Patents by Inventor Keigo Kamoshita

Keigo Kamoshita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring board with built-in electronic component and method for manufacturing the same
    Patent number: 9723728
    Abstract: A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity, a conductive layer formed on the substrate and extending over the electronic component in the cavity, and a solder-resist layer formed on the conductive layer and having first and second openings such that the first openings are forming first pads including the conductive layer exposed by the first openings and that the second openings are forming second pads including the conductive layer exposed by the second openings. The second pads include portions of the conductive layer formed directly over the electronic component, respectively, and connected to the electronic component, the first pads include portions of the conductive layer formed on outer side with respect to the electronic component, respectively, and each second opening has an opening diameter which is formed smaller than an opening diameter of each first opening.
    Type: Grant
    Filed: August 4, 2015
    Date of Patent: August 1, 2017
    Assignee: IBIDEN CO., LTD.
    Inventors: Keisuke Shimizu, Makoto Terui, Ryojiro Tominaga, Keigo Kamoshita, Tsutomu Yamauchi
  • WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20160037647
    Abstract: A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity, a conductive layer formed on the substrate and extending over the electronic component in the cavity, and a solder-resist layer formed on the conductive layer and having first and second openings such that the first openings are forming first pads including the conductive layer exposed by the first openings and that the second openings are forming second pads including the conductive layer exposed by the second openings. The second pads include portions of the conductive layer formed directly over the electronic component, respectively, and connected to the electronic component, the first pads include portions of the conductive layer formed on outer side with respect to the electronic component, respectively, and each second opening has an opening diameter which is formed smaller than an opening diameter of each first opening.
    Type: Application
    Filed: August 4, 2015
    Publication date: February 4, 2016
    Applicant: IBIDEN CO., LTD.
    Inventors: Keisuke Shimizu, Makoto Terui, Ryojiro Tominaga, Keigo Kamoshita, Tsutomu Yamauchi