Abstract: The present inventors have studied and found that the substituted quinoline derivatives have acetylcholine receptor clustering-inducing action and can be useful as an active ingredient in the pharmaceutical compositions for preventing and/or treating neuromuscular diseases. The substituted quinoline derivative of the present invention may be used as an agent for preventing and/or treating neuromuscular diseases.

Abstract: An industrially advantageous method for producing a high purity terminal olefin is disclosed, comprising the steps of (a) contacting a mixture comprising a terminal olefin represented by formula (1): and one or more corresponding internal olefins as impurities, with a brominating agent in the presence of water or an alcohol, to convert the internal olefin(s) to compound(s) having a higher boiling point than the terminal olefin; and (b) purifying the terminal olefin by distillation from the reaction mixture.

Abstract: A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 ?m, and (c) a white or colorless and transparent powder having an average particle size of at least 1 ?m but less than 10 ?m. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability.

Abstract: Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler.

Abstract: An industrially advantageous method for producing a high purity terminal olefin is disclosed, comprising the steps of (a) contacting a mixture comprising a terminal olefin represented by formula (1): and one or more corresponding internal olefins as impurities, with a brominating agent in the presence of water or an alcohol, to convert the internal olefin(s) to compound(s) having a higher boiling point than the terminal olefin; and (b) purifying the terminal olefin by distillation from the reaction mixture.

Abstract: Provided is a heat conductive silicone grease composition, including: (A) 100 parts by volume of an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, (B) 0.1 to 50 parts by volume of an alkoxysilane with a specific structure, and (C) 100 to 2,500 parts by volume of a heat conductive filler. The composition exhibits high thermal conductivity, retains excellent fluidity meaning the composition exhibits favorable workability, and is capable of filling fine indentations, thereby reducing contact resistance and providing excellent heat radiation performance. Also, the durability, under conditions of high temperature and high humidity, of the composition is improved, thereby improving the reliability of the composition during actual use. Heat generated by a heat-generating body can be dissipated into a heat-radiating body by sandwiching the composition between the heat-generating body and the heat-radiating body.

Abstract: A silicone resin composition for die bonding is provided. The composition includes (A) a straight-chain organopolysiloxane having silicon-bonded alkenyl groups, and with a viscosity of no more than 1,000 mPa·s, (B) a three dimensional network-type organopolysiloxane resin that is either wax-like or solid at 23° C., (C) an organohydrogenpolysiloxane having SiH groups, and (D) a platinum-group metal-based catalyst. The composition produces a cured product with a high hardness, and good heat resistance, transparency, and light transmittance in the low wavelength region.

Abstract: Provided is a silicone-sealed LED including: a LED chip, a cured silicone rubber layer which coats the LED chip, and a cured silicone resin layer which coats and seals the periphery of the cured silicone rubber layer. Also provided are a process for producing the silicone-sealed LED and a process for sealing a LED. In the silicone-sealed LED, a silicone rubber layer disposed between a silicone resin layer that represents the sealing body and a LED chip functions as a buffer layer, meaning cracks are not easily generated in the silicone resin layer that represents the sealing body, while full use is made of the excellent heat resistance, weather resistance, and color fastness of the silicone rubber and the silicone resin.

Abstract: A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.

Abstract: An addition curable silicone resin composition for a light emitting diode is provided The composition includes an organopolysiloxane that includes a straight-chain segment represented by a formula: —(R12SiO)n— wherein, R1 is an unsaturated aliphatic bonding-free monovalent hydrocarbon group, and n is an integer of 1 or greater, and a resin-like segment consisting of R23SiO1/2 units wherein, R2 is a monovalent hydrocarbon group, an alkoxy group, or a hydroxyl group, SiO2 units, and/or R2SiO3/2 units wherein, R2 is as defined above, in which at least two of all the R2 groups are alkenyl groups. The composition exhibits strong resistance to thermal shock, and is resistant to cracking even under severe temperature cycling.

Abstract: Provided is a silicone composition, including: (A) an organopolysiloxane represented by an average composition formula R1nSiZ[(4?n)/2] (in which, R1 represents a monovalent hydrocarbon group, an alkoxy group or a hydroxyl group, provided that from 5 to 50 mol % of all R1 groups are alkenyl groups, and from 10 to 80 mol % of all R1 groups are aryl groups, Z represents an oxygen atom or a bivalent hydrocarbon group, provided at least 80 mol % of all Z groups are oxygen atoms, and n is a number that satisfies 1=n<2), in which from 5 to 50 mol % of all silicon atoms exist within structures represented by an average formula: —SiR22—X—(SiR22O)1SiR22—X—SiR22O— (in which, R2 represents a monovalent hydrocarbon group, provided that from 10 to 80 mol % of all R2 groups are aryl groups, X represents an oxygen atom or a bivalent hydrocarbon group, and l represents an integer of 3 or greater), (B) an organohydrogenpolysiloxane having at least 2 SiH groups within each molecule, and (C) an addition reaction catalyst.

Abstract: A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 ?m, and (c) a white or colorless and transparent powder having an average particle size of at least 1 ?m but less than 10 ?m. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability.

Abstract: LED devices encapsulated with silicone resin compositions comprising (A) a silicone resin having at least two alkenyl groups bonded to silicon atoms in a molecule, (B) an organohydrogensilane and/or organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicon atoms in a molecule, and (C) an addition reaction catalyst which cure into transparent products having heat resistance and discoloration resistance.

Abstract: A heat conductive silicone rubber composition comprising (A) an organopolysiloxane containing, on the average, at least 0.1 silicon-bonded alkenyl radical and having a viscosity of 50-100,000 mPa·s at 25° C., (B) an organopolysiloxane containing, on the average, at least 2 SiH radicals and having a viscosity of 1-100,000 mPa·s at 25° C., (C) a heat conductive filler, (D) a platinum catalyst, and (E) a specific organopolysiloxane having a molecular weight of at least 10,000, is easy to handle and mold, and especially smooth in flow, even when heavily loaded with the filler.

Abstract: A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.

Abstract: A method for adhering a thermally-conductive silicone composition to a coated surface in which a primer containing a platinum type compound and a solvent but not containing an alkoxy silane is applied and dried on the surface of a metal or an alloy containing at least one metal selected from a group of gold, silver and platinum group, and the thermally-conductive silicone composition is subsequently adhered to the coated surface.

Abstract: Provided is a heat conductive silicone grease composition, including: an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, an alkoxysilane containing specific substituent groups, an organohydrogenpolysiloxane containing 2 or more SiH groups within each molecule, a heat conductive filler, a platinum-based catalyst, and an addition reaction retarder. The heat conductive silicone grease composition exhibits high thermal conductivity, has excellent fluidity prior to curing and therefore exhibits favorable workability, is capable of filling fine indentations and therefore reduces contact resistance, and is also able to prevent oil separation and bleeding of the heat conductive material following curing, meaning the composition exhibits excellent heat radiation performance and reliability.

Abstract: A microcomponent on a substrate is sealed with a liquid silicone composition in the cured state by forming a channel or recess in a substrate, placing a microcomponent at the center of the channel-delimited region or recess, applying a droplet of liquid silicone composition so that the droplet is delimited by the perimeter of the channel or recess and held in a convex shape by the surface tension of the liquid, and curing the liquid silicone composition.

Abstract: Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler.

Abstract: A new variety of Citrus ‘Mikanken16’ that has dark orange fruit color, no seeds, high juiciness, orange-like flavor, ease of peeling the fruit by hand, good appearance and good tasting qualities.