Patents by Inventor Keigo OOWASHI
Keigo OOWASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11884039Abstract: Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness. The insulating sheet according to the present invention contains a thermosetting component and a thermally conductive filler, the thermally conductive filler contains boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first content of the boron nitride in 100% by volume of a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second content of the boron nitride in 100% by volume of a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.Type: GrantFiled: May 9, 2018Date of Patent: January 30, 2024Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Masataka Sugimoto, Keigo Oowashi, Kouji Ashiba, Yuko Kawahara
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Patent number: 11827766Abstract: Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and further effectively controlling the variation in dielectric breakdown strength, and further effectively increasing the adhesion. A resin material according to the present invention includes first inorganic particles, second inorganic particles, and a binder resin, and a ratio of a compressive strength at 10% compression of the first inorganic particles to a compressive strength at 10% compression of the second inorganic particles is 2.5 or more, the second inorganic particles have a compressive strength at 10% compression of 1.5 N/mm2 or less, and the second inorganic particles include primary particles having an aspect ratio of 7 or less.Type: GrantFiled: January 29, 2018Date of Patent: November 28, 2023Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Masataka Sugimoto
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Patent number: 11798863Abstract: The problem to be solved by the invention is to provide a laminate capable of effectively enhancing thermal conductivity and adhesiveness, in spite of the relatively large thickness of a patterned metal layer. The laminate (1) according to the present invention includes a metal substrate (4), an insulating layer (2) laminated on one surface of the metal substrate (4), and a patterned metal layer (3) laminated on the surface of the insulating layer (2) on the side opposite to the metal substrate (4), the metal layer (3) is 300 ?m or more in thickness, and the insulating layer (2) includes boron nitride (12) and an inorganic filler (13) other than boron nitride.Type: GrantFiled: December 7, 2018Date of Patent: October 24, 2023Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Kouji Ashiba, Keigo Oowashi, Aki Koukami, Rui Zhang
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Patent number: 11548264Abstract: An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.Type: GrantFiled: April 17, 2019Date of Patent: January 10, 2023Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Rui Zhang, Keigo Oowashi, Kouji Ashiba, Aki Kouma, Shohei Mizuno
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Patent number: 11492528Abstract: Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.Type: GrantFiled: June 21, 2018Date of Patent: November 8, 2022Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Rui Zhang, Osamu Inui, Hiroshi Maenaka
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Patent number: 11479716Abstract: A light-modulating material of which the light transmittance can be controlled over a wide region from visible light to infrared light by voltage application is provided. The light-modulating material comprises a graphene-like carbon material having an aspect ratio of 3 or more and 330 or less.Type: GrantFiled: July 21, 2017Date of Patent: October 25, 2022Assignees: SEKISUI CHEMICAL CO., LTD., HIROSHIMA UNIVERSITYInventors: Rende Sun, Akira Nakasuga, Shoji Nozato, Keigo Oowashi, Hiroji Fukui, Takeharu Haino, Ryo Sekiya
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Patent number: 11459443Abstract: Provided is a resin material capable of effectively enhancing insulation properties, adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.90 or less, second inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.95 or more, third inorganic particles having an average aspect ratio of more than 2, and a binder resin.Type: GrantFiled: June 21, 2018Date of Patent: October 4, 2022Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Rui Zhang, Kazuyuki Yahara, Osamu Inui, Hiroshi Maenaka
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Patent number: 11383500Abstract: Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing generation of voids. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average major diameter of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average major diameter of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.Type: GrantFiled: May 9, 2018Date of Patent: July 12, 2022Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Masataka Sugimoto, Keigo Oowashi, Kouji Ashiba, Yuko Kawahara
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Patent number: 11383499Abstract: Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing variation in the adhesiveness. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average aspect ratio of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average aspect ratio of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.Type: GrantFiled: May 9, 2018Date of Patent: July 12, 2022Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Masataka Sugimoto, Keigo Oowashi, Kouji Ashiba, Yuko Kawahara
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Patent number: 11168216Abstract: Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and effectively controlling the variation in dielectric breakdown strength. A resin material according to the present invention includes first boron nitride aggregate particles, second boron nitride aggregate particles, and a binder resin, and a 10% K value of the second boron nitride aggregate particles is smaller than a 30% K value of the second boron nitride aggregate particles, and a 30% K value of the second boron nitride aggregate particles is smaller than a 10% K value of the first boron nitride aggregate particles.Type: GrantFiled: January 29, 2018Date of Patent: November 9, 2021Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Masataka Sugimoto
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Publication number: 20210168972Abstract: A heat conductive sheet having excellent heat conductivity in the thickness direction is provided. A heat conductive sheet (1) comprises a first carbon material having a graphene laminated structure (2), orientation-controlling particles (3), and a first resin (4), wherein at least a part of the first carbon material (2) is oriented in a direction different from the surface direction of the heat conductive sheet (1) due to the presence of the orientation-controlling particles (3), and the ratio of the average particle diameter of the first carbon material (2) to the average particle diameter of the orientation-controlling particles (3) (the first carbon material (2)/the orientation-controlling particles (3)) is 0.09 or more and less than 4.0.Type: ApplicationFiled: December 10, 2018Publication date: June 3, 2021Inventors: Kouji Ashiba, Keigo Oowashi, Shoji Nozato, Makoto Takafuji, Hirotaka Ihara
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Publication number: 20210139761Abstract: Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.Type: ApplicationFiled: June 21, 2018Publication date: May 13, 2021Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Rui Zhang, Osamu Inui, Hiroshi Maenaka
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Publication number: 20210008839Abstract: An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.Type: ApplicationFiled: April 17, 2019Publication date: January 14, 2021Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Rui ZHANG, Keigo OOWASHI, Kouji ASHIBA, Aki KOUMA, Shohei MIZUNO
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Publication number: 20200388551Abstract: The problem to be solved by the invention is to provide a laminate capable of effectively enhancing thermal conductivity and adhesiveness, in spite of the relatively large thickness of a patterned metal layer. The laminate (1) according to the present invention includes a metal substrate (4), an insulating layer (2) laminated on one surface of the metal substrate (4), and a patterned metal layer (3) laminated on the surface of the insulating layer (2) on the side opposite to the metal substrate (4), the metal layer (3) is 300 ?m or more in thickness, and the insulating layer (2) includes boron nitride (12) and an inorganic filler (13) other than boron nitride.Type: ApplicationFiled: December 7, 2018Publication date: December 10, 2020Applicant: SEKISUI CHEMICAL CO., LTD.Inventors: Kouji ASHIBA, Keigo OOWASHI, Aki KOUKAMI, Rui ZHANG
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Publication number: 20200385543Abstract: Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and further effectively controlling the variation in dielectric breakdown strength, and further effectively increasing the adhesion. A resin material according to the present invention includes first inorganic particles, second inorganic particles, and a binder resin, and a ratio of a compressive strength at 10% compression of the first inorganic particles to a compressive strength at 10% compression of the second inorganic particles is 2.5 or more, the second inorganic particles have a compressive strength at 10% compression of 1.5 N/mm2 or less, and the second inorganic particles include primary particles having an aspect ratio of 7 or less.Type: ApplicationFiled: January 29, 2018Publication date: December 10, 2020Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Masataka Sugimoto
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Publication number: 20200216659Abstract: Provided is a resin material capable of effectively enhancing adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less, second inorganic particles having an average aspect ratio of more than 2, and a binder resin, an absolute value of a difference between an average particle diameter of the first inorganic particles and an average major diameter of the second inorganic particles is 10 ?m or less, the average particle diameter of the first inorganic particles is 1 ?m or more and less than 20 ?m, the average major diameter of the second inorganic particles is 2 ?m or more, and the content of the second inorganic particles is more than 40% by volume relative to 100% by volume of sum of the first inorganic particles and the second inorganic particles.Type: ApplicationFiled: June 21, 2018Publication date: July 9, 2020Inventors: Yuko KAWAHARA, Keigo OOWASHI, Kouji ASHIBA, Rui ZHANG, Osamu INUI, Hiroshi MAENAKA
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Publication number: 20200181358Abstract: Provided is a resin material capable of effectively enhancing insulation properties, adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.90 or less, second inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.95 or more, third inorganic particles having an average aspect ratio of more than 2, and a binder resin.Type: ApplicationFiled: June 21, 2018Publication date: June 11, 2020Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Rui Zhang, Kazuyuki Yahara, Osamu Inui, Hiroshi Maenaka
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Patent number: 10647912Abstract: A carbon-coated vanadium dioxide particle includes a vanadium dioxide particle; and a coating layer containing amorphous carbon on a surface of the vanadium dioxide particle, the amorphous carbon being derived from carbon contained in an oxazine resin, and having a peak intensity ratio of a G band to a band of 1.5 or greater as determined from a Raman spectrum. The coating layer has an average thickness of 50 nm or less. The coating layer has a coefficient of variation (CV value) of thickness of 7% or less.Type: GrantFiled: March 22, 2017Date of Patent: May 12, 2020Assignee: SEKISUI CHEMICAL CO., LTD.Inventors: Ren-de Sun, Shoji Nozato, Akira Nakasuga, Masanori Nakamura, Naoyuki Nagatani, Keigo Oowashi
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Publication number: 20200123428Abstract: Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness. The insulating sheet according to the present invention contains a thermosetting component and a thermally conductive filler, the thermally conductive filler contains boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first content of the boron nitride in 100% by volume of a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second content of the boron nitride in 100% by volume of a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.Type: ApplicationFiled: May 9, 2018Publication date: April 23, 2020Inventors: Masataka Sugimoto, Keigo Oowashi, Kouji Ashiba, Yuko Kawahara
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Publication number: 20200090831Abstract: Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing generation of voids. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average major diameter of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average major diameter of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.Type: ApplicationFiled: May 9, 2018Publication date: March 19, 2020Inventors: Masataka Sugimoto, Keigo Oowashi, Kouji Ashiba, Yuko Kawahara