Patents by Inventor Kei Kikuchi

Kei Kikuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for depositing oxide film on metallic substrate by heat plasma flash evaporation method
    Patent number: 5453306
    Abstract: The generation of a reaction product is suppressed between a metallic substrate and plasma in depositing a ceramic intermediate layer on the metallic substrate in a process for depositing an oxide film on the metallic substrate by thermal plasma flash evaporation method. Thus, there is no reaction phase in the ceramic intermediate layer and the metallic substrate, and an intermediated buffer layer of only oxide ceramic is deposited on a flat surface of the metallic substrate. The intermediate ceramic layer is deposited in inert atmosphere of a low oxygen concentration at a temperature of less than 600.degree. C. for the metallic substrate. Then, a superconducting thin film is deposited on the ceramic intermediate layer.
    Type: Grant
    Filed: June 30, 1994
    Date of Patent: September 26, 1995
    Assignees: International Superconductivity Technology Center, Hokkaido Electric Power Co., Inc., Fujikura Ltd., Tokyo Gas Co., Ltd., Hitachi Cable, Ltd.
    Inventors: Noriyuki Tatsumi, Jiro Tsujino, Atsushi Kume, Yuh Shiohara, Shoji Tanaka, Shigenori Yuhya, Kei Kikuchi