Patents by Inventor Kei-Yi Wei

Kei-Yi Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110206840
    Abstract: A powder adhesive comprising a primary rubber bonding polymer and a thermosetting component, and a method for bonding elastomers to metals employing the same. By adding a thermosetting component to a powdered adhesive, the adhesive may be applied to a substrate, sintered and thermoset to provide a sweep resistant adhesive film on the substrate, which may subsequently be bonded to an elastomer. Without a thermosetting component, the adhesive is at risk to re-melt or otherwise soften during a heated elastomer molding operation which in turn could cause the adhesive material to sweep off the substrate.
    Type: Application
    Filed: November 9, 2009
    Publication date: August 25, 2011
    Inventors: James R. Halladay, Kei-Yi Wei, Kirk J. Abbey
  • Publication number: 20090130469
    Abstract: A powder adhesive composition for bonding an elastomer to metals or other rigid substrates comprising a powdered film forming polymer having a liquefaction temperature above room temperature and is capable of forming rubber tearing bonds between an elastomer and a substrate. The adhesive composition is shelf stable and free flowing at room temperature to allow for ease of storage and electrostatic spray application, yet melts or flows at elevated temperatures to form a film on a coated substrate prior to elastomer bonding.
    Type: Application
    Filed: May 23, 2008
    Publication date: May 21, 2009
    Inventors: KEI-YI WEI, Kirk J. Abbey, James Halladay
  • Publication number: 20050277732
    Abstract: A two-component coating composition that includes (A) a first component containing an acid functional aliphatic polyester polyol having an acid number of at least 20 mg KOH/g and a hydroxyl number of from 50 to 500 mg KOH/g, and (B) a second component comprising one or more polyisocyanates. The composition can be used to coat metal substrates by (i) mixing components (A) and (B) in the above-described composition to form a mixture; and (ii) applying the mixture to a surface of a metal substrate.
    Type: Application
    Filed: June 14, 2004
    Publication date: December 15, 2005
    Inventors: Poli Yu, Richard Roesler, Kei-Yi Wei, Sylvie Horgan
  • Patent number: 5102977
    Abstract: A hydroxyl functional polyester suitable for use in powder coating formulations and bearing sulfonate salt groups, its preparation, and its use in powder coating formulations with methoxyalkylene amino group bearing curatives are described. These polyester resins preferably have 200.degree. C. ICI cone and plate viscosities between about 10 and 90 Poise, have DSC determined glass transition temperatures of at least about 40.degree. C., have hydroxyl numbers between about 10 and 60, and have a sulfonate salt group content between about 0.25 and 4 weight percent. They are preferably synthesized by esterification or transesterification utilizing a sulfonate salt group bearing reactant such as 5-sodium sulfo isophthalic acid. The sulfonate salt groups, preferably alkali metal salt groups, serve to catalyze the curing reaction between the resin and the curative.
    Type: Grant
    Filed: January 18, 1990
    Date of Patent: April 7, 1992
    Assignee: Ruco Polymer Corporation
    Inventors: John J. McLafferty, Kei-Yi Wei