Abstract: There is provided a parallel sensing touch control device including a capacitive sensor array processed by differential unit. In one detection interval, the device is concurrently conducting more than one sensing electrode of the capacitive sensor array so as to reduce a scanning interval of the capacitive sensor array. The differential unit performs a differential operation on detected signals to cancel out common mode noise.

Abstract: A short circuit testing method for a capacitive sensing device including a plurality of sense lines and a plurality of drive lines includes: under a short circuit testing mode, coupling at least one first line in the sense lines and drive lines to a reference level; using a sensing circuit corresponding to a specific sense line to read out a testing resultant signal; and, comparing the testing resultant signal with a reference signal to determine whether a short circuit exists.

Abstract: An amplifier circuit comprising: a first amplifier, comprising a voltage input terminal and a voltage output terminal; a voltage offset providing circuit, comprising a first terminal coupled to a first predetermined voltage source, a second terminal coupled to the voltage output terminal, and a third terminal, wherein a voltage at the third terminal is higher than a voltage at the second terminal by an offset voltage; and a voltage control capacitor, comprising a fourth terminal coupled to the third terminal, and a fifth terminal coupled to the voltage input terminal, wherein a capacitance value of the voltage control capacitor corresponds to a voltage difference between a voltage at the fifth terminal and a voltage at the fourth terminal. A better compensation for the amplifier circuit can be acquired since a voltage control capacitor having a capacitance value corresponding to the output voltage of the amplifier is applied.

Abstract: An amplifier circuit comprising: a first amplifier, comprising a voltage input terminal and a voltage output terminal; a voltage offset providing circuit, comprising a first terminal coupled to a first predetermined voltage source, a second terminal coupled to the voltage output terminal, and a third terminal, wherein a voltage at the third terminal is higher than a voltage at the second terminal by an offset voltage; and a voltage control capacitor, comprising a fourth terminal coupled to the third terminal, and a fifth terminal coupled to the voltage input terminal, wherein a capacitance value of the voltage control capacitor corresponds to a voltage difference between a voltage at the fifth terminal and a voltage at the fourth terminal. A better compensation for the amplifier circuit can be acquired since a voltage control capacitor having a capacitance value corresponding to the output voltage of the amplifier is applied.

Abstract: A method of an image sensor device includes: using a pixel array of the image sensor device to sense and generate at least one dark image; computing pixel statistics according to the at least one dark image; and, determining which one of a plurality of temperature ranges a temperature of the image sensor device falls within according to the pixel statistics.

Abstract: There is provided a parallel sensing touch control device including a capacitive sensor array processed by differential unit. In one detection interval, the device is concurrently conducting more than one sensing electrode of the capacitive sensor array so as to reduce a scanning interval of the capacitive sensor array. The differential unit performs a differential operation on detected signals to cancel out common mode noise.

Abstract: A method of an image sensor device includes: using a pixel array of the image sensor device to sense and generate at least one dark image; computing pixel statistics according to the at least one dark image; and, determining which one of a plurality of temperature ranges a temperature of the image sensor device falls within according to the pixel statistics.

Abstract: A hybrid transmitter driver works in a first operation mode or a second operation mode and includes an operational amplifier, a pre-driver, a first multiplexer, a second multiplexer and an output stage driver. After receiving a signal from the first signal generator, the operational amplifier outputs a first driving signal and a third driving signal. After receiving a signal from the second signal generator, the pre-driver outputs a second driving signal and a fourth driving signal. In the first operation mode, the first multiplexer outputs the second driving signal and the second multiplexer outputs the fourth driving signal to make the output stage driver output a first transmission signal. In the second operation mode, the first multiplexer outputs the first driving signal and the second multiplexer outputs the third driving signal to make the output stage driver output a second transmission signal.

Abstract: A hybrid transmitter driver works in a first operation mode or a second operation mode and includes an operational amplifier, a pre-driver, a first multiplexer, a second multiplexer and an output stage driver. After receiving a signal from the first signal generator, the operational amplifier outputs a first driving signal and a third driving signal. After receiving a signal from the second signal generator, the pre-driver outputs a second driving signal and a fourth driving signal. In the first operation mode, the first multiplexer outputs the second driving signal and the second multiplexer outputs the fourth driving signal to make the output stage driver output a first transmission signal. In the second operation mode, the first multiplexer outputs the first driving signal and the second multiplexer outputs the third driving signal to make the output stage driver output a second transmission signal.

Abstract: A short circuit testing method for a capacitive sensing device including a plurality of sense lines and a plurality of drive lines includes: under a short circuit testing mode, coupling at least one first line in the sense lines and drive lines to a reference level; using a sensing circuit corresponding to a specific sense line to read out a testing resultant signal; and, comparing the testing resultant signal with a reference signal to determine whether a short circuit exists.

Abstract: There is provided a capacitive touch sensing system including a touch panel, a plurality of amplification units, an analog signal processing unit and an AD converter. The touch panel includes a plurality of driving electrodes intersecting with a plurality of sensing electrodes. Each of the amplification units is coupled to one of the sensing electrodes so as to output an amplified sensing signal. The analog signal processing unit demodulates a differential signal of the amplified sensing signals outputted by two adjacent amplification units or demodulates the amplified sensing signal outputted by the amplification units to generate a dc signal. The AD converter converts the dc signal to a digital signal.

Abstract: A pipelined ADC incorporating variable input gain has a novel first stage generating a first digital output and a residue according to an analog input. The first stage comprises a novel MDAC. The MDAC comprises an operational amplifier, a feedback capacitor, a first sampling capacitor and a second sampling capacitor. First terminals of the feedback capacitor, the first sampling capacitor and the second sampling capacitor are connected to an inverted input terminal of the operational amplifier. A non-inverted input terminal of the operational amplifier is connected to a ground. In a sampling phase, second terminals of the feedback capacitor, the first sampling capacitor and the second sampling capacitor are connected to the analog input. In a charge transferring phase, second terminals of the feedback capacitor, the first sampling capacitor and the second sampling capacitor are respectively connected to the output terminal, a flash ADC output and the ground.

Abstract: There is provided a capacitive touch sensing system including a touch panel, a plurality of amplification units, an analog signal processing unit and an AD converter. The touch panel includes a plurality of driving electrodes intersecting with a plurality of sensing electrodes. Each of the amplification units is coupled to one of the sensing electrodes so as to output an amplified sensing signal. The analog signal processing unit demodulates a differential signal of the amplified sensing signals outputted by two adjacent amplification units or demodulates the amplified sensing signal outputted by the amplification units to generate a dc signal. The AD converter converts the dc signal to a digital signal.

Abstract: According to embodiments of the present invention, an analog-to-digital converter is provided. The analog-to-digital converter includes an input configured to receive an input signal, a feed-forward path connected to the input configured to feed forward the input signal, a processing path including a loop filter, wherein the loop filter includes at least one local feedback path configured to feed back an output signal of the loop filter to an input of the loop filter, a first combiner configured to combine the input signal fed forward by the feed-forward path with an output of the processing path, a quantizer configured to generate an output signal of the converter, a feed-back path configured to feed back the output signal, and a second combiner wherein the processing path is connected to the second combiner and the second combiner is configured to combine the input signal with the fed back output signal of the converter and supply the result of the combination to the processing path.

Abstract: A method of forming a buried contact junction without forming a buried contact trench and without a disconnection gap in the current path by using a tapered polysilicon profile and a large angle tilt buried contact implant is described. A layer of gate silicon oxide is provided over the surface of a semiconductor substrate. A first polysilicon layer is deposited overlying the gate silicon oxide layer. The first polysilicon layer is etched away where it is not covered by a buried contact mask to provide an opening to the semiconductor substrate wherein the first polysilicon layer is tapered such that the bottom of the opening has a width the size of the planned buried contact and wherein the top of the opening has a width larger than the size of the planned buried contact. Ions are implanted at a tilt angle into the substrate within the opening whereby the ions penetrate the substrate laterally underlying with said first polysilicon layer to form the buried contact.