Patents by Inventor Keigo Sato
Keigo Sato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978480Abstract: There is provided an optical disc drive that can maintain contact between an optical disc and a conveying roller, while allowing the number of components to be reduced. A conveying roller includes a right roller that is rotatable around an axis and a left roller that is rotatable around an axis. The right roller portion and the left roller portion are arranged in a lateral direction. One of a right end portion of the right roller portion and a left end portion of the left roller portion is movable in an up-down direction relative to the other of the right end portion of the right roller portion and the left end portion of the left roller portion, with a relative position between the axis and the axis unchanged.Type: GrantFiled: March 18, 2021Date of Patent: May 7, 2024Assignee: Sony Interactive Entertainment Inc.Inventors: Aki Yoguchi, Keigo Sato
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Publication number: 20240137628Abstract: The load port includes a FOUP configured to accommodate a plurality of substrates in multiple stages, cameras configured to image each of the substrates accommodated in the FOUP and including a low-magnification camera with a wide horizontal angle of view and a high-magnification camera with a narrow horizontal angle of view, and a CPU configured to detect the accommodation state of each of the substrates based on the imaging data acquired from the low-magnification camera and the high-magnification camera, respectively.Type: ApplicationFiled: October 16, 2023Publication date: April 25, 2024Inventors: Keigo Sato, Yuji Miyashita, Katsumi Yasuda
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Publication number: 20240092337Abstract: A vehicle control apparatus includes front-wheel and rear-wheel driving systems, and a control system. The front-wheel driving system includes a first travel motor mechanically coupled to a front wheel of a vehicle and a first accumulator electrically coupled to the first travel motor. The rear-wheel driving system includes a second travel motor mechanically coupled to a rear wheel of the vehicle and a second accumulator electrically coupled to the second travel motor. The control system includes one or more processors and one or more memories communicably coupled to the one or more processors, and controls the first and second travel motors. When a difference between an SOC of the first accumulator and an SOC of the second accumulator is greater than a threshold value, the one or more processors change a torque distribution ratio between the first and second travel motors from a reference distribution ratio.Type: ApplicationFiled: September 13, 2023Publication date: March 21, 2024Inventors: Hiroshi KUSANO, Yoshinobu YAMAZAKI, Masami OGURI, Akihiro NABESHIMA, Yoshiyuki JIN, Takeshi YONEDA, Fumiya SATO, Keigo YAMADA, Takumi ARAKI, Shuntaro MIURA
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Patent number: 11926285Abstract: A remote communication system includes a portable device; and a fixed system. The fixed system includes main communication modules; and a position estimating unit configured to estimate a position of the portable device, based on an incident angle of a signal from the portable device, upon detecting the signal by antennas provided in the main communication modules. When there are two main communication modules for which the incident angle is known, the position of the portable device is estimated based on the incident angle. When there is one main communication module for which the incident angle is known, the position of the portable device is estimated based on the incident angle and a received radio wave intensity of the signal. When there is no main communication module for which the incident angle is known, the position of the portable device is estimated based on the received radio wave intensity.Type: GrantFiled: July 27, 2021Date of Patent: March 12, 2024Assignee: ALPS ALPINE CO., LTD.Inventors: Yoshihisa Kishimoto, Keigo Wakana, Daisuke Takai, Yukimitsu Yamada, Mitsuharu Nakasato, Kazuma Sato
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Publication number: 20230154495Abstract: There is provided an optical disc drive that can maintain contact between an optical disc and a conveying roller, while allowing the number of components to be reduced. A conveying roller includes a right roller that is rotatable around an axis and a left roller that is rotatable around an axis. The right roller portion and the left roller portion are arranged in a lateral direction. One of a right end portion of the right roller portion and a left end portion of the left roller portion is movable in an up-down direction relative to the other of the right end portion of the right roller portion and the left end portion of the left roller portion, with a relative position between the axis and the axis unchanged.Type: ApplicationFiled: March 18, 2021Publication date: May 18, 2023Applicant: Sony Interactive Entertainment Inc.Inventors: Aki YOGUCHI, Keigo SATO
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Patent number: 11014430Abstract: A refrigeration cycle device has a compressor, a radiator, a decompressor, an evaporator, a heat medium cooling evaporator, a cooling target device, a detector, and a controller. The heat medium cooling evaporator cools a cooling heat medium by performing a heat exchange between the refrigerant decompressed in the decompressor and the cooling heat medium. The cooling heat medium cools the cooling target device. The detector detects a subcooling state of the cooling target device having a temperature lower than or equal to a reference temperature. Upon the detection of the subcooling state in the cooling target device by the detector, the controller increases the degree of superheat of the refrigerant flowing out of the heat medium cooling heat exchanger as compared to the degree of superheat of the refrigerant flowing out of the heat medium cooling heat exchanger when the detector does not detect the subcooling state.Type: GrantFiled: February 26, 2019Date of Patent: May 25, 2021Assignee: DENSO CORPORATIONInventors: Koji Miura, Yoshiki Kato, Masayuki Takeuchi, Nobuyuki Hashimura, Keigo Sato, Norihiko Enomoto, Kengo Sugimura, Ariel Marasigan
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Patent number: 10989447Abstract: A refrigeration cycle device includes a compressor, a condenser, a first decompressor, an outside heat exchanger, and an evaporator. A predetermined part of a refrigerant passage from the condenser to the first decompressor through which the refrigerant flows is a condenser outlet portion. A predetermined part of a refrigerant passage from the first decompressor to the outside heat exchanger through which the refrigerant flows is an outside heat exchanger inlet portion. A predetermined part of a refrigerant passage from the outside heat exchanger to the second decompressor through which the refrigerant flows is an outside heat exchanger outlet portion. A volume capacity of the condenser outlet portion is larger than a volume capacity of the outside heat exchanger inlet portion. According to the refrigeration cycle device, preferable coefficient of performance of cycle can be achieved in different operation modes.Type: GrantFiled: January 24, 2019Date of Patent: April 27, 2021Assignee: DENSO CORPORATIONInventors: Koji Miura, Yoshiki Kato, Masayuki Takeuchi, Nobuyuki Hashimura, Keigo Sato, Norihiko Enomoto, Kengo Sugimura, Ariel Marasigan
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Patent number: 10993322Abstract: A circuit board includes: an insulating layer having at least a part formed of an insulating resin; and an electrode pad embedded in the insulating layer and having a neck formed on an outer side surface, the neck being held in contact with the insulating resin of the insulating layer. The electrode pad includes: a first conductor layer having an end surface exposed from one surface of the insulating layer; and a second conductor layer formed on the first conductor layer and having a grain boundary density different from a grain boundary density of the first conductor layer. The neck is formed in a region of the outer side surface, the region corresponding to a boundary part between the first conductor layer and the second conductor layer.Type: GrantFiled: April 20, 2020Date of Patent: April 27, 2021Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Keigo Sato, Hiroshi Taneda, Noriyoshi Shimizu
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Patent number: 10837348Abstract: A thermal management device for a vehicle includes heat medium circuits, a reserve tank, and a connector. The heat medium circulates through the heat medium circuits separately. The reserve tank is configured to separate an air bubble contained in the heat medium from the heat medium. The connector allows the reserve tank to come in communication with the heat medium circuits selectively. As such, an occurrence of the heat loss in the degassing performed in the reserve tank can be suppressed with the thermal management device for a vehicle including the heat medium circuits.Type: GrantFiled: January 27, 2017Date of Patent: November 17, 2020Assignee: DENSO CORPORATIONInventors: Norihiko Enomoto, Yoshiki Kato, Nobuyuki Hashimura, Kengo Sugimura, Koji Miura, Keigo Sato, Ariel Marasigan
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Publication number: 20200344879Abstract: A circuit board includes: an insulating layer having at least a part formed of an insulating resin; and an electrode pad embedded in the insulating layer and having a neck formed on an outer side surface, the neck being held in contact with the insulating resin of the insulating layer. The electrode pad includes: a first conductor layer having an end surface exposed from one surface of the insulating layer; and a second conductor layer formed on the first conductor layer and having a grain boundary density different from a grain boundary density of the first conductor layer. The neck is formed in a region of the outer side surface, the region corresponding to a boundary part between the first conductor layer and the second conductor layer.Type: ApplicationFiled: April 20, 2020Publication date: October 29, 2020Inventors: Keigo Sato, Hiroshi Taneda, Noriyoshi Shimizu
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Patent number: 10752089Abstract: An air conditioner is provided with: a refrigeration cycle including a subcooling heat exchanger that subcools a refrigerant having heat-dissipated in a high-pressure side heat exchanger by exchanging heat with a heat medium; a blower that blows the air to an air passage in an air-conditioning casing; an air cooler disposed in the air passage to cool the air; a heater core disposed on an air flow downstream side of the air cooler in the air passage to heat the air cooled by the air cooler; an auxiliary air heater disposed on the air flow downstream side of the air cooler and on an air flow upstream side of the air heater in the air passage, to heat the air cooled by the air cooler by exchanging heat with the heat medium; and a flow-rate adjustment portion configured to adjust a flow rate of the heat medium circulating between the subcooling heat exchanger and the auxiliary air heater.Type: GrantFiled: February 13, 2017Date of Patent: August 25, 2020Assignee: DENSO CORPORATIONInventors: Keigo Sato, Yoshiki Kato, Masayuki Takeuchi
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Patent number: 10723203Abstract: A refrigeration cycle device includes: a first expansion valve that decompresses a refrigerant flowing out of a high-pressure side heat exchanger; an exterior heat exchanger that exchanges heat between the refrigerant flowing out of the first expansion valve and outside air; a second expansion valve that decompresses the refrigerant flowing out of the exterior heat exchanger; a low-pressure side heat exchanger arranged in series with the exterior heat exchanger; a cooler core that exchanges heat between the heat medium cooled by the low-pressure side heat exchanger and air to be blown into a vehicle interior to cool the air; and a controller configured to switch between a heat absorption mode and a heat dissipation mode by adjusting an amount of decompression in each of the first expansion valve and the second expansion valve.Type: GrantFiled: October 6, 2016Date of Patent: July 28, 2020Assignee: DENSO CORPORATIONInventors: Yoshiki Kato, Nobuyuki Hashimura, Koji Miura, Norihiko Enomoto, Kengo Sugimura, Keigo Sato, Masayuki Takeuchi, Ariel Marasigan
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Patent number: 10723199Abstract: A vehicular heat management device includes a first heat source, a second heat source, a heater core, a first heat medium pathway, a second heat medium pathway, a heater core pathway, a switching portion, and a control unit. The first heat source is provided in the first heat medium pathway, and the second heat source is provided in the second heat medium pathway. The heater core is provided in the heater core pathway. The switching portion switches between flowing connection and flowing disconnection. The control unit performs at least one of a switching control and a second heat source control when a temperature of the heat medium of the heater core pathway is at or above a predetermined temperature. In the switching control, the switching portion connects the second heat medium pathway to the heater core pathway. In the second heat source control, the second heat source generates heat.Type: GrantFiled: September 6, 2016Date of Patent: July 28, 2020Assignees: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Yoshiki Kato, Masayuki Takeuchi, Keigo Sato, Koji Miura, Norihiko Enomoto, Kengo Sugimura, Ariel Marasigan, Ikuo Ozawa, Nobuharu Kakehashi, Yoshikazu Shinpo, Yoichi Onishi, Toshio Murata
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Patent number: 10717341Abstract: A vehicular heat management system includes a heat medium circuit, a heat source portion, and a device. A heat medium cooling an engine circulates in the heat medium circuit. The heat source portion heats the heat medium. The device is configured to function and heat the heat medium when the heat medium flowing into the device is at or above a predetermined temperature. When the engine is being warmed up, heat generated by the heat source portion is supplied to the device in preference to the engine. According to this, since the heat generated by the heat source portion is supplied to the device in preference to the engine when the engine is being warmed up, the engine can be warmed up early.Type: GrantFiled: August 25, 2016Date of Patent: July 21, 2020Assignee: DENSO CORPORATIONInventors: Kengo Sugimura, Yoshiki Kato, Masayuki Takeuchi, Keigo Sato, Koji Miura, Norihiko Enomoto, Ariel Marasigan, Nobuyuki Hashimura
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Patent number: 10593621Abstract: A semiconductor device includes an interconnect substrate, an interconnect trace disposed on an upper surface of the interconnect substrate, a semiconductor chip mounted on the upper surface of the interconnect substrate, an adhesive resin layer disposed between the upper surface of the interconnect substrate and a lower surface of the semiconductor chip to bond the interconnect substrate and the semiconductor chip, the adhesive resin layer including an opening at a bottom of which an upper surface of the interconnect trace is situated, a barrier layer covering a sidewall of the opening, and conductive paste disposed inside the opening, wherein an electrode terminal of the semiconductor chip situated at the lower surface thereof is disposed inside the opening, with the conductive paste filling a space between the barrier layer and the electrode terminal.Type: GrantFiled: September 21, 2018Date of Patent: March 17, 2020Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Keigo Sato, Hiroshi Taneda
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Patent number: 10522484Abstract: A wiring substrate includes a substrate body, a post formed on an upper surface of the substrate body, a thin film capacitor, and a first insulation layer covering the thin film capacitor and the post. The thin film capacitor includes a reference hole extending through the thin film capacitor in a thickness-wise direction. The post is inserted through the reference hole.Type: GrantFiled: May 1, 2018Date of Patent: December 31, 2019Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventor: Keigo Sato
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Patent number: 10400662Abstract: A vehicular heat management device includes a first heat source, a second heat source, a first heat generator, a second heat generator, a heat generator pathway, a first heat source pathway, a second heat source pathway, and a switching portion. The first heat source and the second heat source heat a heat medium. The first heat generator generates heat according to operation. The second heat generator generates heat according to operation. The first heat generator and the second heat generator are provided in the heat generator pathway. The first heat generator is provided in the first heat generator pathway. The second heat generator is provided in the second heat generator pathway. The switching portion switches between a condition where the heat generator pathway is in flowing communication with the first heat generator pathway and a condition where the heat generator pathway is in flowing communication with the second heat generator pathway.Type: GrantFiled: September 6, 2016Date of Patent: September 3, 2019Assignees: DENSO CORPORATION, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Norihiko Enomoto, Yoshiki Kato, Masayuki Takeuchi, Koji Miura, Keigo Sato, Kengo Sugimura, Nobuharu Kakehashi, Ikuo Ozawa, Ariel Marasigan, Yoshikazu Shinpo, Yoichi Onishi, Toshio Murata
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Publication number: 20190184790Abstract: A refrigeration cycle device has a compressor, a radiator, a decompressor, an evaporator, a heat medium cooling evaporator, a cooling target device, a detector, and a controller. The heat medium cooling evaporator cools a cooling heat medium by performing a heat exchange between the refrigerant decompressed in the decompressor and the cooling heat medium. The cooling heat medium cools the cooling target device. The detector detects a subcooling state of the cooling target device having a temperature lower than or equal to a reference temperature. Upon the detection of the subcooling state in the cooling target device by the detector, the controller increases the degree of superheat of the refrigerant flowing out of the heat medium cooling heat exchanger as compared to the degree of superheat of the refrigerant flowing out of the heat medium cooling heat exchanger when the detector does not detect the subcooling state.Type: ApplicationFiled: February 26, 2019Publication date: June 20, 2019Inventors: Koji MIURA, Yoshiki KATO, Masayuki TAKEUCHI, Nobuyuki HASHIMURA, Keigo SATO, Norihiko ENOMOTO, Kengo SUGIMURA, Ariel MARASIGAN
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Publication number: 20190154311Abstract: A refrigeration cycle device includes a compressor, a condenser, a first decompressor, an outside heat exchanger, and an evaporator. A predetermined part of a refrigerant passage from the condenser to the first decompressor through which the refrigerant flows is a condenser outlet portion. A predetermined part of a refrigerant passage from the first decompressor to the outside heat exchanger through which the refrigerant flows is an outside heat exchanger inlet portion. A predetermined part of a refrigerant passage from the outside heat exchanger to the second decompressor through which the refrigerant flows is an outside heat exchanger outlet portion. A volume capacity of the condenser outlet portion is larger than a volume capacity of the outside heat exchanger inlet portion. According to the refrigeration cycle device, preferable coefficient of performance of cycle can be achieved in different operation modes.Type: ApplicationFiled: January 24, 2019Publication date: May 23, 2019Inventors: Koji MIURA, Yoshiki KATO, Masayuki TAKEUCHI, Nobuyuki HASHIMURA, Keigo SATO, Norihiko ENOMOTO, Kengo SUGIMURA, Ariel MARASIGAN
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Publication number: 20190131236Abstract: A semiconductor device includes an interconnect substrate, an interconnect trace disposed on an upper surface of the interconnect substrate, a semiconductor chip mounted on the upper surface of the interconnect substrate, an adhesive resin layer disposed between the upper surface of the interconnect substrate and a lower surface of the semiconductor chip to bond the interconnect substrate and the semiconductor chip, the adhesive resin layer including an opening at a bottom of which an upper surface of the interconnect trace is situated, a barrier layer covering a sidewall of the opening, and conductive paste disposed inside the opening, wherein an electrode terminal of the semiconductor chip situated at the lower surface thereof is disposed inside the opening, with the conductive paste filling a space between the barrier layer and the electrode terminal.Type: ApplicationFiled: September 21, 2018Publication date: May 2, 2019Inventors: Keigo SATO, Hiroshi TANEDA