Patents by Inventor Kei Miyoshi
Kei Miyoshi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8609886Abstract: An industrially advantageous method for producing a high purity terminal olefin is disclosed, comprising the steps of (a) contacting a mixture comprising a terminal olefin represented by formula (1): and one or more corresponding internal olefins as impurities, with a brominating agent in the presence of water or an alcohol, to convert the internal olefin(s) to compound(s) having a higher boiling point than the terminal olefin; and (b) purifying the terminal olefin by distillation from the reaction mixture.Type: GrantFiled: January 8, 2010Date of Patent: December 17, 2013Assignee: Kuraray Co., Ltd.Inventors: Kei Miyoshi, Goro Asanuma
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Patent number: 8592030Abstract: A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 ?m, and (c) a white or colorless and transparent powder having an average particle size of at least 1 ?m but less than 10 ?m. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability.Type: GrantFiled: February 8, 2013Date of Patent: November 26, 2013Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Naoki Yamakawa, Kei Miyoshi, Toshiyuki Ozai, Yoshinori Ogawa
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Patent number: 8119758Abstract: Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler.Type: GrantFiled: August 29, 2007Date of Patent: February 21, 2012Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Ikuo Sakurai, Nobuaki Matsumoto, Kei Miyoshi, Kunihiro Yamada
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Publication number: 20120029229Abstract: An industrially advantageous method for producing a high purity terminal olefin is disclosed, comprising the steps of (a) contacting a mixture comprising a terminal olefin represented by formula (1): and one or more corresponding internal olefins as impurities, with a brominating agent in the presence of water or an alcohol, to convert the internal olefin(s) to compound(s) having a higher boiling point than the terminal olefin; and (b) purifying the terminal olefin by distillation from the reaction mixture.Type: ApplicationFiled: January 8, 2010Publication date: February 2, 2012Applicant: KURARAY CO., LTD.Inventors: Kei Miyoshi, Goro Asanuma
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Patent number: 8017684Abstract: Provided is a heat conductive silicone grease composition, including: (A) 100 parts by volume of an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, (B) 0.1 to 50 parts by volume of an alkoxysilane with a specific structure, and (C) 100 to 2,500 parts by volume of a heat conductive filler. The composition exhibits high thermal conductivity, retains excellent fluidity meaning the composition exhibits favorable workability, and is capable of filling fine indentations, thereby reducing contact resistance and providing excellent heat radiation performance. Also, the durability, under conditions of high temperature and high humidity, of the composition is improved, thereby improving the reliability of the composition during actual use. Heat generated by a heat-generating body can be dissipated into a heat-radiating body by sandwiching the composition between the heat-generating body and the heat-radiating body.Type: GrantFiled: December 26, 2006Date of Patent: September 13, 2011Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Akihiro Endo, Kei Miyoshi, Kunihiro Yamada, Hiroaki Kizaki
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Patent number: 7951891Abstract: A silicone resin composition for die bonding is provided. The composition includes (A) a straight-chain organopolysiloxane having silicon-bonded alkenyl groups, and with a viscosity of no more than 1,000 mPa·s, (B) a three dimensional network-type organopolysiloxane resin that is either wax-like or solid at 23° C., (C) an organohydrogenpolysiloxane having SiH groups, and (D) a platinum-group metal-based catalyst. The composition produces a cured product with a high hardness, and good heat resistance, transparency, and light transmittance in the low wavelength region.Type: GrantFiled: June 6, 2006Date of Patent: May 31, 2011Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kei Miyoshi, Tomoyuki Goto, Naoki Yamakawa
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Patent number: 7838117Abstract: Provided is a silicone-sealed LED including: a LED chip, a cured silicone rubber layer which coats the LED chip, and a cured silicone resin layer which coats and seals the periphery of the cured silicone rubber layer. Also provided are a process for producing the silicone-sealed LED and a process for sealing a LED. In the silicone-sealed LED, a silicone rubber layer disposed between a silicone resin layer that represents the sealing body and a LED chip functions as a buffer layer, meaning cracks are not easily generated in the silicone resin layer that represents the sealing body, while full use is made of the excellent heat resistance, weather resistance, and color fastness of the silicone rubber and the silicone resin.Type: GrantFiled: January 19, 2006Date of Patent: November 23, 2010Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Kei Miyoshi, Eiichi Tabei
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Patent number: 7786056Abstract: A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.Type: GrantFiled: March 31, 2008Date of Patent: August 31, 2010Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Nobuaki Matsumoto, Kunihiro Yamada, Kei Miyoshi, Ikuo Sakurai, Kenichi Isobe
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Patent number: 7705104Abstract: An addition curable silicone resin composition for a light emitting diode is provided The composition includes an organopolysiloxane that includes a straight-chain segment represented by a formula: —(R12SiO)n— wherein, R1 is an unsaturated aliphatic bonding-free monovalent hydrocarbon group, and n is an integer of 1 or greater, and a resin-like segment consisting of R23SiO1/2 units wherein, R2 is a monovalent hydrocarbon group, an alkoxy group, or a hydroxyl group, SiO2 units, and/or R2SiO3/2 units wherein, R2 is as defined above, in which at least two of all the R2 groups are alkenyl groups. The composition exhibits strong resistance to thermal shock, and is resistant to cracking even under severe temperature cycling.Type: GrantFiled: August 2, 2006Date of Patent: April 27, 2010Assignee: Shin Etsu Chemical Co., Ltd.Inventors: Naoki Yamakawa, Kei Miyoshi
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Patent number: 7615387Abstract: Provided is a silicone composition, including: (A) an organopolysiloxane represented by an average composition formula R1nSiZ[(4?n)/2] (in which, R1 represents a monovalent hydrocarbon group, an alkoxy group or a hydroxyl group, provided that from 5 to 50 mol % of all R1 groups are alkenyl groups, and from 10 to 80 mol % of all R1 groups are aryl groups, Z represents an oxygen atom or a bivalent hydrocarbon group, provided at least 80 mol % of all Z groups are oxygen atoms, and n is a number that satisfies 1=n<2), in which from 5 to 50 mol % of all silicon atoms exist within structures represented by an average formula: —SiR22—X—(SiR22O)1SiR22—X—SiR22O— (in which, R2 represents a monovalent hydrocarbon group, provided that from 10 to 80 mol % of all R2 groups are aryl groups, X represents an oxygen atom or a bivalent hydrocarbon group, and l represents an integer of 3 or greater), (B) an organohydrogenpolysiloxane having at least 2 SiH groups within each molecule, and (C) an addition reaction catalyst.Type: GrantFiled: September 25, 2006Date of Patent: November 10, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Kei Miyoshi
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Publication number: 20090258216Abstract: A silicone adhesive for a semiconductor element that is suitable as a die bonding material for fixing a light emitting diode chip to a substrate. The adhesive includes (a) an addition reaction-curable silicone resin composition having a viscosity at 25° C. of not more than 100 Pa·s, and yielding a cured product upon heating at 150° C. for 3 hours that has a type D hardness prescribed in JIS K6253 of at least 30, (b) a white pigment powder having an average particle size of less than 1 ?m, and (c) a white or colorless and transparent powder having an average particle size of at least 1 ?m but less than 10 ?m. The adhesive exhibits high levels of concealment, effectively reflects light emitted from the LED chip, and also exhibits favorable chip positioning properties, superior adhesive strength, and excellent durability.Type: ApplicationFiled: April 10, 2009Publication date: October 15, 2009Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Naoki YAMAKAWA, Kei Miyoshi, Toshiyuki Ozai, Yoshinori Ogawa
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Patent number: 7595113Abstract: LED devices encapsulated with silicone resin compositions comprising (A) a silicone resin having at least two alkenyl groups bonded to silicon atoms in a molecule, (B) an organohydrogensilane and/or organohydrogenpolysiloxane having at least two hydrogen atoms bonded to silicon atoms in a molecule, and (C) an addition reaction catalyst which cure into transparent products having heat resistance and discoloration resistance.Type: GrantFiled: May 26, 2005Date of Patent: September 29, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Kei Miyoshi
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Patent number: 7547743Abstract: A heat conductive silicone rubber composition comprising (A) an organopolysiloxane containing, on the average, at least 0.1 silicon-bonded alkenyl radical and having a viscosity of 50-100,000 mPa·s at 25° C., (B) an organopolysiloxane containing, on the average, at least 2 SiH radicals and having a viscosity of 1-100,000 mPa·s at 25° C., (C) a heat conductive filler, (D) a platinum catalyst, and (E) a specific organopolysiloxane having a molecular weight of at least 10,000, is easy to handle and mold, and especially smooth in flow, even when heavily loaded with the filler.Type: GrantFiled: May 12, 2005Date of Patent: June 16, 2009Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tomoyuki Goto, Kei Miyoshi
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Publication number: 20080269084Abstract: A silicone grease composition comprising 3-30 wt % of an organopolysiloxane and 60-96.9 wt % of a heat conductive filler is diluted with a least volatile isoparaffin having a boiling point of 260-360° C. Despite a heavy loading of heat conductive filler, the grease composition is easily applicable to heat sinks as a thin uniform coating. The composition is drastically increased in shelf stability at room temperature, easy to handle, and provides for good heat dissipation.Type: ApplicationFiled: March 31, 2008Publication date: October 30, 2008Applicant: Shin -Etsu Chemical Co., Ltd.Inventors: Nobuaki Matsumoto, Kunihiro Yamada, Kei Miyoshi, Ikuo Sakurai, Kenichi Isobe
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Publication number: 20080260957Abstract: A method for adhering a thermally-conductive silicone composition to a coated surface in which a primer containing a platinum type compound and a solvent but not containing an alkoxy silane is applied and dried on the surface of a metal or an alloy containing at least one metal selected from a group of gold, silver and platinum group, and the thermally-conductive silicone composition is subsequently adhered to the coated surface.Type: ApplicationFiled: October 25, 2007Publication date: October 23, 2008Inventors: Kunihiro Yamada, Akihiro Endo, Kei Miyoshi
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Publication number: 20080213578Abstract: Provided is a heat conductive silicone grease composition, including: an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, an organopolysiloxane with a specific structure and with a kinematic viscosity at 25° C. of 10 to 10,000 mm2/s, an alkoxysilane containing specific substituent groups, an organohydrogenpolysiloxane containing 2 or more SiH groups within each molecule, a heat conductive filler, a platinum-based catalyst, and an addition reaction retarder. The heat conductive silicone grease composition exhibits high thermal conductivity, has excellent fluidity prior to curing and therefore exhibits favorable workability, is capable of filling fine indentations and therefore reduces contact resistance, and is also able to prevent oil separation and bleeding of the heat conductive material following curing, meaning the composition exhibits excellent heat radiation performance and reliability.Type: ApplicationFiled: July 11, 2007Publication date: September 4, 2008Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Akihiro Endo, Kei Miyoshi, Kunihiro Yamada
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Publication number: 20080099139Abstract: A microcomponent on a substrate is sealed with a liquid silicone composition in the cured state by forming a channel or recess in a substrate, placing a microcomponent at the center of the channel-delimited region or recess, applying a droplet of liquid silicone composition so that the droplet is delimited by the perimeter of the channel or recess and held in a convex shape by the surface tension of the liquid, and curing the liquid silicone composition.Type: ApplicationFiled: September 12, 2007Publication date: May 1, 2008Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Kei Miyoshi, Naoki Yamahawa
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Publication number: 20080057325Abstract: Provided is a heat-conductive silicone composition, including: (A) 100 parts by volume of an organopolysiloxane having a specific structure, (B) 0.1 to 50 parts by volume of an organosilicon compound that functions as a wetter and contains a triorganooxysilyl group bonded to one terminal via an alkylene group that may be branched, (C) 100 to 2,500 parts by volume of a heat-conductive filler, and (D) an effective quantity of a curing agent. Also provided is a heat-conductive silicone cured product obtained by curing this composition. The heat-conductive silicone composition, even when filled with a large quantity of a heat-conductive filler in order to provide superior thermal conductivity, exhibits a minimal increase in viscosity or plasticity, and retains favorable handling properties and moldability. The heat-conductive silicone cured product exhibits excellent flexibility even when filled with a large quantity of a heat-conductive filler.Type: ApplicationFiled: August 29, 2007Publication date: March 6, 2008Applicant: Shin-Etsu Chemical Co., Ltd.Inventors: Ikuo Sakurai, Nobuaki Matsumoto, Kei Miyoshi, Kunihiro Yamada
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Patent number: 7323250Abstract: Provided is a curable silicone resin composition including (A) a siloxane-based compound containing at least 2 addition reactive carbon-carbon double bonds within each molecule, (B) a siloxane-based compound containing at least 2 hydrogen atoms bonded to silicon atoms within each molecule, (C) a hydrosilylation reaction catalyst, (D) a phenol-based antioxidant, and (E) a hindered amine compound. Also provided are an optical semiconductor sealing material including such a composition, and an optical semiconductor device that has been sealed with such a composition. The curable silicone composition generates a cured product with high hardness and strength, excellent transparency, and excellent light transmittance and photostability particularly in the short wavelength region.Type: GrantFiled: March 24, 2005Date of Patent: January 29, 2008Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Eiichi Tabei, Kei Miyoshi
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Patent number: PP36418Abstract: A new variety of Citrus ‘Mikanken16’ that has dark orange fruit color, no seeds, high juiciness, orange-like flavor, ease of peeling the fruit by hand, good appearance and good tasting qualities.Type: GrantFiled: May 8, 2024Date of Patent: February 4, 2025Assignee: EHIME PREFECTUREInventors: Haruhito Nakata, Yukinori Shigematsu, Yoji Hyodo, Hiroaki Mido, Takehiro Kikuchi, Yasuyuki Masamoto, Takae Sakimoto, Hiromichi Yakushiji, Takehiro Okusada, Taizo Ninomiya, Mitsutoshi Okamoto, Saki Yamamoto, Saki Miyoshi, Toya Hioki, Kei Kinoshita