Abstract: Provided is an imaging apparatus capable of enhancing heat resistance of a color filter and a manufacturing method of the imaging apparatus. An imaging apparatus includes a semiconductor substrate, a color filter provided on one surface side of the semiconductor substrate, and a first sealing material provided on the one surface side, the first sealing material that covers the color filter. The first sealing material includes a material capable of transmitting light of a wavelength band set in advance and having a thermal conductivity of 0.5 W/m·K or less.

Abstract: A power supply apparatus (100) according to the present disclosure converts an input voltage supplied from a power source to a predetermined direct current voltage. The power supply apparatus (100) includes an inrush current prevention circuit (120) based on a buck converter system and configured to suppress a flow of inrush current from the power source to the power supply apparatus (100) and a boost converter circuit (130) configured to output the predetermined direct current voltage. A choke coil (104) included in the inrush current prevention circuit (120) and a choke coil (104) included in the boost converter circuit (130) are a common choke coil. A smoothing capacitor (107) included in the inrush current prevention circuit (120) and a smoothing capacitor (107) included in the boost converter circuit (130) are a common smoothing capacitor.

Abstract: A power supply system includes at least two power supply devices that supply a current to a load. Each of the at least two power supply devices includes a converter configured to generate a current that is to be supplied to the load, an FET that is connected in series between the converter and the load, a gate voltage monitoring circuit configured to monitor whether a gate voltage of the FET has fallen below a predetermined first reference voltage, and an alarm generation circuit configured to generate an alarm according to a result of monitoring by the gate voltage monitoring circuit.

Abstract: Provided are a photosensitive resin composition in which warping of a cured film after curing is decreased and lithographic properties in a case of forming a pattern are excellent, a cured film, a laminate, a method for producing a cured film, and a semiconductor device. The photosensitive resin composition includes a polyimide precursor including a repeating unit including a biphenyl structure and a photopolymerization initiator having an oxime structure capable of generating an aryl radical by being irradiated with light.

Abstract: A power supply system includes at least two power supply devices that supply a current to a load. Each of the at least two power supply devices includes a converter configured to generate a current that is to be supplied to the load, an FET that is connected in series between the converter and the load, a gate voltage monitoring circuit configured to monitor whether a gate voltage of the FET has fallen below a predetermined first reference voltage, and an alarm generation circuit configured to generate an alarm according to a result of monitoring by the gate voltage monitoring circuit.

Abstract: A power supply system includes at least two power supply apparatuses that supply current to one load. Each power supply apparatus includes a converter that supplies current to the load, a FET connected in series between the converter and the load, a current detection unit that detects current flowing between the converter and the load, and a droop characteristic controller that causes output voltage of the converter to droop at a droop rate determined based on the magnitude of load current flowing from the converter towards the load. The droop rate is greater when the load current is included in a first current section than when the load current is included in each of a second current section and a third current section. The second current section includes smaller current than the first current section. The third current section includes larger current than the first current section.

Abstract: A power supply system includes at least two power supply apparatuses that supply current to one load. Each power supply apparatus includes a converter that supplies current to the load, a FET connected in series between the converter and the load, a current detection unit that detects current flowing between the converter and the load, and a droop characteristic controller that causes output voltage of the converter to droop at a droop rate determined based on the magnitude of load current flowing from the converter towards the load. The droop rate is greater when the load current is included in a first current section than when the load current is included in each of a second current section and a third current section. The second current section includes smaller current than the first current section. The third current section includes larger current than the first current section.

Abstract: Provided are a photosensitive resin composition in which warping of a cured film after curing is decreased and lithographic properties in a case of forming a pattern are excellent, a cured film, a laminate, a method for producing a cured film, and a semiconductor device. The photosensitive resin composition includes a polyimide precursor including a repeating unit including a biphenyl structure and a photopolymerization initiator having an oxime structure capable of generating an aryl radical by being irradiated with light.

Abstract: Provided are a temporary bonding material which is less likely to cause film unevenness and void formation while maintaining an adhesive force required for temporary bonding of a carrier substrate and a base material, and is easily peelable, a laminate, a method for manufacturing a laminate, a method for manufacturing a device substrate, and a method for manufacturing a semiconductor device. A temporary bonding material of the present invention includes a thermoplastic resin, a compound having a Si—O structure in an amount of 0.001% by mass or more and less than 8% by mass of the thermoplastic resin, and a solvent, in which an adhesive force of the temporary bonding material of an adhesive in which the solvent is removed from the temporary bonding material with respect to a silicon wafer is 1 to 15 N/m.

Abstract: Provided are a temporary bonding material which is less likely to cause film unevenness and void formation while maintaining an adhesive force required for temporary bonding of a carrier substrate and a base material, and is easily peelable, a laminate, a method for manufacturing a laminate, a method for manufacturing a device substrate, and a method for manufacturing a semiconductor device. A temporary bonding material of the present invention includes a thermoplastic resin, a compound having a Si—O structure in an amount of 0.001% by mass or more and less than 8% by mass of the thermoplastic resin, and a solvent, in which an adhesive force of the temporary bonding material of an adhesive in which the solvent is removed from the temporary bonding material with respect to a silicon wafer is 1 to 15 N/m.