Abstract: Provided are silicone elastomer particles having a crosslinked structure which is active with respect to biodegradability, and can provide texture and feel during use that is equal to or higher than conventional silicone elastomer particles when blended in a cosmetic composition or the like, a reactive group-containing polycaprolactone compound having a specific structure and useful as a raw material for synthesis reactions, and a method for producing the same. A polycaprolactone compound containing a reactive group having two or more modified polycaprolactone structures has the structural formula (1) as described herein, where in the formula, n is a number in the range 1 to 5 and Ra is a specific (meth)acryl terminal group or alkenyl terminal group, specifically, a compound selected from the aforementioned (meth)acryl-modified polycaprolactone compounds and alkenyl-modified polycaprolactone compounds.

Abstract: A co-extruded sheet reduces swelling and/or cracking of the surface occurring during thermal shaping such as vacuum forming and provides improved mechanical strength. A co-extruded sheet contains a polycarbonate resin, and includes a core layer formed from a foam resin and skin layers formed from a non-foaming resin. The skin layer is laminated to one major surface of the core layer, while the skin layer is laminated to the other major surface of the core layer. The core layer has an expansion ratio of 1.6 to 3. The co-extruded sheet has a thickness of 1 to 5 mm and satisfies expression (1): 0.10? (t1+t2)/T?0.5. In expression (1), t1 indicates the thickness of the skin layer, t2 indicates the thickness of the second skin layer, and T indicates the thickness of the co-extruded sheet.

Abstract: A semiconductor device includes: a chip mounting portion having a lower surface on which a first ditch is formed; a semiconductor chip mounted on an upper surface of the chip mounting portion; a lead electrically connected to a pad of the semiconductor chip through a conductive member; and a sealing body configured to seal the semiconductor chip, wherein the lower surface of the chip mounting portion is exposed from the sealing body, and wherein a plating film is formed on the lower surface including an inside of the first ditch.

Abstract: The reliability of a semiconductor device is improved. In a manufacturing method of a semiconductor device, when resin enters a ditch formed on a lower surface of a chip mounting portion by a process of forming a sealing body made of the resin, the resin embedded in the ditch is removed by a process of cleaning the lower surface of the chip mounting portion, and a plating film is formed also on an inner wall of the ditch in a process of forming the plating film on the lower surface of the chip mounting portion.

Abstract: The reliability of a semiconductor device is improved. In a manufacturing method of a semiconductor device, when resin enters a ditch formed on a lower surface of a chip mounting portion by a process of forming a sealing body made of the resin, the resin embedded in the ditch is removed by a process of cleaning the lower surface of the chip mounting portion, and a plating film is formed also on an inner wall of the ditch in a process of forming the plating film on the lower surface of the chip mounting portion.