Patents by Inventor Keigo Asano

Keigo Asano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230101718
    Abstract: A three-dimensional shape measurement system includes an image pickup unit, a storage device that stores image pickup conditions required in imaging for measurement as condition information for each of a plurality of combinations of the material and surface property of an object, and a measurement controller that controls driving of the image pickup unit. The measurement controller identifies the material and surface property of the object, specifies image pickup conditions corresponding to the identified material and surface property of the object based on the condition information, causes the image pickup unit to perform the imaging for measurement under the specified image pickup conditions, and measures the shape of the object based on the obtained image for measurement.
    Type: Application
    Filed: September 26, 2022
    Publication date: March 30, 2023
    Inventors: Shigemoto HIROTA, Akihito KATAOKA, Keigo ASANO, Masahiro MAEDA
  • Patent number: 6923632
    Abstract: An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a temperature higher than a temperature of an inner surface of the die set. The hold-member surface contacts the molten resin. The die-set inner surface is exposed in the cavity.
    Type: Grant
    Filed: September 19, 2001
    Date of Patent: August 2, 2005
    Assignee: Denso Corporation
    Inventors: Hiroshi Koyama, Tsutomu Onoue, Keigo Asano, Tadatsugu Nakamura, Izuru Shoji
  • Publication number: 20020017732
    Abstract: An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a temperature higher than a temperature of an inner surface of the die set. The hold-member surface contacts the molten resin. The die-set inner surface is exposed in the cavity.
    Type: Application
    Filed: September 19, 2001
    Publication date: February 14, 2002
    Applicant: NIPPONDENSO CO., LTD.
    Inventors: Hiroshi Koyama, Tsutomu Onoue, Keigo Asano, Tadatsugu Nakamura, Izuru Shoji
  • Patent number: 6309579
    Abstract: An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a temperature higher than a temperature of an inner surface of the die set. The hold-member surface contacts the molten resin. The die-set inner surface is exposed in the cavity.
    Type: Grant
    Filed: December 28, 1999
    Date of Patent: October 30, 2001
    Assignee: Nippondenso Co., Ltd.
    Inventors: Hiroshi Koyama, Tsutomu Onoue, Keigo Asano, Tadatsugu Nakamura, Izuru Shoji
  • Patent number: 6063321
    Abstract: An insert is held in a cavity within a die set by a movable hold member. Molten resin is injected into the cavity when the insert is held by the hold member. The hold member is separated from the insert at a given timing. A surface of the hold member is heated to a temperature higher than a temperature of an inner surface of the die set. The hold-member surface contacts the molten resin. The die-set inner surface is exposed in the cavity.
    Type: Grant
    Filed: May 17, 1996
    Date of Patent: May 16, 2000
    Assignee: Denso Corp.
    Inventors: Hiroshi Koyama, Tsutomu Onoue, Keigo Asano, Tadatsugu Nakamura, Izuru Shoji