Abstract: The purpose of the present invention is to allow a clean airflow around a substrate to reliably move downward of the substrate in an examination device in which clean air is supplied to an inspection chamber. This examination device is provided with a rectifying plate (see FIG. 4A) which covers a part of the upper surface of a stage for mounting a substrate, and is disposed between a gas supply unit and the stage to block an airflow toward the substrate.

Abstract: To provide a method of manufacturing a light-emitting module capable of accurately arranging a plurality of light-emitting elements at narrow intervals, and a light-emitting module manufactured by the method of manufacturing, and, moreover, a device on which the light-emitting module is mounted.

Abstract: A stereolithography apparatus according to an embodiment of the present technology includes a light source unit, a photo-detector, and a control unit. The light source unit includes a plurality of light-emitting elements that emits light for curing a photo-curing resin. The photo-detector detects the light emitted from the light source unit. The control unit generates an amount-of-light profile indicating an amount-of-light distribution of the light on the basis of the light detected by the photo-detector and controls light emission of the plurality of light-emitting elements on the basis of the amount-of-light profile.

Abstract: A stereolithography apparatus according to an embodiment of the present technology includes a light source unit, a photo-detector, and a control unit. The light source unit includes a plurality of light-emitting elements that emits light for curing a photo-curing resin. The photo-detector detects the light emitted from the light source unit. The control unit generates an amount-of-light profile indicating an amount-of-light distribution of the light on the basis of the light detected by the photo-detector and controls light emission of the plurality of light-emitting elements on the basis of the amount-of-light profile.

Abstract: A light emitting element assembly includes: a light emitting element (21); a light emitting element drive unit (30); a first joining member (41) connected to an electrode provided in the light emitting element (21); and a second joining member (42) provided on the light emitting element drive unit (30).

Abstract: An exposure apparatus includes an optical system unit, a modeling unit, and a separation member. The optical system unit includes an exit region from which light is emitted. The modeling unit includes a modeling region to which photosensitive material is supplied, the photosensitive material being sensitive to the light emitted from the exit region. The separation member is translucent, and is arranged at least between the exit region of the optical system unit and the modeling region. This makes it possible to suppress a deterioration in a performance of an optical system that is caused due to the occurrence of a volatile constituent of photosensitive material.

Abstract: To provide a method of manufacturing a light-emitting module capable of accurately arranging a plurality of light-emitting elements at narrow intervals, and a light-emitting module manufactured by the method of manufacturing, and, moreover, a device on which the light-emitting module is mounted.

Abstract: A stereolithography apparatus according to an embodiment of the present technology includes a light source unit, a photo-detector, and a control unit. The light source unit includes a plurality of light-emitting elements that emits light for curing a photo-curing resin. The photo-detector detects the light emitted from the light source unit. The control unit generates an amount-of-light profile indicating an amount-of-light distribution of the light on the basis of the light detected by the photo-detector and controls light emission of the plurality of light-emitting elements on the basis of the amount-of-light profile.

Abstract: A light-emitting module according to an embodiment of the present technology includes a plurality of multi-light emitters each including a plurality of light-emitting elements that is arranged to be spaced apart from each other by a predetermined distance in one direction and emits light in a direction orthogonal to the one direction, and a plurality of individual electrodes that supplies each of the plurality of light-emitting elements with electric power, the plurality of multi-light emitters being arranged in the one direction. The plurality of light-emitting elements includes a first light-emitting element located at an outermost end in the one direction, and a second light-emitting element located at a second-outermost end in the one direction. The plurality of individual electrodes includes a first individual electrode that supplies the first light-emitting element with electric power, and a second individual electrode that supplies the second light-emitting element with electric power.

Abstract: [Solving Means] A molding apparatus includes a stage, a regulation body, a light irradiation section, and a movement mechanism. The stage has a stage surface. The regulation body has a surface including a regulation surface facing to the stage surface and a photocatalyst layer arranged on the regulation surface. The regulation body regulates a position in a lamination direction of a material of a molded object to be formed on the stage surface by the regulation surface. The light irradiation section irradiates the material with light via the photocatalyst layer of the regulation body. The movement mechanism relatively moves the stage and the regulation body.

Abstract: A method of manufacturing a mounting substrate according to an embodiment of the present technology includes the following three steps: (1) a step of forming a plurality of electrodes on a semiconductor layer, and thereafter forming one of solder bumps at a position facing each of the electrodes; (2) a step of covering the solder bumps with a coating layer, and thereafter selectively etching the semiconductor layer with use of the coating layer as a mask to separate the semiconductor layer into a plurality of elements; and (3) a step of removing the coating layer, and thereafter mounting the elements on a wiring substrate to direct the solder bumps toward the wiring substrate, thereby forming the mounting substrate.

Abstract: A method of manufacturing a mounting substrate according to an embodiment of the present technology includes the following three steps: (1) a step of forming a plurality of electrodes on a semiconductor layer, and thereafter forming one of solder bumps at a position facing each of the electrodes; (2) a step of covering the solder bumps with a coating layer, and thereafter selectively etching the semiconductor layer with use of the coating layer as a mask to separate the semiconductor layer into a plurality of elements; and (3) a step of removing the coating layer, and thereafter mounting the elements on a wiring substrate to direct the solder bumps toward the wiring substrate, thereby forming the mounting substrate.

Abstract: A brushless motor includes a stator as an armature where a plurality of coils is housed and a rotor as a magnetic exciter having a permanent magnet, wherein an end portion of the coil housed in a slot of a stator stack is inserted into a wire binding board having a wire binding pattern of the coil, the end portion of the coil is soldered to a land of the wire binding board, and the wire binding board and a circuit board are electrically conducted to each other through an connecting terminal.

Abstract: A semiconductor laser includes: a semiconductor layer including an active layer and a ridge portion, the ridge portion facing a current injection region of the active layer; and an embedded film covering a side surface of the ridge portion and a top surface of the semiconductor layer, wherein the embedded film includes a first layer configured of a silicon oxide film, a second layer made of a silicon compound having a refractive index lower than that of the active layer and having a silicon content higher than a stoichiometric ratio, and a third layer made of an inorganic insulating material in this order of closeness to the ridge portion and the semiconductor layer.

Abstract: A brushless motor includes a stator as an armature where a plurality of coils is housed and a rotor as a magnetic exciter having a permanent magnet, wherein an end portion of the coil housed in a slot of a stator stack is inserted into a wire binding board having a wire binding pattern of the coil, the end portion of the coil is soldered to a land of the wire binding board, and the wire binding board and a circuit board are electrically conducted to each other through an connecting terminal.

Abstract: A piezoelectric layer has a multilayer structure including a tensile stress layer and a compression stress layer. The mechanical strength of the piezoelectric layer is increased to prevent the occurrence of cracks and to realize a high electromechanical coupling coefficient. An acoustic resonator 1 includes a first electrode 13 including at least one conductive layer, a piezoelectric layer 14 including a plurality of layers, the piezoelectric layer 14 being formed adjacent to the top face of the first electrode 13, and a second electrode 15 including at least one conductive layer, the second electrode 15 being formed adjacent to the top face of the piezoelectric layer 14. The piezoelectric layer 14 includes a tensile compression layer 23 in which tensile stress is present and compression stress layers 21 and 25 in which compression stress is present. The tensile stress in the tensile stress layer 23 and the compression stress in the compression stress layers 22 and 25 are adjusted to cancel each other.