielectric property, and has a simple preparation process, which is good for batch production.
    Type: Application
    Filed: June 22, 2010
    Publication date: June 16, 2011
    Applicant: GUANGDONG SHENGYI SCI.TECH CO., LTD.
    Inventors: DONG WEI, Ke Hong Fang