Patents by Inventor Keiichi Endoh
Keiichi Endoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160172328Abstract: A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.Type: ApplicationFiled: December 11, 2015Publication date: June 16, 2016Applicant: DOWA Electronics Materials Co., Ltd.Inventors: Keiichi ENDOH, Yutaka HISAEDA, Akihiro MIYAZAWA, Aiko NAGAHARA, Toshihiko UEYAMA
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Publication number: 20160136763Abstract: A bonding material of a silver paste includes: fine silver particles having an average primary particle diameter of 1 to 50 nanometers, each of the fine silver particles being coated with an organic compound having a carbon number of not greater than 8, such as hexanoic acid; silver particles having an average primary particle diameter of 0.5 to 4 micrometers, each of the silver particles being coated with an organic compound, such as oleic acid; a solvent containing 3 to 7% by weight of an alcohol and 0.3 to 1% by weight of a triol; a dispersant containing 0.5 to 2% by weight of an acid dispersant and 0.01 to 0.1% by weight of phosphate ester dispersant; and 0.01 to 0.Type: ApplicationFiled: June 19, 2014Publication date: May 19, 2016Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Keiichi Endoh, Minami Nagaoka, Satoru Kurita, Hiromasa Miyoshi, Yoshiko Kohno, Akihiro Miyazawa
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Publication number: 20160121435Abstract: A metal paste for joining includes aggregates of metal nanoparticles and a solvent, and an average particle size of the aggregates is 1 ?m or more.Type: ApplicationFiled: May 15, 2014Publication date: May 5, 2016Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Masashi FURUKAWA, Hiroomi KOBAYASHI, Yoshinori SHIBATA, Keisuke UCHIDA, Hiromasa MIYOSHI, Keiichi ENDOH, Satoru KURITA, Minami NAGAOKA
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Publication number: 20160101486Abstract: There is provided a metal nanoparticle dispersion which can be bonded at a lower temperature (for example, 200° C. or less), and enabling to obtain excellent mechanical properties and electric properties of the bonded portion, the metal nanoparticle dispersion, including: metal nanoparticles, with at least a part of a surface of each particle coated with amine A having 8 or more carbon atoms; and a dispersion medium for dispersing the metal nanoparticles, wherein the dispersion medium contains amine B which is primary, secondary, or tertiary amine having 7 or less carbon atoms, and which is linear alkyl amine or alkanol amine.Type: ApplicationFiled: April 25, 2014Publication date: April 14, 2016Inventors: Keiichi ENDOH, Hiromasa MIYOSHI, Takashi HINOTSU, Satoru KURITA, Yoshiko KOHNO
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Publication number: 20160099087Abstract: A bonded product is obtained by applying a silver paste containing silver nanoparticles having an average primary particle diameter of 1 to 200 nm, and performing firing. A diameter of a crystallite of the bonded product on a (111) plane of Ag when heated at 250° C. for 10 minutes in an inert atmosphere is 65 nm or larger.Type: ApplicationFiled: December 11, 2015Publication date: April 7, 2016Applicant: DOWA Electronics Materials Co., Ltd.Inventors: Keiichi ENDOH, Yutaka HISAEDA, Akihiro MIYAZAWA, Aiko NAGAHARA, Toshihiko UEYAMA
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Patent number: 9240256Abstract: A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300° C. or lower.Type: GrantFiled: April 23, 2010Date of Patent: January 19, 2016Assignee: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama
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Publication number: 20150028085Abstract: The occurrence of uneven drying in the center and end of a surface of a bonding layer during a desolvation process of a pre-drying step is reduced to ensure highly reliable bonding without peeling of a bonding surface even after repeated exposure to heat shock after bonding. The bonding material of the present invention to achieve the object contains silver nanoparticles coated with organic substance having 6 or less carbon atoms and having an average primary particle diameter of 10 to 30 nm as main silver particles, silver nanoparticles coated with an organic substance having 6 or less carbon atoms and having an average primary particle diameter of 100 to 200 nm as secondary silver particles, two kinds of solvents having different boiling points, and a dispersant.Type: ApplicationFiled: January 20, 2012Publication date: January 29, 2015Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Keiichi Endoh, Satoru Kurita, Minami Nagaoka
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Patent number: 8858700Abstract: In a bonding material using nanoparticles and a bonding method, use in combination with microparticles is proposed. However, there is the problem in which it is not easy to uniformly mix the nanoparticles and the microparticles. The present invention uses a bonding material including metal nanoparticles having an average particle diameter of 100 nm or less and a surface coated with an organic substance having 6 to 8 carbon atoms, and a polar solvent in an amount of 5 to 20% by mass with respect to a powder of the metal nanoparticles, and objects to be bonded with the bonding material interposed therebetween are fired at 200 to 350° C. under pressure. Thus, the metal nanoparticles are melted and returned to a bulk material, and therefore a bonding layer of the bulk material can be formed at a low temperature equal to or lower than a melting point.Type: GrantFiled: October 23, 2009Date of Patent: October 14, 2014Assignee: DOWA Electronics Materials Co., Ltd.Inventors: Keiichi Endoh, Aiko Nagahara, Yutaka Hisaeda, Toshihiko Ueyama
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Patent number: 8641929Abstract: Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.Type: GrantFiled: June 10, 2011Date of Patent: February 4, 2014Assignee: Dowa Electronics Materials Co., Ltd.Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama
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Publication number: 20130323529Abstract: There is provided a bonding material capable of forming a bonding body under an inert gas atmosphere such as a nitrogen atmosphere, and capable of exhibiting a bonding strength that endures a practical use even if not a heat treatment is applied thereto at a high temperature, which is the bonding material containing silver nanoparticles coated with a fatty acid having a carbon number of 8 or less and having an average primary particle size of 1 nm or more and 200 nm or less, and silver particles having an average particle size of 0.5 ?m or more and 10 ?m or less, and an organic material having two or more carboxyl groups.Type: ApplicationFiled: May 13, 2011Publication date: December 5, 2013Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Satoru Kurita, Keiichi Endoh, Yu Saito, Yutaka Hisaeda, Toshihiko Ueyama
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Publication number: 20130081759Abstract: Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.Type: ApplicationFiled: June 10, 2011Publication date: April 4, 2013Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama
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Publication number: 20120298009Abstract: A method of forming a bonded product using metal nanoparticles is provided. More specifically, provided is a paste containing a flux component that can form a metal phase even in an inert atmosphere. The use of this paste allows a bonding material that can give a practically acceptable bonding strength to be provided in an inert atmosphere such as a nitrogen atmosphere at low temperatures without performing conventionally used pressurization. The paste is a bonding material configured to include: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic material having 8 or less carbon atoms; a flux component having at least two carboxyl groups; and a dispersion medium. The use of this bonding material allows materials to be bonded even at a temperature of 300° C. or lower.Type: ApplicationFiled: April 23, 2010Publication date: November 29, 2012Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Keiichi Endoh, Yutaka Hisaeda, Akihiro Miyazawa, Aiko Nagahara, Toshihiko Ueyama
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Publication number: 20120103515Abstract: In a bonding material using nanoparticles and a bonding method, use in combination with microparticles is proposed. However, there is the problem in which it is not easy to uniformly mix the nanoparticles and the microparticles. The present invention uses a bonding material including metal nanoparticles having an average particle diameter of 100 nm or less and a surface coated with an organic substance having 6 to 8 carbon atoms, and a polar solvent in an amount of 5 to 20% by mass with respect to a powder of the metal nanoparticles, and objects to be bonded with the bonding material interposed therebetween are fired at 200 to 350° C. under pressure. Thus, the metal nanoparticles are melted and returned to a bulk material, and therefore a bonding layer of the bulk material can be formed at a low temperature equal to or lower than a melting point.Type: ApplicationFiled: October 23, 2009Publication date: May 3, 2012Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.Inventors: Keiichi Endoh, Aiko Nagahara, Yutaka Hisaeda, Toshihiko Ueyama