Patents by Inventor Kei Hirai

Kei Hirai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250092495
    Abstract: A steel wire is composed of a steel containing not less than 1.0 mass % and not more than 1.1 mass % C, not less than 0.15 mass % and not more than 0.25 mass % Si, not less than 0.25 mass % and not more than 0.35 mass % Mn, and not less than 0.15 mass % and not more than 0.25 mass % Cr, with the balance being Fe and unavoidable impurities. The steel wire has a wire diameter of not less than 0.15 mm and not more than 0.42 mm. The steel has a pearlite structure. The steel has a dislocation density of not less than 2.4×1016 m?2 and not more than 5.0×1016 m?2. The steel has a full width at half maximum in a circumferential direction of not less than 42° at a peak of a maximum intensity of a Debye ring for Fe (211) plane.
    Type: Application
    Filed: February 2, 2023
    Publication date: March 20, 2025
    Applicant: Sumitomo Electric Industries, Ltd.
    Inventors: Kei HIRAI, Tetsuya NAKAJIMA, Akifumi MATSUOKA, Takumi AKADA
  • Publication number: 20250003034
    Abstract: A cubic boron nitride sintered material of the present disclosure includes 35 to 100 volume % of a cubic boron nitride grain and 0 to 65 volume % of a binder, wherein: a lattice constant of the cubic boron nitride grain is 3.6140 ? to ?3.6161 ?, a silicon content in the cubic boron nitride grain is 0.02 mass % or less, and the binder material includes at least one selected from a group consisting of a compound and a solid solution of the compound, the compound consisting of at least one element selected from a group consisting of a group 4 element, a group 5 element, a group 6 element in the periodic table, aluminum, silicon, iron, cobalt and nickel, and at least one element selected from a group consisting of carbon, nitrogen, boron and oxygen.
    Type: Application
    Filed: October 24, 2022
    Publication date: January 2, 2025
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Kenta SANO, Akito ISHII, Masato MICHIUCHI, Katsumi OKAMURA, Kei HIRAI
  • Publication number: 20240304514
    Abstract: A composite material has a plate shape and has a first surface and a second surface. The second surface is opposite to the first surface. The composite material includes a plurality of first layers and at least one second layer. The first layers and the second layer are alternately layered along a thickness direction of the composite material such that the first layers are located at the first surface and the second surface. Each of the first layers is a layer including copper. The second layer is a layer of a molybdenum powder compact impregnated with copper. A compressive residual stress of 50 MPa or less acts on each of the first layer located at the first surface and the first layer located at the second surface.
    Type: Application
    Filed: December 22, 2021
    Publication date: September 12, 2024
    Applicants: SUMITOMO ELECTRIC INDUSTRIES, LTD., A.L.M.T. Corp.
    Inventors: Toru MAEDA, Miki MIYANAGA, Daisuke KONDO, Kei HIRAI, Masayuki ITO, Shin-ichi YAMAGATA
  • Publication number: 20240196582
    Abstract: A differential signal transmission cable includes: an insulating layer that extends in a longitudinal direction of the differential signal transmission cable; a pair of signal lines that extend in the longitudinal direction and are embedded in the insulating layer; and a shield layer that covers an outer peripheral surface of the insulating layer. The shield layer includes an electroless plating layer containing copper and alloy elements. The types and contents of the alloy elements are selected such that a tensile stress acts on the shield layer.
    Type: Application
    Filed: July 1, 2021
    Publication date: June 13, 2024
    Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Kengo GOTO, Takayuki ONISHI, Koji KASUYA, Kei HIRAI, Takashi SEKIYA, Yuji OCHI, Yuto KOBAYASHI
  • Publication number: 20230383387
    Abstract: A diamond sintered material includes diamond grains, wherein a content ratio of the diamond grains is more than or equal to 80 volume % and less than or equal to 99 volume % with respect to the diamond sintered material, an average grain size of the diamond grains is more than or equal to 0.1 ?m and less than or equal to 50 ?m, and a dislocation density of the diamond grains is more than or equal to 8.1×1013 m?2 and less than 1.0×1016 m?2.
    Type: Application
    Filed: October 5, 2021
    Publication date: November 30, 2023
    Applicants: SUMITOMO ELECTRIC HARDMETAL CORP., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Hirotsugu IWASAKI, Akihiko UEDA, Michiko MATSUKAWA, Satoru KUKINO, Kei HIRAI
  • Publication number: 20220290021
    Abstract: A coated super-abrasive grain comprises: a body composed of cubic boron nitride; and a coating film coating at least a portion of a surface of the body, the body having a dislocation density of 9×1014/m2 or less, the coating film including one or more types of compounds composed of at least one type of element selected from the group consisting of a group 4 element, a group 5 element and a group 6 element of the periodic table, aluminum and silicon, and at least one type of element selected from the group consisting of oxygen, nitrogen, carbon, and boron.
    Type: Application
    Filed: August 4, 2020
    Publication date: September 15, 2022
    Inventors: Akito ISHII, Katsumi OKAMURA, Masahiro OHATA, Masato MICHIUCHI, Kei HIRAI, Nobuhide NAKAMURA, Kentaro CHIHARA
  • Publication number: 20220041446
    Abstract: There is provided a polycrystalline cubic boron nitride containing a cubic boron nitride at a content greater than or equal to 98.5% by volume, the polycrystalline cubic boron nitride having a dislocation density less than or equal to 8×1015/m2.
    Type: Application
    Filed: September 4, 2019
    Publication date: February 10, 2022
    Applicants: SUMITOMO ELECTRIC HARDMETAL CORP., Sumitomo Electric Industries, Ltd.
    Inventors: Tsutomu HIRANO, Satoru KUKINO, Kei HIRAI
  • Patent number: 8882944
    Abstract: In a method for forming a rustproof film on a PC strand, the thickness of the resin film is set to 200±80 ?m, the pre-heating is performed within a temperature range from 60 to 150° C. to prevent an occurrence of a cob-webbing phenomenon as a result of melting of the synthetic resin powder coating material and the post-heating is performed within a range from 150 to 250° C. in order to uniformize the thickness of the coats adhered to the outer peripheral surfaces of the core wire and the surrounding wires, and the temperature of the pre-heating is set to be lower than the temperature of the post-heating, and the synthetic resin powder coating material including particles having diameters in a range from 0.1 to 250 ?m is used, and the line speed in the series of steps is set to 5 to 10 m/min.
    Type: Grant
    Filed: June 10, 2013
    Date of Patent: November 11, 2014
    Assignee: Kurosawa Construction Co., Ltd.
    Inventors: Ryohei Kurosawa, Kei Hirai, Naoki Matsubara
  • Patent number: 8833050
    Abstract: A double rustproof PC strand has superior durability and semi-permanent rustproof performance. A core wire and surrounding wires are formed of wires subjected to a wire drawing treatment and a plating treatment to be formed with a plated layer. A rustproof treatment is applied by forming a synthetic resin coat on an outer peripheral surface thereof. In order to uniformize and regulate the twisting pitch, the core wire and the surrounding wires are adjusted under the conditions of: (A) Diameter of CORE: 4.42±0.05 mm, Diameter of Surrounding wire: 4.25±0.05 mm, (B) Diameter of CORE: 5.22±0.05 mm, Diameter of Surrounding wire: 5.06±0.05 mm, or (C) Diameter of CORE: 5.40±0.05 mm, Diameter of Surrounding wire: 5.25±0.05 mm, and then twisted, and the tensile strength is 1850 N/mm2 or higher.
    Type: Grant
    Filed: January 14, 2013
    Date of Patent: September 16, 2014
    Assignee: Kurosawa Construction Co., Ltd.
    Inventors: Ryohei Kurosawa, Kei Hirai
  • Publication number: 20140034208
    Abstract: In a method for forming a rustproof film on a PC strand, the thickness of the resin film is set to 200±80 ?m, the pre-heating is performed within a temperature range from 60 to 150° C. to prevent an occurrence of a cob-webbing phenomenon as a result of melting of the synthetic resin powder coating material and the post-heating is performed within a range from 150 to 250° C. in order to uniformize the thickness of the coats adhered to the outer peripheral surfaces of the core wire and the surrounding wires, and the temperature of the pre-heating is set to be lower than the temperature of the post-heating, and the synthetic resin powder coating material including particles having diameters in a range from 0.1 to 250 ?m is used, and the line speed in the series of steps is set to 5 to 10 m/min.
    Type: Application
    Filed: June 10, 2013
    Publication date: February 6, 2014
    Inventors: Ryohei KUROSAWA, Kei HIRAI, Naoki MATSUBARA
  • Publication number: 20130269308
    Abstract: In order to provide a double rustproof PC strand with superior durability and semi-permanent rustproof performance, a core wire and surrounding wires are formed of wires subjected to a wire drawing treatment and a plating treatment and formed with a plated layer, and a rustproof treatment is applied by forming a synthetic resin coat on an outer peripheral surface thereof. In order to uniformize and regulate the twisting pitch, the core wire and the surrounding wires are adjusted under the conditions of (A) Diameter of CORE: 4.42±0.05 mm, Diameter of Surrounding wire: 4.25±0.05 mm, (B) Diameter of CORE: 5.22±0.05 mm, Diameter of Surrounding wire: 5.06±0.05 mm, or (C) Diameter of CORE: 5.40±0.05 mm, Diameter of Surrounding wire: 5.25±0.05 mm, and then twisted, and the tensile strength is 1850 N/mm2 or higher.
    Type: Application
    Filed: January 14, 2013
    Publication date: October 17, 2013
    Applicant: KUROSAWA CONSTRUCTION CO., LTD.
    Inventors: Ryohei KUROSAWA, Kei HIRAI
  • Patent number: 8191251
    Abstract: A PC strand is untwisted to separate surrounding wires from a core wire, a synthetic resin powdered coating material is uniformly adhered by being applied and heated over the outer periphery of the core wire and surrounding wires in this untwisted state, the product is cooled to form a resin film, and then the surrounding wires are twisted back to the original state with respect to the core wire. Pre-heating is performed before the coating step and post-heating is performed after the coating step, the pre-heating temperature is set 30 to 130° C. higher than the post-heating temperature, a synthetic resin powdered coating material having an average grain size of 40 to 50 ?m is used, and the process line speed is 5 to 10 m/min.
    Type: Grant
    Filed: April 14, 2010
    Date of Patent: June 5, 2012
    Assignee: Kurosawa Construction Co., Ltd.
    Inventors: Ryohei Kurosawa, Kei Hirai
  • Publication number: 20110209345
    Abstract: Provided is a method for the highly efficient formation of a uniform, high-quality film with which increased line speed, improved productivity, and cost reduction can be envisaged. A method for forming a rustproof film on a PC strand, wherein a PC stranded (1) is untwisted to separate surrounding wires (1b) from a core wire (1a), a synthetic resin powdered coating material is uniformly adhered by being applied and heated over the outer periphery of the core wire and surrounding wires in this untwisted state, the product is cooled to form a resin film (26), and then the surrounding wires are twisted back to the original state with respect to the core wire. Pre-heating is performed before the coating step and post-heating is performed after the coating step, the pre-heating temperature is set 30 to 130° C. higher than the post-heating temperature, a synthetic resin powdered coating material having an average grain size of 40 to 50 ?m is used, and the process line speed is 5 to 10 m/min.
    Type: Application
    Filed: April 14, 2010
    Publication date: September 1, 2011
    Inventors: Ryohei Kurosawa, Kei Hirai