Patents by Inventor Keigo OOWASHI

Keigo OOWASHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11884039
    Abstract: Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness. The insulating sheet according to the present invention contains a thermosetting component and a thermally conductive filler, the thermally conductive filler contains boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first content of the boron nitride in 100% by volume of a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second content of the boron nitride in 100% by volume of a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: January 30, 2024
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Masataka Sugimoto, Keigo Oowashi, Kouji Ashiba, Yuko Kawahara
  • Patent number: 11827766
    Abstract: Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and further effectively controlling the variation in dielectric breakdown strength, and further effectively increasing the adhesion. A resin material according to the present invention includes first inorganic particles, second inorganic particles, and a binder resin, and a ratio of a compressive strength at 10% compression of the first inorganic particles to a compressive strength at 10% compression of the second inorganic particles is 2.5 or more, the second inorganic particles have a compressive strength at 10% compression of 1.5 N/mm2 or less, and the second inorganic particles include primary particles having an aspect ratio of 7 or less.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: November 28, 2023
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Masataka Sugimoto
  • Patent number: 11798863
    Abstract: The problem to be solved by the invention is to provide a laminate capable of effectively enhancing thermal conductivity and adhesiveness, in spite of the relatively large thickness of a patterned metal layer. The laminate (1) according to the present invention includes a metal substrate (4), an insulating layer (2) laminated on one surface of the metal substrate (4), and a patterned metal layer (3) laminated on the surface of the insulating layer (2) on the side opposite to the metal substrate (4), the metal layer (3) is 300 ?m or more in thickness, and the insulating layer (2) includes boron nitride (12) and an inorganic filler (13) other than boron nitride.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: October 24, 2023
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Kouji Ashiba, Keigo Oowashi, Aki Koukami, Rui Zhang
  • Patent number: 11548264
    Abstract: An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: January 10, 2023
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Rui Zhang, Keigo Oowashi, Kouji Ashiba, Aki Kouma, Shohei Mizuno
  • Patent number: 11492528
    Abstract: Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: November 8, 2022
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Rui Zhang, Osamu Inui, Hiroshi Maenaka
  • Patent number: 11479716
    Abstract: A light-modulating material of which the light transmittance can be controlled over a wide region from visible light to infrared light by voltage application is provided. The light-modulating material comprises a graphene-like carbon material having an aspect ratio of 3 or more and 330 or less.
    Type: Grant
    Filed: July 21, 2017
    Date of Patent: October 25, 2022
    Assignees: SEKISUI CHEMICAL CO., LTD., HIROSHIMA UNIVERSITY
    Inventors: Rende Sun, Akira Nakasuga, Shoji Nozato, Keigo Oowashi, Hiroji Fukui, Takeharu Haino, Ryo Sekiya
  • Patent number: 11459443
    Abstract: Provided is a resin material capable of effectively enhancing insulation properties, adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.90 or less, second inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.95 or more, third inorganic particles having an average aspect ratio of more than 2, and a binder resin.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: October 4, 2022
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Rui Zhang, Kazuyuki Yahara, Osamu Inui, Hiroshi Maenaka
  • Patent number: 11383500
    Abstract: Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing generation of voids. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average major diameter of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average major diameter of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: July 12, 2022
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Masataka Sugimoto, Keigo Oowashi, Kouji Ashiba, Yuko Kawahara
  • Patent number: 11383499
    Abstract: Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing variation in the adhesiveness. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average aspect ratio of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average aspect ratio of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.
    Type: Grant
    Filed: May 9, 2018
    Date of Patent: July 12, 2022
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Masataka Sugimoto, Keigo Oowashi, Kouji Ashiba, Yuko Kawahara
  • Patent number: 11168216
    Abstract: Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and effectively controlling the variation in dielectric breakdown strength. A resin material according to the present invention includes first boron nitride aggregate particles, second boron nitride aggregate particles, and a binder resin, and a 10% K value of the second boron nitride aggregate particles is smaller than a 30% K value of the second boron nitride aggregate particles, and a 30% K value of the second boron nitride aggregate particles is smaller than a 10% K value of the first boron nitride aggregate particles.
    Type: Grant
    Filed: January 29, 2018
    Date of Patent: November 9, 2021
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Masataka Sugimoto
  • Publication number: 20210168972
    Abstract: A heat conductive sheet having excellent heat conductivity in the thickness direction is provided. A heat conductive sheet (1) comprises a first carbon material having a graphene laminated structure (2), orientation-controlling particles (3), and a first resin (4), wherein at least a part of the first carbon material (2) is oriented in a direction different from the surface direction of the heat conductive sheet (1) due to the presence of the orientation-controlling particles (3), and the ratio of the average particle diameter of the first carbon material (2) to the average particle diameter of the orientation-controlling particles (3) (the first carbon material (2)/the orientation-controlling particles (3)) is 0.09 or more and less than 4.0.
    Type: Application
    Filed: December 10, 2018
    Publication date: June 3, 2021
    Inventors: Kouji Ashiba, Keigo Oowashi, Shoji Nozato, Makoto Takafuji, Hirotaka Ihara
  • Publication number: 20210139761
    Abstract: Provided is a heat dissipation sheet capable of effectively enhancing adhesiveness and long-term insulation reliability. The heat dissipation sheet according to the present invention contains first inorganic particles having an aspect ratio of 2 or less, second inorganic particles having an aspect ratio of more than 2, and a binder resin. In this heat dissipation sheet, a content of the second inorganic particles is larger than a content of the first inorganic particles in 100% by volume of a region having a thickness of 15% on a first surface side in a thickness direction, and the content of the first inorganic particles in 100% by volume of the region having a thickness of 15% is larger than the content of the first inorganic particles in 100% by volume of a central region having a thickness of 70%.
    Type: Application
    Filed: June 21, 2018
    Publication date: May 13, 2021
    Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Rui Zhang, Osamu Inui, Hiroshi Maenaka
  • Publication number: 20210008839
    Abstract: An electrical insulation sheet comprising a resin composition layer, wherein one surface side has a higher relative permittivity at a frequency of 1 MHz than the relative permittivity of an other surface side, and a circuit pattern is formed on the one surface side, a laminated body comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein a circuit pattern is formed on the metal plate, and a substrate comprising the electrical insulation sheet and a metal plate on a metal base plate in that order, wherein the metal plate has a circuit pattern.
    Type: Application
    Filed: April 17, 2019
    Publication date: January 14, 2021
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Rui ZHANG, Keigo OOWASHI, Kouji ASHIBA, Aki KOUMA, Shohei MIZUNO
  • Publication number: 20200388551
    Abstract: The problem to be solved by the invention is to provide a laminate capable of effectively enhancing thermal conductivity and adhesiveness, in spite of the relatively large thickness of a patterned metal layer. The laminate (1) according to the present invention includes a metal substrate (4), an insulating layer (2) laminated on one surface of the metal substrate (4), and a patterned metal layer (3) laminated on the surface of the insulating layer (2) on the side opposite to the metal substrate (4), the metal layer (3) is 300 ?m or more in thickness, and the insulating layer (2) includes boron nitride (12) and an inorganic filler (13) other than boron nitride.
    Type: Application
    Filed: December 7, 2018
    Publication date: December 10, 2020
    Applicant: SEKISUI CHEMICAL CO., LTD.
    Inventors: Kouji ASHIBA, Keigo OOWASHI, Aki KOUKAMI, Rui ZHANG
  • Publication number: 20200385543
    Abstract: Provided is a resin material capable of effectively improving the insulating properties and the thermal conductivity, and further effectively controlling the variation in dielectric breakdown strength, and further effectively increasing the adhesion. A resin material according to the present invention includes first inorganic particles, second inorganic particles, and a binder resin, and a ratio of a compressive strength at 10% compression of the first inorganic particles to a compressive strength at 10% compression of the second inorganic particles is 2.5 or more, the second inorganic particles have a compressive strength at 10% compression of 1.5 N/mm2 or less, and the second inorganic particles include primary particles having an aspect ratio of 7 or less.
    Type: Application
    Filed: January 29, 2018
    Publication date: December 10, 2020
    Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Masataka Sugimoto
  • Publication number: 20200216659
    Abstract: Provided is a resin material capable of effectively enhancing adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less, second inorganic particles having an average aspect ratio of more than 2, and a binder resin, an absolute value of a difference between an average particle diameter of the first inorganic particles and an average major diameter of the second inorganic particles is 10 ?m or less, the average particle diameter of the first inorganic particles is 1 ?m or more and less than 20 ?m, the average major diameter of the second inorganic particles is 2 ?m or more, and the content of the second inorganic particles is more than 40% by volume relative to 100% by volume of sum of the first inorganic particles and the second inorganic particles.
    Type: Application
    Filed: June 21, 2018
    Publication date: July 9, 2020
    Inventors: Yuko KAWAHARA, Keigo OOWASHI, Kouji ASHIBA, Rui ZHANG, Osamu INUI, Hiroshi MAENAKA
  • Publication number: 20200181358
    Abstract: Provided is a resin material capable of effectively enhancing insulation properties, adhesiveness and long-term insulation reliability. The resin material according to the present invention contains first inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.90 or less, second inorganic particles having an average aspect ratio of 2 or less and an average circularity of 0.95 or more, third inorganic particles having an average aspect ratio of more than 2, and a binder resin.
    Type: Application
    Filed: June 21, 2018
    Publication date: June 11, 2020
    Inventors: Yuko Kawahara, Keigo Oowashi, Kouji Ashiba, Rui Zhang, Kazuyuki Yahara, Osamu Inui, Hiroshi Maenaka
  • Patent number: 10647912
    Abstract: A carbon-coated vanadium dioxide particle includes a vanadium dioxide particle; and a coating layer containing amorphous carbon on a surface of the vanadium dioxide particle, the amorphous carbon being derived from carbon contained in an oxazine resin, and having a peak intensity ratio of a G band to a band of 1.5 or greater as determined from a Raman spectrum. The coating layer has an average thickness of 50 nm or less. The coating layer has a coefficient of variation (CV value) of thickness of 7% or less.
    Type: Grant
    Filed: March 22, 2017
    Date of Patent: May 12, 2020
    Assignee: SEKISUI CHEMICAL CO., LTD.
    Inventors: Ren-de Sun, Shoji Nozato, Akira Nakasuga, Masanori Nakamura, Naoyuki Nagatani, Keigo Oowashi
  • Publication number: 20200123428
    Abstract: Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness. The insulating sheet according to the present invention contains a thermosetting component and a thermally conductive filler, the thermally conductive filler contains boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first content of the boron nitride in 100% by volume of a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second content of the boron nitride in 100% by volume of a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.
    Type: Application
    Filed: May 9, 2018
    Publication date: April 23, 2020
    Inventors: Masataka Sugimoto, Keigo Oowashi, Kouji Ashiba, Yuko Kawahara
  • Publication number: 20200090831
    Abstract: Provided is an insulating sheet capable of effectively enhancing thermal conduction and adhesiveness and effectively suppressing generation of voids. The insulating sheet according to the present invention contains a thermosetting component and boron nitride, the insulating sheet has a first surface on one side in a thickness direction and a second surface on the other side in the thickness direction, and a first average major diameter of the boron nitride in a region having a thickness of 10% of a thickness of the sheet, from the first surface toward the second surface is smaller than a second average major diameter of the boron nitride in a region having a thickness of 90% of a thickness of the sheet, from the second surface toward the first surface.
    Type: Application
    Filed: May 9, 2018
    Publication date: March 19, 2020
    Inventors: Masataka Sugimoto, Keigo Oowashi, Kouji Ashiba, Yuko Kawahara