Patents by Inventor Kei Miyazaki

Kei Miyazaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240085181
    Abstract: According to one embodiment, a sensor includes a base, a first support portion fixed to the substrate, and a first member supported by the first support portion. A gap is provided between the base and the first member. The first beam electrode and the second beam electrode satisfy at least one of a first condition, a second condition, a third condition, a fourth condition, a fifth condition, a sixth condition, a seventh condition, or an eighth condition.
    Type: Application
    Filed: February 24, 2023
    Publication date: March 14, 2024
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kei MASUNISHI, Etsuji OGAWA, Yasushi TOMIZAWA, Fumito MIYAZAKI, Daki ONO, Kengo UCHIDA, Hiroki HIRAGA, Shiori KAJI, Hideaki MURASE
  • Publication number: 20240085451
    Abstract: According to one embodiment, a sensor includes a base body, a support portion fixed to the base body, and a first member supported by the support portion. A gap is provided between the base body and a part of the first member. The first member includes a supported region, a first movable region, a first structure, a first support structure, a first connection structure, a first connect portion, and a first beam. The support portion is located between the base body and the supported region in a first direction from the base body to the support portion. The first beam extends along a second direction crossing the first direction. A first beam position of the first beam is located between a first movable region position of the first movable region and a support portion position of the support portion in the second direction.
    Type: Application
    Filed: February 27, 2023
    Publication date: March 14, 2024
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Kei MASUNISHI, Etsuji OGAWA, Yasushi TOMIZAWA, Fumito MIYAZAKI, Daki ONO, Kengo UCHIDA, Hiroki HIRAGA, Shiori KAJI, Hideaki MURASE
  • Patent number: 11627293
    Abstract: A method of controlling a projector includes detecting whether a human is present or absent between a projection surface and the projector, emitting a first sound when it is detected that the human is present, determining whether or not detecting that the human is present continues during a first period having a first time length, projecting, by the projector, a first projection image including a first image on the projection surface when it is determined that the detecting that the human is present continues, and projecting, by the projector, a second projection image not including the first image on the projection surface when it is determined that the detecting that the human is present does not continue.
    Type: Grant
    Filed: May 26, 2021
    Date of Patent: April 11, 2023
    Assignee: SEIKO EPSON CORPORATION
    Inventors: Kei Miyazaki, Takao Hirakura, Takeshi Furihata
  • Publication number: 20210377499
    Abstract: A method of controlling a projector includes detecting whether a human is present or absent between a projection surface and. the projector, emitting a first sound. when it is detected that the human is present, determining whether or not detecting that the human is present continues during a first period having a first time length, projecting, by the projector, a first projection image including a first image on the projection surface when it is determined that the detecting that the human is present continues, and projecting, by the projector, a. second projection image not including the first image on the projection surface when it is determined that the detecting that the human is present does not continue.
    Type: Application
    Filed: May 26, 2021
    Publication date: December 2, 2021
    Inventors: Kei MIYAZAKI, Takao HIRAKURA, Takeshi FURIHATA
  • Patent number: 6730620
    Abstract: Processing of applying ultraviolet rays to a front face of an insulating film material formed on a wafer W is performed, whereby a contact angle of the front face thereof becomes smaller. Accordingly, when an insulating film material is applied on the aforesaid front face, the material smoothly spreads, and projections and depressions never occur on a front face of an upper layer insulating film material. Thereby, it is possible to form the insulating film thick and flatter on a substrate.
    Type: Grant
    Filed: April 30, 2002
    Date of Patent: May 4, 2004
    Assignee: Tokyo Electron Limited
    Inventors: Kei Miyazaki, Yuichiro Uchihama, Kenji Yasuda, Kiminari Sakaguchi, Shinji Nagashima
  • Publication number: 20020119678
    Abstract: Processing of applying ultraviolet rays to a front face of an insulating film material formed on a wafer W is performed, whereby a contact angle of the front face thereof becomes smaller. Accordingly, when an insulating film material is applied on the aforesaid front face, the material smoothly spreads, and projections and depressions never occur on a front face of an upper layer insulating film material. Thereby, it is possible to form the insulating film thick and flatter on a substrate.
    Type: Application
    Filed: April 30, 2002
    Publication date: August 29, 2002
    Inventors: Kei Miyazaki, Yuichiro Uchihama, Kenji Yasuda, Kiminari Sakaguchi, Shinji Nagashima
  • Patent number: 6413317
    Abstract: Processing of applying ultraviolet rays to a front face of an insulating film material formed on a wafer W is performed, whereby a contact angle of the front face thereof becomes smaller. Accordingly, when an insulating film material is applied on the aforesaid front face, the material smoothly spreads, and projections and depressions never occur on a front face of an upper layer insulating film material. Thereby, it is possible to form the insulating film thick and flatter on a substrate.
    Type: Grant
    Filed: September 13, 2000
    Date of Patent: July 2, 2002
    Assignee: Tokyo Electron Limited
    Inventors: Kei Miyazaki, Yuichiro Uchihama, Kenji Yasuda, Kiminari Sakaguchi, Shinji Nagashima
  • Patent number: 6354832
    Abstract: In a heat processing apparatus of a low-oxygen curing and cooling processing station, a plurality of blast ports are provided in a ring shutter along a thickness direction of a wafer and a heated inert gas is supplied into a heat processing chamber via the blast ports, so that both faces of the wafer can be heated while the inside of the heat processing chamber is exchanged for the inert gas. Accordingly, heat processing for the substrate can be efficiently performed in a short period of time.
    Type: Grant
    Filed: July 27, 2000
    Date of Patent: March 12, 2002
    Assignee: Tokyo Electron Limited
    Inventors: Yuta Yoshimura, Kei Miyazaki, Kyoshige Katayama, Takeshi Tamura