Patents by Inventor Keichi Okabe

Keichi Okabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Production method for silicon wafer and soi wafer, and soi wafer
    Publication number: 20030008478
    Abstract: There are provided a method for manufacturing a mirror polished wafer with little polishing sag (peripheral sag) by a relatively easy method, a method for manufacturing a bonded wafer having an SOI layer or a bond layer which has no periphery removing region or reduces it, and a bonded wafer thereof.
    Type: Application
    Filed: November 28, 2001
    Publication date: January 9, 2003
    Inventors: Takao Abe, Tokio Takei, Keichi Okabe, Hajime Miyajima