Patents by Inventor Kei Anai
Kei Anai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20250149492Abstract: Provided is a copper paste for pressure bonding, the copper paste at least containing two or more copper powders having different shapes and/or particle sizes and a solvent. The copper paste has a viscosity of 10 Pa·s or more and 200 Pa·s or less. The ratio of the total mass of the two or more copper powders to the mass of the copper paste, A, is 0.60 or more and less than 0.82. When the index of bulkiness, H, is defined as H=C/(A×B), H is 0.75 or more and 1.00 or less, wherein A is as defined above, B represents the film thickness of a coating film formed by applying the copper paste to a substrate, and C represents the film thickness of a dried coating film formed by drying the coating film in an air atmosphere at 110° C. for 20 minutes.Type: ApplicationFiled: February 28, 2023Publication date: May 8, 2025Inventors: Kei ANAI, Jo NISHIKAWA
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Patent number: 12263523Abstract: A method is provided for producing a bonding composition containing copper particles and a second liquid medium. In this production method, the copper particles are produced in a first liquid medium using a wet reduction method, and thus a dispersion of the copper particles is prepared. Subsequently, the first liquid medium in the dispersion is ultimately, finally or eventually replaced with the second liquid medium while the dispersion is kept wet. It is also preferable that the first liquid medium is replaced with another liquid medium one or more times, and the second liquid medium is used in the final replacement. The liquid media are preferably replaced at a temperature of lower than 100° C. The second liquid medium preferably includes one or more of water, alcohol, ketone, ester, ether, and hydrocarbon.Type: GrantFiled: March 12, 2021Date of Patent: April 1, 2025Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Kei Anai, Shinichi Yamauchi, Jung-Lae Jo
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Patent number: 12233463Abstract: A composition for pressure bonding contains a metal powder and a solid reducing agent and has a compressibility of 10% to 90%, the compressibility being expressed by a relationship formula using the thickness A of a dried coating film formed by drying the composition in an air atmosphere at 110° C. under atmospheric pressure for 20 minutes and the thickness B of a sintered body formed by treating the dried coating film in a nitrogen atmosphere at 280° C. under a pressure of 6 MPa for 20 minutes. The solid reducing agent may be BIS-TRIS. Also provided is a bonded structure of conductors in which a bonding portion via which two conductors are bonded together is formed by treating, under pressure, the two conductors and a coating film formed of the composition for pressure bonding provided therebetween.Type: GrantFiled: March 25, 2020Date of Patent: February 25, 2025Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Kei Anai, Shinichi Yamauchi, Jung-Lae Jo
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Patent number: 12070801Abstract: A bonding material includes: a copper foil; and a sinterable bonding film formed on one surface of the copper foil. The bonding film contains a copper powder and a solid reducing agent. The bonding material is used for bonding to a bonding target having, on its surface, at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum. The bonding material is also used as a material for wire bonding. A bonded structure is also provided in which a bonding target having a metal layer formed on its surface and a copper foil are electrically connected to each other via a bonding layer formed of a sintered structure of a copper powder, wherein the metal layer contains at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum.Type: GrantFiled: March 2, 2020Date of Patent: August 27, 2024Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Kei Anai, Jung-Lae Jo
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Patent number: 12046572Abstract: A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.Type: GrantFiled: March 12, 2021Date of Patent: July 23, 2024Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Kei Anai, Jung-Lae Jo
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Patent number: 12030125Abstract: A bonded body is provided including: a bonding layer containing Cu; and a semiconductor element bonded to the bonding layer. The bonding layer includes an extending portion laterally extending from a peripheral edge of the semiconductor element. In a cross-sectional view in a thickness direction, the extending portion rises from a peripheral edge of a bottom of the semiconductor element or from the vicinity of the peripheral edge of the bottom of the semiconductor element, and includes a side wall substantially spaced apart from a side of the semiconductor element. Preferably, the extending portion does not include any portion where the side wall and the side of the semiconductor element are in contact with each other. A method for manufacturing a bonded body is also provided.Type: GrantFiled: March 2, 2020Date of Patent: July 9, 2024Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Kei Anai, Shinichi Yamauchi, Jung-Lae Jo, Takahiko Sakaue
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Patent number: 12012523Abstract: A composition for forming a conductive film contains flat metal particles and a resin. The flat metal particles each have a metal oxide layer in the surface portion thereof. The flat metal particles have a ratio of the thickness of the metal oxide layer to the thickness of the flat metal particle of from 0.010 to 0.300. The thickness of the metal oxide layer is from 0.010 ?m to 2.000 ?m. In the method for manufacturing a conductive film, a composition for forming a conductive film is used, the composition containing flat metal particles and a resin. The composition for forming a conductive film is applied to a base material to form a coating film, and then the coating film is irradiated with light to sinter the coating film, thereby obtaining a conductive film. The flat metal particles each have a metal oxide layer in the surface portion thereof.Type: GrantFiled: March 26, 2019Date of Patent: June 18, 2024Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Kei Anai, Shun Fukuzato
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Publication number: 20240181528Abstract: A bonding composition contains copper powder, a liquid medium, and a reducing agent. The reducing agent contains at least one amino group and a plurality of hydroxyl groups. The reducing agent has a boiling point that is higher than the boiling point of the liquid medium. The reducing agent has a melting point that is equal to or below the sintering temperature of the copper powder. Preferably, the reducing agent is bis(2hydroxyethyl)iminotris(hydroxymethyl)methane. Preferably, the bonding composition has a viscosity of from 10 Pa·s to 200 Pa·s at a shear rate of 10 s-1 at 25° C. Preferably, the bonding composition contains from 0.1 parts to 10 parts by mass of the reducing agent and from 10 parts to 40 parts by mass of the liquid medium with respect to 100 parts by mass of the copper powder.Type: ApplicationFiled: February 12, 2024Publication date: June 6, 2024Inventors: Kei ANAI, Shinichi YAMAUCHI
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Publication number: 20240149340Abstract: A bonded structure is a structure in which two bonding target members and a bonding portion formed between and adjacent to the bonding target members are bonded together. The bonding portion is made of a material mainly containing copper. In a cross section of the bonded structure taken along a thickness direction, a ratio of a bonded rate between the bonding target members and the bonding portion in a peripheral region of the bonded structure to a bonded rate between the bonding target members and the bonding portion in a central region of the bonded structure is from 0.6 to 0.9. The bonded rate is 0.3 or more.Type: ApplicationFiled: March 28, 2022Publication date: May 9, 2024Inventors: Shinichi YAMAUCHI, Kei ANAI
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Publication number: 20240116104Abstract: A conductive composition for bonding includes a mix of copper powder carboxylic acid. The carboxylic acid has a branched carbon chain. The copper powder comprises first and second copper particles. The first copper particles have a volume-based cumulative particle size D50 of 0.11 ?m or more and less than 1 ?m at a cumulative volume of 50 vol % in a region of particle sizes of less than 1 ?m in a particle size distribution of the copper powder. The second copper particles have a volume-based cumulative particle size D50 of 1 ?m or more and 10 ?m or less at a cumulative volume of 50 vol % in a region of particle sizes of 1 ?m or more in the particle size distribution of the copper powder. The carboxylic acid is contained in an amount of 6 parts or more and 24 parts or less per 100 parts by mass.Type: ApplicationFiled: September 6, 2021Publication date: April 11, 2024Inventors: Satoshi KONNO, Shinichi YAMAUCHI, Kei ANAI
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Patent number: 11945974Abstract: A temporary fixing composition is provided that is used to temporarily fix a first bonding target material and a second bonding target material to each other before the two bonding target materials are bonded to each other. The temporary fixing composition contains a first organic component having a viscosity of less than 70 mPa·s at 25° C. and a boiling point of 200° C. or lower and a second organic component having a viscosity of 70 mPa·s or greater at 25° C. and a boiling point of 210° C. or higher. It is preferable that, when thermogravimetry-differential thermal analysis is performed under the conditions at a temperature increase rate of 10° C./min in a nitrogen atmosphere with a sample mass of 30 mg, the 95% mass reduction temperature is lower than 300° C.Type: GrantFiled: March 12, 2021Date of Patent: April 2, 2024Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Kei Anai, Jung-Lae Jo, Kengo Tashiro
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Patent number: 11931808Abstract: A bonding composition contains copper powder, a liquid medium, and a reducing agent. The reducing agent contains at least one amino group and a plurality of hydroxyl groups. The reducing agent has a boiling point that is higher than the boiling point of the liquid medium. The reducing agent has a melting point that is equal to or below the sintering temperature of the copper powder. Preferably, the reducing agent is bis(2hydroxyethyl)iminotris(hydroxymethyl)methane. Preferably, the bonding composition has a viscosity of from 10 Pa·s to 200 Pa·s at a shear rate of 10 s?1 at 25° C. Preferably, the bonding composition contains from 0.1 parts to 10 parts by mass of the reducing agent and from 10 parts to 40 parts by mass of the liquid medium with respect to 100 parts by mass of the copper powder.Type: GrantFiled: August 8, 2019Date of Patent: March 19, 2024Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Kei Anai, Shinichi Yamauchi
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Publication number: 20230137716Abstract: A method is provided for producing a bonding composition containing copper particles and a second liquid medium. In this production method, the copper particles are produced in a first liquid medium using a wet reduction method, and thus a dispersion of the copper particles is prepared. Subsequently, the first liquid medium in the dispersion is ultimately, finally or eventually replaced with the second liquid medium while the dispersion is kept wet. It is also preferable that the first liquid medium is replaced with another liquid medium one or more times, and the second liquid medium is used in the final replacement. The liquid media are preferably replaced at a temperature of lower than 100° C. The second liquid medium preferably includes one or more of water, alcohol, ketone, ester, ether, and hydrocarbon.Type: ApplicationFiled: March 12, 2021Publication date: May 4, 2023Inventors: Kei ANAI, Shinichi YAMAUCHI, Jung-Lae JO
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Publication number: 20230005871Abstract: A bonding sheet includes a copper foil and sinterable bonding films formed on both faces of the copper foil. The bonding films each contain copper particles and a solid reducing agent. The bonding sheet is used to bond to a target object to be bonded having at least one metal selected from gold, silver, copper, and nickel on a surface thereof. A bonded structure includes: a bonded object having at least one metal selected from gold, silver, copper, and nickel on a surface thereof; a copper foil; and a bonding layer including a sintered structure of copper particles; and the bonded object and the copper foil are electrically connected to each other via the bonding layer.Type: ApplicationFiled: March 12, 2021Publication date: January 5, 2023Inventors: Kei ANAI, Jung-Lae JO
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Publication number: 20220380639Abstract: A temporary fixing composition is provided that is used to temporarily fix a first bonding target material and a second bonding target material to each other before the two bonding target materials are bonded to each other. The temporary fixing composition contains a first organic component having a viscosity of less than 70 mPa·s at 25° C. and a boiling point of 200° C. or lower and a second organic component having a viscosity of 70 mPa·s or greater at 25° C. and a boiling point of 210° C. or higher. It is preferable that, when thermogravimetry-differential thermal analysis is performed under the conditions at a temperature increase rate of 10° C./min in a nitrogen atmosphere with a sample mass of 30 mg, the 95% mass reduction temperature is lower than 300° C.Type: ApplicationFiled: March 12, 2021Publication date: December 1, 2022Inventors: Kei ANAI, Jung-Lae JO, Kengo TASHIRO
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Publication number: 20220157765Abstract: A bonding material includes: a copper foil; and a sinterable bonding film formed on one surface of the copper foil. The bonding film contains a copper powder and a solid reducing agent. The bonding material is used for bonding to a bonding target having, on its surface, at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum. The bonding material is also used as a material for wire bonding. A bonded structure is also provided in which a bonding target having a metal layer formed on its surface and a copper foil are electrically connected to each other via a bonding layer formed of a sintered structure of a copper powder, wherein the metal layer contains at least one metal selected from the group consisting of gold, silver, copper, nickel, and aluminum.Type: ApplicationFiled: March 2, 2020Publication date: May 19, 2022Inventors: Kei ANAI, Jung-Lae JO
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Publication number: 20220139865Abstract: A bonded body is provided including: a bonding layer containing Cu; and a semiconductor element bonded to the bonding layer. The bonding layer includes an extending portion laterally extending from a peripheral edge of the semiconductor element. In a cross-sectional view in a thickness direction, the extending portion rises from a peripheral edge of a bottom of the semiconductor element or from the vicinity of the peripheral edge of the bottom of the semiconductor element, and includes a side wall substantially spaced apart from a side of the semiconductor element. Preferably, the extending portion does not include any portion where the side wall and the side of the semiconductor element are in contact with each other. A method for manufacturing a bonded body is also provided.Type: ApplicationFiled: March 2, 2020Publication date: May 5, 2022Applicants: Mitsui Mining & Smelting Co., Ltd., Mitsui Mining & Smelting Co., Ltd.Inventors: Kei ANAI, Shinichi YAMAUCHI, Jung-Lae JO, Takahiko SAKAUE
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Publication number: 20220118546Abstract: A composition for pressure bonding contains a metal powder and a solid reducing agent and has a compressibility of 10% to 90%, the compressibility being expressed by a relationship formula using the thickness A of a dried coating film formed by drying the composition in an air atmosphere at 110° C. under atmospheric pressure for 20 minutes and the thickness B of a sintered body formed by treating the dried coating film in a nitrogen atmosphere at 280° C. under a pressure of 6 MPa for 20 minutes. The solid reducing agent may be BIS-TRIS. Also provided is a bonded structure of conductors in which a bonding portion via which two conductors are bonded together is formed by treating, under pressure, the two conductors and a coating film formed of the composition for pressure bonding provided therebetween.Type: ApplicationFiled: March 25, 2020Publication date: April 21, 2022Inventors: Kei ANAI, Shinichi YAMAUCHI, Jung-Lae JO
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Patent number: 11195635Abstract: Provided is a method for manufacturing a conductive film, including forming a coating of a composition that contains conductivity-imparting particles and photo-sintering the coating, wherein, prior to the photo-sintering of the coating, the coating is compressed in the thickness direction thereof. It is preferable that the coating be compressed at a temperature at which a binding agent contained in the composition shows a storage modulus of 100 MPa or less. It is also preferable that the coating be compressed so that the compression rate in the thickness direction is from 25% to 80%. It is preferable that, in the photo-sintering step, the light irradiation be performed through irradiation with pulsed light.Type: GrantFiled: December 19, 2018Date of Patent: December 7, 2021Assignee: MITSUI MINING & SMELTING CO., LTD.Inventors: Kei Anai, Shun Fukuzato
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Publication number: 20210138541Abstract: A bonding composition contains copper powder, a liquid medium, and a reducing agent. The reducing agent contains at least one amino group and a plurality of hydroxyl groups. The reducing agent has a boiling point that is higher than the boiling point of the liquid medium. The reducing agent has a melting point that is equal to or below the sintering temperature of the copper powder. Preferably, the reducing agent is bis(2hydroxyethyl)iminotris(hydroxymethyl)methane. Preferably, the bonding composition has a viscosity of from 10 Pa·s to 200 Pa·s at a shear rate of 10 s?1 at 25° C. Preferably, the bonding composition contains from 0.1 parts to 10 parts by mass of the reducing agent and from 10 parts to 40 parts by mass of the liquid medium with respect to 100 parts by mass of the copper powder.Type: ApplicationFiled: August 8, 2019Publication date: May 13, 2021Inventors: Kei ANAI, Shinichi YAMAUCHI