Patents by Inventor Kei Nagata

Kei Nagata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240134596
    Abstract: The content output device includes an information acquisition unit, a content generation unit and an output unit. The information acquisition unit acquires driving state information which is information related to a current driving state of a vehicle. The content generation unit acquires one or more content elements corresponding to a trigger condition, from among a plurality of content elements combinable with each other, when the driving state information satisfies the trigger condition, and generates an output content using the acquired content elements. The output unit outputs the output content.
    Type: Application
    Filed: June 29, 2021
    Publication date: April 25, 2024
    Inventors: Takashi IIZAWA, Keita KURAMOCHI, Atsuhiro YAMANAKA, Hideki NAGATA, Kazuaki TANAKA, Kyoichi TERAO, Takashi KAMIMURA, Daiki WAGURI, Yuya ISHIZAKI, Kei SUZUKI, Takayuki SHIMAZU
  • Publication number: 20100022745
    Abstract: A one component resin composition curable with a combination of light and heat, which comprises (1) an epoxy resin, (2) an acrylic ester monomer and/or methacrylic ester monomer, or an oligomer thereof, (3) a latent epoxy curing agent, (4) a photo radical initiator, and (5) a compound having two or more thiol groups per molecule, wherein the ingredient (5) is contained in an amount of 0.001 to 5.0 parts by weight per 100 parts by weight of this resin composition. According to the present invention, a one component resin composition curable with a combination of light and heat, which has excellent curability especially in a light-shielded area can be provided. Also, a liquid crystal sealant composition curable with a combination of light and heat, which is applicable to the one-drop-fill method and has excellent curability in light-shielded areas and adhesion reliability, especially high-temperature and high-humidity adhesion reliability, can be provided.
    Type: Application
    Filed: October 2, 2009
    Publication date: January 28, 2010
    Applicants: MITSUI CHEMICALS, INC., SHARP KABUSHIKI KAISHA
    Inventors: Fumito Takeuchi, Takahisa Miyawaki, Kenji Itou, Kenichi Yashiro, Kei Nagata, Souta Itou, Tazo Ikeguchi, Nobuo Sasaki, Makoto Nakahara
  • Patent number: 7566377
    Abstract: A liquid crystal sealing agent composition that is a one-component light and heat-curable resin composition containing: (1) a solid epoxy resin having a ring and ball method softening temperature of 40° C. or above; (2) an acrylate monomer and/or a methacrylate monomer, or an oligomer thereof; (3) a thermoplastic polymer having a ring and ball method softening temperature of 50 to 120° C., the thermoplastic polymer being obtained by copolymerizing an acrylate monomer and/or a methacrylate monomer with a monomer copolymerizable therewith; (4) a light-activated radical polymerization initiator; and (5) a latent epoxy curing agent.
    Type: Grant
    Filed: September 19, 2003
    Date of Patent: July 28, 2009
    Assignees: Mitsui Chemicals, Inc., Sharp Kabushiki Kaisha
    Inventors: Takahisa Miyawaki, Yasushi Mizuta, Fumito Takeuchi, Kenji Itou, Tadashi Kitamura, Hiroyuki Asakura, Kenichi Yashiro, Kei Nagata
  • Patent number: 7438958
    Abstract: The present invention provides a liquid crystal sealing composition and a liquid crystal display panel excellent in adhesion, moisture permeation resistance and heat resistance and superior for use in a sheet press heating bonding system. The liquid crystal sealing composition comprises (1) an alkoxysilyl group-containing modified epoxy resin obtained by de-alcohol condensation reaction of (a) an epoxy resin having at least one hydroxyl group in one molecule and (b) an alkoxysilyl group-containing compound, (2) a heat latent epoxy curing agent, (3) a filler having an average particle diameter of 0.1 to 10 ?m, and if necessary (4) an epoxy resin having at least 1.2 epoxy groups on average in one molecule, (5) an aprotic solvent having a boiling point in the range of 140 to 220° C., compatible with epoxy resin and inert to an epoxy group, and (6) other additives.
    Type: Grant
    Filed: October 24, 2003
    Date of Patent: October 21, 2008
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Takahisa Miyawaki, Kenichi Yashiro, Kei Nagata
  • Publication number: 20070096056
    Abstract: A one component resin composition curable with a combination of light and heat, which comprises (1) an epoxy resin, (2) an acrylic ester monomer and/or methacrylic ester monomer, or an oligomer thereof, (3) a latent epoxy curing agent, (4) a photo radical initiator, and (5) a compound having two or more thiol groups per molecule, wherein the ingredient (5) is contained in an amount of 0.001 to 5.0 parts by weight per 100 parts by weight of this resin composition. According to the present invention, a one component resin composition curable with a combination of light and heat, which has excellent curability especially in a light-shielded area can be provided. Also, a liquid crystal sealant composition curable with a combination of light and heat, which is applicable to the one-drop-fill method and has excellent curability in light-shielded areas and adhesion reliability, especially high-temperature and high-humidity adhesion reliability, can be provided.
    Type: Application
    Filed: November 25, 2004
    Publication date: May 3, 2007
    Applicants: MITSUI CHEMICALS, INC., SHARP KABUSHIKI KAISHA
    Inventors: Fumito Takeuchi, Takahisa Miyawaki, Kenji Itou, Kenichi Yashiro, Kei Nagata, Souta Itou, Tazo Ikeguchi, Nobuo Sasaki, Makoto Nakahara
  • Publication number: 20060009579
    Abstract: A liquid crystal sealing agent composition that is a one-component light and heat-curable resin composition containing: (1) a solid epoxy resin having a ring and ball method softening temperature of 40° C. or above; (2) an acrylate monomer and/or a methacrylate monomer, or an oligomer thereof; (3) a thermoplastic polymer having a ring and ball method softening temperature of 50 to 120° C., the thermoplastic polymer being obtained by copolymerizing an acrylate monomer and/or a methacrylate monomer with a monomer copolymerizable therewith; (4) a light-activated radical polymerization initiator; and (5) a latent epoxy curing agent.
    Type: Application
    Filed: September 19, 2003
    Publication date: January 12, 2006
    Applicant: MITSUI CHEMICALS AND AND SHARP KABUSHIKI KAISHA
    Inventors: Takahisa Miyawaki, Yasushi Mizuta, Fumito Takeuchi, Kenji Itou, Tadashi Kitamura, Hiroyuki Asakura, Kenichi yashiro, Kei Nagata
  • Publication number: 20060006362
    Abstract: The present invention provides a liquid crystal sealing composition and a liquid crystal display panel excellent in adhesion, moisture permeation resistance and heat resistance and superior for use in a sheet press heating bonding system. The liquid crystal sealing composition comprises (1) an alkoxysilyl group-containing modified epoxy resin obtained by de-alcohol condensation reaction of (a) an epoxy resin having at least one hydroxyl group in one molecule and (b) analkoxysilyl group-containing compound, (2) a heat latent epoxy curing agent, (3) a filler having an average particle diameter of 0.1 to 10 ?m, and if necessary (4) an epoxy resin having at least 1.2 epoxy groups on average in one molecule, (5) an aprotic solvent having a boiling point in the range of 140 to 220° C., compatible with epoxy resin and inert to an epoxy group, and (6) other additives.
    Type: Application
    Filed: October 24, 2003
    Publication date: January 12, 2006
    Applicant: Mitsui Chemicals, Inc.
    Inventors: Takahisa Miyawaki, Kenichi Yashiro, Kei Nagata
  • Patent number: 6586496
    Abstract: A photo-curable resin composition for sealing material, which is superior in the photo-curing performance and in the prompt curing property and is better in the adhesive property, in the resistance to moisture permeation and in the heat resistance, the photo-curable resin composition comprising (A) a compound having oxetane ring, (B) a photoinitiator for cationic polymerization and (C) a silane coupling agent, wherein the composition has a viscosity in the range from 0.01 to 300 Pa.s at 25° C.
    Type: Grant
    Filed: March 23, 2001
    Date of Patent: July 1, 2003
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yasushi Takamatsu, Kei Nagata, Masahiro Ota, Yasushi Mizuta, Yoshio Kikuta