Abstract: A compound of the following structure has excellent luminescence characteristics. One of X1 and X2 is N and the other is B, and R1 to R26, A1, and A2 are H or substituents.

Abstract: Provided is a process for manufacturing a resin molded article, processes for manufacturing resin molded articles having high mechanical strength and low shielding properties that may be directly plated on their surfaces, a resin molded article having a plated layer obtained by the process. The process for manufacturing a resin molded article contains thermally molding a sheet containing a thermoplastic resin and a fiber together with a composition containing a thermoplastic resin belonging to a similar type to that of the thermoplastic resin of the sheet and a laser direct structuring additive.

Abstract: Provided is a polyamide resin composition having particularly excellent strength and low warpage by virtue of being compounded with a glass fiber and suited as a material for portable electronic devices that are becoming thinner and lighter in weight in recent years. A polyamide resin composition for a portable electronic device, including (A) a polyamide resin, (B) a glass fiber having an elongated cross-section with an aspect ratio, defined by the formula shown below, of 2.

Abstract: To provide a flame-retardant polyamide resin composition generally excellent in flame resistance, mechanical characteristics and electrical characteristics, and suitable for electrics/electronics components and vehicles. Used is a flame-retardant polyamide resin composition comprising, a polyamide resin (A), a phosphorus-containing flame retarder (B), and glass fiber having a non-circular cross-section (C), wherein the contents in the composition are 15 to 78% by weight for the polyamide resin (A), 2 to 20% by weight for the phosphorus-containing flame retarder (B), and 20 to 65% by weight for the glass fiber having a non-circular cross-section (C).

Abstract: Provided is a fiber-reinforced thermoplastic resin molded article, which contains reinforcing fibers having a given flattened cross-sectional profile, in which the fiber length distribution of the reinforcing fibers is shifted on the side of long fibers, and which is excellent in mechanical strength, heat resistance, dimensional accuracy such as warpage resistance, and surface appearance.

Abstract: Provided is a polyamide resin composition having particularly excellent strength and low warpage by virtue of being compounded with a glass fiber and suited as a material for portable electronic devices that are becoming thinner and lighter in weight in recent years. A polyamide resin composition for a portable electronic device, including (A) a polyamide resin, (B) a glass fiber having an elongated cross-section with an aspect ratio, defined by the formula shown below, of 2.

Abstract: To provide a flame-retardant polyamide resin composition generally excellent in flame resistance, mechanical characteristics and electrical characteristics, and suitable for electrics/electronics components and vehicles. Used is a flame-retardant polyamide resin composition comprising, a polyamide resin (A), a phosphorus-containing flame retarder (B), and glass fiber having a non-circular cross-section (C), wherein the contents in the composition are 15 to 78% by weight for the polyamide resin (A), 2 to 20% by weight for the phosphorus-containing flame retarder (B), and 20 to 65% by weight for the glass fiber having a non-circular cross-section (C).

Abstract: Provided is a fiber-reinforced thermoplastic resin molded article, which contains reinforcing fibers having a given flattened cross-sectional profile, in which the fiber length distribution of the reinforcing fibers is shifted on the side of long fibers, and which is excellent in mechanical strength, heat resistance, dimensional accuracy such as warpage resistance, and surface appearance. A fiber-reinforced thermoplastic resin molded article of a thermoplastic resin composition comprising from 70 to 35% by weight of a thermoplastic resin (A), and from 30 to 65% by weight of reinforcing fibers (B) of which the cross section is flattened to have a degree of flatness, as expressed by the formula mentioned below, of at least 2.3, wherein the weight-average fiber length of the reinforcing fibers in the molded article is at least 1 mm: Degree of flatness=major diameter of reinforcing fiber (a)/minor diameter of reinforcing fiber (b).

Abstract: In conventional Sn/Sb type brazing filler metals, there are disadvantages that large grains in a ?? phase are likely to deposit and that cracks are likely to occur in the elements and the bonded portion, and that voids are formed when the above described special coating is provided on the die bonding plane of the semiconductor element. The brazing filler metal of the present invention comprises 5 to 20 weight % of Sb and 0.01 to 5 weight % of Te, with the balance being Sn and incidental impurities, or a brazing filler metal comprises 5 to 20 weight % of Sb, 0.01 to 5 weight % of Te, 0.001 to 0.5 weight % of P, with the balance being Sn and incidental impurities.

Abstract: In the present invention, there is provided a polyamide resin composition for portable electronic devices, which is excellent in mechanical strength, thin-wall moldability, crystallinity and warping property. A polyamide resin composition comprising 30 to 80% by weight of a polyamide MP (A), 20 to 70% by weight of a polyamide resin (B) having a melting point not less than 245° C. (with the total amount of both being 100% by weight). The composition additionally comprises a filler (C) comprising a fibrous filler (C1) as an optional component and a plate-like filler (C2) as an essential component, wherein a content ratio (C1):(C2) is 0:10 to 9:1. The filler (C) is present in an amount of 30 to 250 parts by weight per 100 parts by weight of the sum of the polyamide MP (A) and the polyamide resin (B).

Abstract: The object the present invention is to provide an exterior molding body for automobile which is reinforced by a long fiber, is excellent in mechanical properties such as bending elastic modulus and bending strength, chemical resistance and heat resistance, is lightened, has high designability and is reduced in the anisotropy of linear expansion coefficient of molding body caused by the fiber orientation at filling thereof to a mold.

Abstract: The object the present invention is to provide an exterior molding body for automobile which is reinforced by a long fiber, is excellent in mechanical properties such as bending elastic modulus and bending strength, chemical resistance and heat resistance, is lightened, has high designability and is reduced in the anisotropy of linear expansion coefficient of molding body caused by the fiber orientation at filling thereof to a mold.

Abstract: In conventional Sn/Sb type brazing filler metals, there are disadvantages that large grains in a ?? phase are likely to deposit and that cracks are likely to occur in the elements and the bonded portion, and that voids are formed when the above described special coating is provided on the die bonding plane of the semiconductor element. The brazing filler metal of the present invention comprises 5 to 20 weight % of Sb and 0.01 to 5 weight % of Te, with the balance being Sn and incidental impurities, or a brazing filler metal comprises 5 to 20 weight % of Sb, 0.01 to 5 weight % of Te, 0.001 to 0.5 weight % of P, with the balance being Sn and incidental impurities.

Abstract: The present invention relates to a polyamide resin composition comprising: 100 parts by weight of a polyamide resin mixture comprising (A) 20 to 90% by weight of a polyamide 6 resin, a polyamide 66 resin or mixture thereof and (B) 10 to 80% by weight of an aromatic polyamide resin; and (C) 0 to 300 parts by weight of an inorganic filler, said aromatic polyamide resin being having diamine units comprising 10 to 50 mol % of paraxylylenediamine units and 50 to 90 mol % of methaxylylenediamine units, and aliphatic dicarboxylic acid units.