Patents by Inventor Kei Mizuta
Kei Mizuta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20220347600Abstract: A coalescer is installable on a flow path for a target liquid to be treated containing oil droplets. The coalescer includes sheets of metal mesh with, for example, a plain weave, twill weave, or thick weave stacked on one another to form mesh layers and interlayer portions between the layers. The metal mesh has a surface extending along a flow of the target liquid. Oil droplets come into contact with either or both of warp wires and weft wires to form an oil film that moves downstream with the target liquid flow. The oil film grows into larger droplet particles at downstream ends of the mesh layers. The larger droplet particles leave the coalescer with the flow of the target liquid.Type: ApplicationFiled: May 20, 2020Publication date: November 3, 2022Inventors: Yoshifumi MIZUGUCHI, Shinichi SHIMOKOMAKI, Susumu NII, Kei MIZUTA
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Patent number: 8988882Abstract: A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.Type: GrantFiled: March 24, 2010Date of Patent: March 24, 2015Assignees: Molex Japan Co., Ltd., Kagoshima UniversityInventors: Kenji Ohsawa, Rinkou Fukunaga, Katsuya Tsuruta, Kei Mizuta, Masamichi Ishihara
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Patent number: 8982559Abstract: A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion.Type: GrantFiled: February 2, 2009Date of Patent: March 17, 2015Assignees: Fuchigami Micro Co., Ltd., Kagoshima UniversityInventors: Kenji Ohsawa, Katsuya Tsuruta, Toshiaki Kotani, Kei Mizuta
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Publication number: 20140184050Abstract: A lighting apparatus is provided with: a light-emitting unit, a heat spreader in heat-conductive contact with the light-emitting unit that diffuses the heat conducted from the light-emitting unit, heat pipes with one end in heat-conductive contact with the heat spreader that transport heat to their other end, and a lower row of cooling fins and upper row of cooling fins that are in heat-conductive contact with the other ends of the heat pipes, and that radiate the heat conducted from the heat pipes into the environment.Type: ApplicationFiled: December 28, 2012Publication date: July 3, 2014Applicants: KAGOSHIMA UNIVERSITY, MOLEX JAPAN CO., LTD.Inventor: Kei MIZUTA
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Patent number: 8611089Abstract: A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.Type: GrantFiled: March 9, 2009Date of Patent: December 17, 2013Assignees: Fuchigami Micro Co., Ltd., Kagoshima UniversityInventors: Kei Mizuta, Katsuya Tsuruta, Toshiaki Kotani, Kenji Ohsawa
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Publication number: 20120127667Abstract: A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.Type: ApplicationFiled: March 24, 2010Publication date: May 24, 2012Applicants: KAGOSHIMA UNIVERSITY, MOLEX JAPAN CO., LTD.Inventors: Kenji Ohsawa, Rinkou Fukunaga, Katsuya Tsuruta, Kei Mizuta, Masamichi Ishihara
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Publication number: 20120106084Abstract: A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.Type: ApplicationFiled: March 9, 2009Publication date: May 3, 2012Applicants: Kagoshima University, Fuchigami Micro Co. LtdInventors: Kei Mizuta, Katsuya Tsuruta, Toshiaki Kotani, Kenji Ohsawa
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Publication number: 20110308772Abstract: The Present Invention provides a heat pipe and an electronic device which can efficiently cool a light emitting element arranged in an end portion, so that it is possible to efficiently mount the heat pipe in a narrow space. The heat pipe is provided with an upper plate (3), a lower plate (4) opposing the upper plate (3), one intermediate plate or a plurality of intermediate plates (5) laminated between the upper plate (3) and the lower plate (4), a main body portion (2) formed by lamination of the upper plate (3), the lower plate (4) and the intermediate plate (5) and capable of sealing a cooling medium, a vapor diffusion path (6) capable of diffusing a vaporized cooling medium, and a capillary flow path (7) capable of reflowing a condensed cooling medium, and the vapor diffusion path (6) is formed from a first end portion (15) of the main body portion toward a second end portion (16) opposing the first end portion (15).Type: ApplicationFiled: September 8, 2009Publication date: December 22, 2011Applicants: Kagoshima University, Molex Kiire Co., Ltd.Inventors: Katsuya Tsuruta, Rinkou Fukunaga, Toshiaki Kotani, Kei Mizuta
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Publication number: 20110214904Abstract: A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion.Type: ApplicationFiled: February 2, 2009Publication date: September 8, 2011Applicant: Fuchigami Micro Co., LtdInventors: Kenji Ohsawa, Katsuya Tsuruta, Toshiaki Kotani, Kei Mizuta