Abstract: One aspect of the present disclosure is a manufacturing method for a support piece used in the formation of a dolmen structure in a semiconductor device, including processes of: (A) preparing a laminate film including a base material film, an adhesive layer, and a support piece formation film, for example, including a thermosetting resin layer, in this order; and (B) forming support pieces on a surface of the adhesive layer by singulating the support piece formation film, in which the process (B) includes a process of forming a cut in the support piece formation film partway in a thickness direction, and a process of singulating the support piece formation film in a cooled state by expansion, in this order.

Abstract: A liquid discharge head includes first and second groups of nozzles and first and second groups of actuators corresponding to the first and second groups of nozzles, respectively, and a head drive circuit. The head drive circuit is configured to receive a sequence of input data portions including first and second data portions, and select a setting mode between a first setting mode, in which the first group of actuators is driven based on the first input data portion and the second group of actuators is driven based on the second input data portion, and a second setting mode, in which the second group of actuators is driven based on the first input data portion and the first group of actuators is driven based on an input data portion that is after the first data portion in the sequence.

Abstract: According to one embodiment, a control circuit for an inkjet head or the like includes an input circuit configured to receive drive information for driving liquid ejection from a plurality of nozzle arrays. The drive information includes a drive signal value to be supplied to a channel of the plurality of nozzle arrays. A latch circuit array of the control circuit has latch circuits for storing the drive information for each array in the plurality of nozzle arrays. A setting register is configured to receive a setting value to configure the input circuit to correspond to a connection mode for the plurality of latch circuits. The setting value corresponds to the number of arrays in the plurality of nozzle arrays.

Abstract: According to one embodiment, a control circuit for an inkjet head or the like includes an input circuit configured to receive drive information for driving liquid ejection from a plurality of nozzle arrays. The drive information includes a drive signal value to be supplied to a channel of the plurality of nozzle arrays. A latch circuit array of the control circuit has latch circuits for storing the drive information for each array in the plurality of nozzle arrays. A setting register is configured to receive a setting value to configure the input circuit to correspond to a connection mode for the plurality of latch circuits. The setting value corresponds to the number of arrays in the plurality of nozzle arrays.

Abstract: A liquid discharge head includes first and second groups of nozzles and first and second groups of actuators corresponding to the first and second groups of nozzles, respectively, and a head drive circuit. The head drive circuit is configured to receive a sequence of input data portions including first and second data portions, and select a setting mode between a first setting mode, in which the first group of actuators is driven based on the first input data portion and the second group of actuators is driven based on the second input data portion, and a second setting mode, in which the second group of actuators is driven based on the first input data portion and the first group of actuators is driven based on an input data portion that is after the first data portion in the sequence.

Abstract: A solder material includes 25 to 45 mass % of Sn, 30 to 40 mass % of Sb, 3 to 8 mass % of Cu, 25 mass % or less of Ag, and 1.3 to 6 mass % of In.