Abstract: Provided is a method for manufacturing a wiring substrate. The method includes forming a resist layer on a support body, exposing the resist layer, developing the exposed resist layer to form an opening in the resist layer, forming a metal wiring in the opening, and removing the resist layer after the metal wiring is formed. In the exposing of the resist layer, a wiring exposure pattern that corresponds to the metal wiring, and a dummy exposure pattern that does not correspond to the metal wiring are exposed to the resist layer. At least a part of the dummy exposure pattern is located in a region within 200 ?m from an end portion of the wiring exposure pattern.

Abstract: A method for manufacturing a wiring board, including: forming a resist layer on a seed layer comprising a metal provided on a support body; forming a pattern including an opening to which the seed layer is exposed in the resist layer by light exposure and development of the resist layer, and forming a copper plating layer on the seed layer exposed into the opening by electrolytic plating, in this order. The arithmetic mean roughness Ra of the surface of the seed layer on a side opposite to the support body is 0.05 ?m or more and 0.30 ?m or less.

Abstract: A method for producing a coating liquid, the method including: a preparation step of preparing an emulsion containing a polymer-based emulsifier, a binder resin, and a liquid medium, and aerogel particles; and a mixing step of mixing the emulsion and the aerogel particles prepared in the preparation step to agglomerate at least a portion of the aerogel particles, and obtaining a coating liquid containing agglomerates of the aerogel particles, the polymer-based emulsifier, the binder resin, and the liquid medium.

Abstract: A method for producing a wiring board, including: a step of pretreating the surface of a metal layer exposed into an opening by bringing the surface into contact with a pretreatment liquid at a predetermined pretreatment temperature; and a step of forming a copper plating layer on the metal layer by electrolytic plating. The resist layer and the pretreatment liquid are selected such that a mass change rate of the resist layer when the resist layer before being exposed and developed is immersed in the pretreatment liquid is ?2.0% by mass or more. The mass change rate is a value calculated by Expression: Mass change rate (% by mass)={(W1?W0)/W0}×100. W1 is the mass of the resist layer after a laminated body including a resist layer 3 and a copper foil is immersed in the pretreatment liquid at the pretreatment temperature for 30 minutes.

Abstract: A manufacturing method for a thermal insulating material, including: an applying step of applying a coating liquid obtained by mixing aerogel particles, a water-soluble polymer having a hydrophobic group, and a liquid medium such that the aerogel particles are aggregated, with a coating means applying a pressure of 1.5 MPa or less to the coating liquid to obtain a coated film; and a removing step of removing at least a part of the liquid medium from the coated film to obtain a thermal insulating material.

Abstract: A manufacturing method for a coating liquid, including: a preparing step of preparing aerogel particles, a water-soluble polymer having a hydrophobic group, and a liquid medium; and a mixing step of mixing the aerogel particles, the water-soluble polymer, and the liquid medium prepared in the preparing step and aggregating the aerogel particles to obtain a coating liquid containing aggregates of the aerogel particles, the water-soluble polymer, and the liquid medium.