Patents by Inventor Kei Ming Yip

Kei Ming Yip has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12207417
    Abstract: The present invention discloses a three-dimensional circuit board processing apparatus, including an input module, a vertical processing module, and an output module, which are arranged in sequence. The vertical processing module includes a conveying unit and a processing assembly. A vertical conveying port is arranged on each of two sides of the vertical processing module. The input module is connected to one end of the conveying unit, and the output module is connected to another end of the conveying unit. The input module and/or the output module are/is a flippable module. According to embodiments of the present invention, by arranging the flippable input module and/or output module, the circuit board may enter and exit the vertical processing module vertically, and may be uniformly processed through the vertical processing module, thereby enhancing the processing quality of the circuit board and improving the automation performance of three-dimensional processing.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: January 21, 2025
    Assignee: Simetric Semiconductor Solutions Co., Ltd.
    Inventors: Marcus Elmar Lang, Kei Ming Yip
  • Publication number: 20240224428
    Abstract: The present invention discloses a three-dimensional circuit board processing apparatus, including an input module, a vertical processing module, and an output module, which are arranged in sequence. The vertical processing module includes a conveying unit and a processing assembly. A vertical conveying port is arranged on each of two sides of the vertical processing module. The input module is connected to one end of the conveying unit, and the output module is connected to another end of the conveying unit. The input module and/or the output module are/is a flippable module. According to embodiments of the present invention, by arranging the flippable input module and/or output module, the circuit board may enter and exit the vertical processing module vertically, and may be uniformly processed through the vertical processing module, thereby enhancing the processing quality of the circuit board and improving the automation performance of three-dimensional processing.
    Type: Application
    Filed: January 3, 2023
    Publication date: July 4, 2024
    Inventors: Marcus Elmar Lang, Kei Ming Yip