Abstract: A polyphenylene sulfide resin composition is obtained by mixing a polyphenylene sulfide resin (a), a fluororesin (b) and an organosilane compound (c). When a resin phase-separated structure of a molded product formed from the polyphenylene sulfide resin composition is observed by an electron microscope, the component (a) forms a continuous phase, the component (b) forms a primary dispersed phase having a number-average dispersion diameter of not greater than 1 ?m, and a secondary dispersed phase of the component (a) is included in the primary dispersed phase of the component (b).

Abstract: A polyphenylene sulfide resin composition is obtained by mixing a polyphenylene sulfide resin (a), a fluororesin (b) and an organosilane compound (c). When a resin phase-separated structure of a molded product formed from the polyphenylene sulfide resin composition is observed by an electron microscope, the component (a) forms a continuous phase, the component (b) forms a primary dispersed phase having a number-average dispersion diameter of not greater than 1 ?m, and a secondary dispersed phase of the component (a) is included in the primary dispersed phase of the component (b).

Abstract: A polyphenylene sulfide resin composition has excellent heat resistance, flowability and lightweight property as well as surface smoothness and impact resistance. The polyphenylene sulfide resin composition includes 1 to 30 parts by weight of a mica (b) having an aspect ratio of not less than 80, relative to 100 parts by weight of a polyphenylene sulfide resin (a).

Abstract: A polyphenylene sulfide resin composition has excellent heat resistance, flowability and lightweight property as well as surface smoothness and impact resistance. The polyphenylene sulfide resin composition includes 1 to 30 parts by weight of a mica (b) having an aspect ratio of not less than 80, relative to 100 parts by weight of a polyphenylene sulfide resin (a).

Abstract: A polyarylene sulfide resin composition includes: (A) a polyarylene sulfide resin having a carboxyl group content of more than 100 ?mol/g and less than 400 ?mol/g, and also having a weight average molecular weight of 10,000 or more and less than 100,000; and (B) a filler. The polyarylene sulfide resin composition has improved mechanical properties and chemical resistance while maintaining intrinsic high melting point of a polyarylene sulfide.

Abstract: A polyphenylene sulfide resin composition includes 5-50% by weight of (A) a polyphenylene sulfide resin having a weight-average molecular weight of not less than 10000 and a polydispersity, which is expressed by dividing the weight-average molecular weight by a number-average molecular weight, of not higher than 2.5; and 95-50% by weight of (B) fused silica in a spherical form having a volume-average particle diameter of not less than 0.1 ?m and less than 1.0 ?m, wherein a total of (A) and (B) is kept at 100% by weight.

Abstract: The invention provides a PPS resin composition having excellent heat resistance and excellent electrical properties without damaging excellent physical properties including mechanical properties and low gas generation which PPS intrinsically has. There is provided a resin composition comprising (a) a polyphenylene sulfide resin and (b) one or more copolymers selected among a tetrafluoroethylene/hexafluoropropylene copolymer, an ethylene/tetrafluoroethylene copolymer and a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer. In the resin composition, (a) the polyphenylene sulfide resin forms a continuous phase, (b) one copolymer selected among the above components forms primary dispersed phases, and the primary dispersed phase includes secondary dispersed phases formed by a component different from the component of the primary dispersed phase.

Abstract: A polyarylene sulfide resin composition includes: (A) a polyarylene sulfide resin having a carboxyl group content of more than 100 ?mol/g and less than 400 ?mol/g, and also having a weight average molecular weight of 10,000 or more and less than 100,000; and (B) a filler. The polyarylene sulfide resin composition has improved mechanical properties and chemical resistance while maintaining intrinsic high melting point of a polyarylene sulfide.

Abstract: There is provided a polyphenylene sulfide resin composition, comprising 5 to 95% by weight of a component (B) which is a polyphenylene sulfide resin having a weight-average molecular weight of not less than 10,000 and a weight loss percentage ?Wr of not greater than 0.18% under heating, relative to 95 to 5% by weight of a component (A) which is a polyphenylene sulfide resin having the weight loss percentage ?Wr of greater than 0.18%, wherein a total of the component (A) and the component (B) is equal to 100% by weight.

Abstract: There is provided a polyphenylene sulfide resin composition, comprising 5 to 95% by weight of a component (B) which is a polyphenylene sulfide resin having a weight-average molecular weight of not less than 10,000 and a weight loss percentage ?Wr of not greater than 0.18% under heating, relative to 95 to 5% by weight of a component (A) which is a polyphenylene sulfide resin having the weight loss percentage ?Wr of greater than 0.18%, wherein a total of the component (A) and the component (B) is equal to 100% by weight.

Abstract: The invention provides a PPS resin composition having excellent heat resistance and excellent electrical properties without damaging excellent physical properties including mechanical properties and low gas generation which PPS intrinsically has. There is provided a resin composition comprising (a) a polyphenylene sulfide resin and (b) one or more copolymers selected among a tetrafluoroethylene/hexafluoropropylene copolymer, an ethylene/tetrafluoroethylene copolymer and a tetrafluoroethylene/perfluoro(alkyl vinyl ether) copolymer. In the resin composition, (a) the polyphenylene sulfide resin forms a continuous phase, (b) one copolymer selected among the above components forms primary dispersed phases, and the primary dispersed phase includes secondary dispersed phases formed by a component different from the component of the primary dispersed phase.

Abstract: There is provided a polyphenylene sulfide resin composition, comprising 5 to 95% by weight of a component (B) which is a polyphenylene sulfide resin having a weight-average molecular weight of not less than 10,000 and a weight loss percentage ?Wr of not greater than 0.18% under heating, relative to 95 to 5% by weight of a component (A) which is a polyphenylene sulfide resin having the weight loss percentage ?Wr of greater than 0.18%, wherein a total of the component (A) and the component (B) is equal to 100% by weight.

Abstract: There is provided a polyphenylene sulfide (PPS) resin composition, comprising: 5 to 50 parts by weight of a polyamide resin (b) and 50 to 250 parts by weight of a metal hydroxide (c) relative to 100 parts by weight of a polyphenylene sulfide resin (a), wherein the metal hydroxide is dispersed in the composition at an average secondary particle diameter equal to or less than 5 ?m. The PPS resin composition may provide excellent tracking resistance without significantly damaging various intrinsic properties of a PPS resin, such as excellent mechanical strength and low gas generation.

Abstract: A polyphenylene sulfide resin composition has excellent heat resistance, flowability and lightweight property as well as surface smoothness and impact resistance. The polyphenylene sulfide resin composition includes 1 to 30 parts by weight of a mica (b) having an aspect ratio of not less than 80, relative to 100 parts by weight of a polyphenylene sulfide resin (a).

Abstract: There is provided a polyphenylene sulfide resin composition, comprising 5 to 95% by weight of a component (B) which is a polyphenylene sulfide resin having a weight-average molecular weight of not less than 10,000 and a weight loss percentage ?Wr of not greater than 0.18% under heating, relative to 95 to 5% by weight of a component (A) which is a polyphenylene sulfide resin having the weight loss percentage ?Wr of greater than 0.18%, wherein a total of the component (A) and the component (B) is equal to 100% by weight.

Abstract: There is provided a polyphenylene sulfide (PPS) resin composition, comprising: 5 to 50 parts by weight of a polyamide resin (b) and 50 to 250 parts by weight of a metal hydroxide (c) relative to 100 parts by weight of a polyphenylene sulfide resin (a), wherein the metal hydroxide is dispersed in the composition at an average secondary particle diameter equal to or less than 5 ?m. The PPS resin composition may provide excellent tracking resistance without significantly damaging various intrinsic properties of a PPS resin, such as excellent mechanical strength and low gas generation.

Abstract: A polyphenylene sulfide resin composition including 100 parts by weight of a resin composition that consists of 99 to 60 wt % of a polyphenylene sulfide resin (a), and 1 to 40 wt % of at least one type of noncrystalline resin (b) selected from the group consisting of polyetherimide resin and polyether sulfone resin and 0.1 to 10 parts by weight of a compound (c) containing at least one group selected from epoxy group, amino group and isocyanate group, wherein the non-crystalline resin (b) forms an island phase and the number-average dispersed particle size of the noncrystalline resin (b) is 1,000 nm or less.

Abstract: There are provided a non-contact type semiconductor device, a mobile terminal device, and a communication system capable of suppressing unauthorized read, thereby assuring security. The non-contact type semiconductor device records information for identifying a read device of a communication destination and a request from a read device in a recording area. Moreover, the non-contact type semiconductor device holds authentication information and access authority, requests the read device to send authentication information, correlates the authentication information with the authentication information and access authority held, and executes the request from the read device according to the correlation result. Furthermore, by performing mutual communication by using the read device, the non-contact type semiconductor device, and a mobile terminal device using the non-contact type semiconductor device, it is possible to suppress unauthorized read, thereby assuring security.

Abstract: A process for producing a polyphenylene sulfide resin composition includes melt-kneading about 99 to about 60 wt % of a polyphenylene sulfide resin (a) and about 1 to about 40 wt % of a polyamide resin (b), and about 0.1 to 10 parts by weight of a compatibilizing agent (c) per 100 parts by weight in total of the polyphenylene sulfide resin (a) and the polyamide resin (b), using a double screw extruder with two or more kneading portions at a temperature of the range from a melting peak temperature of the polyphenylene sulfide resin+10° C. to a melting peak temperature of the polyphenylene sulfide resin+70° C., wherein the polyamide resin (b) is excluded nylon 46 and has a relative viscosity of 1.5 or more measuring in concentrated sulfuric acid at a concentration of 1% and at 25° C.

Abstract: A polyphenylene sulfide resin treated by thermal oxidation has a generated gas amount of 0.23 wt % or less when the resin is heated and melted in vacuum at 320° C. for 2 hours; a residual amount of 3.0 wt % or less as a residue when the resin is dissolved in an amount corresponding to 20 times the weight of the resin, of 1-chloronaphthalene at 250° C. for 5 minutes and, as the 1-chloronaphthalene solution, pressure-filtered in a still hot state by a PTFE membrane filter with a pore size of 1 ?m or less; and a melt flow rate (measured at a temperature of 315.5° C. and at a load of 5000 g according to ASTM D-1238-70) of more than 100 g/10 min to 500 g/10 min.