Patents by Inventor Keigo Oomori

Keigo Oomori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Organic film forming apparatus
    Patent number: 11906246
    Abstract: According to one embodiment, an organic film forming apparatus includes a chamber configured to maintain an atmosphere more reduced than an atmospheric pressure, at least one processing room provided inside the chamber and being surrounded by a cover, and an exhaust part configured to exhaust the inside the chamber. The processing room includes an upper heating part including first heaters, a lower heating part including second heaters, and facing the upper heating part, an upper heat equalizing plate provided on the lower heating part side of the upper heating part, a lower heat equalizing plate provided on the upper heating part side of the lower heating part, and workpiece supporters configured to support a workpiece through a gap between the upper and lower heat equalizing plates.
    Type: Grant
    Filed: June 12, 2020
    Date of Patent: February 20, 2024
    Assignee: SHIBAURA MECHATRONICS CORPORATION
    Inventors: Yukinobu Nishibe, Akinori Iso, Keigo Oomori, Takashi Takahashi
  • ORGANIC FILM FORMING APPARATUS
    Publication number: 20200310183
    Abstract: According to one embodiment, an organic film forming apparatus includes a chamber configured to maintain an atmosphere more reduced than an atmospheric pressure, at least one processing room provided inside the chamber and being surrounded by a cover, and an exhaust part configured to exhaust the inside the chamber. The processing room includes an upper heating part including first heaters, a lower heating part including second heaters, and facing the upper heating part, an upper heat equalizing plate provided on the lower heating part side of the upper heating part, a lower heat equalizing plate provided on the upper heating part side of the lower heating part, and workpiece supporters configured to support a workpiece through a gap between the upper and lower heat equalizing plates.
    Type: Application
    Filed: June 12, 2020
    Publication date: October 1, 2020
    Inventors: Yukinobu Nishibe, Akinori Iso, Keigo Oomori, Takashi Takahashi