Abstract: Provided is an electromagnetic wave transmitting heater that has excellent heating properties and is capable of suppressing an increase in a cross section of a heater wire. The electromagnetic wave transmitting heater includes a plurality of heater wires disposed at intervals to allow transmission of electromagnetic waves, a pair of lateral wires, one of the pair of lateral wires being coupled to one end of each of the heater wires, another one of the pair of lateral wires being coupled to another end of each of the heater wires, and a pair of coupling wires, one of the pair of coupling wires being coupled to one of the pair of lateral wires, another one of the pair of coupling wires being coupled to another one of the pair of lateral wires. The lateral wires each have a cross section larger than a cross section of each of the heater wires.

Abstract: A semiconductor apparatus capable of sufficiently securing adhesion between a lead frame and sealing resin body. The semiconductor apparatus includes a lead frame, semiconductor device bonded to a mounting surface of the lead frame, and sealing resin body that covers the surface of the semiconductor device and a surrounding region of the semiconductor device on the mounting surface, in which in the surrounding region, a plurality of circular concave portions is formed with a predetermined pitch in a plurality of rows so as to surround the semiconductor device, and when the pitch and depth of concave portions arranged in at least the innermost peripheral row of the rows that surround the semiconductor device are represented as P[?m] and H[?m],respectively, and the flexural modulus of elasticity of the sealing resin body is represented as E[GPa], the following Formulae (1) and (2) are satisfied: E[GPa]?20[GPa]??(1) 5?86.4?5.45×E[GPa]+0.