Patents by Inventor Keiichi Fujimoto

Keiichi Fujimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10612142
    Abstract: A film formation apparatus for forming a thin film having high gas barrier performance, such as a DLC (Diamond Like Carbon) film, a SiOx film, a SiOC film, a SiOCN film, a SiNx film, and an AlOx film, on an inner surface and/or an outer surface of a container such as a PET bottle. The film formation apparatus has: a vacuum chamber for forming, in a vacuum state, a film on a surface of a container using a heat generating element; a vacuum evacuation device for vacuumizing the vacuum chamber; and a relative shifting device for relatively shifting the container and the heat generating element in the vacuum chamber after the vacuumization of the vacuum chamber.
    Type: Grant
    Filed: December 26, 2012
    Date of Patent: April 7, 2020
    Assignee: KIRIN BEER KABUSHIKI KAISHA
    Inventors: Hiroyuki Ooshima, Keiichi Fujimoto, Hiroyasu Tabuchi, Masaki Nakaya
  • Publication number: 20200094318
    Abstract: The present invention aims at providing a bonding material having both preferable dispensing properties and preferable bonding properties, and also providing a bonding method employing the bonding material. Provided are: a bonding material comprising fine silver particles having an average primary particle diameter of smaller than or equal to 130 nm, and a crosslinking-type inter-particle distance keeping agent crosslinking between the fine silver particles and keeping a distance between the fine silver particles; and a bonding method employing the bonding material.
    Type: Application
    Filed: December 28, 2017
    Publication date: March 26, 2020
    Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
    Inventors: Hideyuki FUJIMOTO, Keiichi ENDOH, Tatsuro HORI, Satoru KURITA
  • Publication number: 20200035637
    Abstract: There are provided a bonding material capable of bonding an electronic part to a substrate by means of a silver bonding layer which is difficult to form large cracks even if the cooling/heating cycle is repeated, and a bonded product wherein an electronic part is bonded to a substrate by using the same. In a bonded product wherein a semiconductor chip such as an SiC chip (having a bonded surface plated with silver) serving as an electronic part is bonded to a copper substrate via a silver bonding layer containing a sintered body of silver, the silver bonding layer has a shear strength of not less than 60 MPa and has a crystalline diameter of not larger than 78 nm on (111) plane thereof.
    Type: Application
    Filed: March 26, 2018
    Publication date: January 30, 2020
    Inventors: Tatsuro Hori, Keiichi Endoh, Hideyuki Fujimoto, Satoru Kurita
  • Publication number: 20190283129
    Abstract: There are provided a bonding material, which is easily printed on a metal substrate, such as a copper substrate, and which can satisfactorily bond an Si chip to the metal substrate by preventing voids from being generated in a metal bonding layer and/or on the boundary between the metal bonding layer and the Si chip or metal copper substrate even if no pre-burning is carried out when the Si chip is bonded to the metal substrate, and a bonding method using the same. In a bonding material of a metal paste containing metal particles, a solvent and a dispersant, the metal particles containing first metal particles (small particles) having an average primary particle diameter of 1 to 40 nm, second metal particles (medium particles) having an average primary particle diameter of 41 to 110 nm, and third metal particles (large particles) having an average primary particle diameter of 120 nm to 10 ?m, the weight percentages of the first, second and third metal particles being 1.
    Type: Application
    Filed: September 27, 2017
    Publication date: September 19, 2019
    Applicant: Dowa Electronics Materials Co., Ltd.
    Inventors: Keiichi Endoh, Minami Kanasugi, Hideyuki Fujimoto, Satoru Kurita
  • Publication number: 20140366806
    Abstract: The present invention relates to a film formation apparatus for forming thin films having high gas barrier performance, such as a DLC (Diamond Like Carbon) film, SiOx film, SiOC film, SiOCN film, SiNx film, and AIOx film, on the inner surface and/or outer surface of containers such as PET bottles. The film formation apparatus is provided with: a vacuum chamber for forming, in a vacuum state, a film on a surface of a container (4) using a heat generating element (21); a vacuum evacuation device for vacuumizing the vacuum chamber; and a relative shifting device for relatively shifting the container (4) and the heat generating element (21) in the vacuum chamber after starting vacuumization of the vacuum chamber.
    Type: Application
    Filed: December 26, 2012
    Publication date: December 18, 2014
    Applicant: KIRIN BEER KABUSHIKI KAISHA
    Inventors: Hiroyuki Ooshima, Keiichi Fujimoto, Hiroyasu Tabuchi, Masaki Nakaya
  • Publication number: 20110090015
    Abstract: A semiconductor integrated circuit includes a first ring oscillator to which a stress voltage is applied; a second ring oscillator to which the stress voltage is not applied; and a phase comparator configured to receive an output of the first ring oscillator and an output of the second ring oscillator, and to compare phases of the outputs. The first ring oscillator includes a switch circuit configured to switch between a first connection state in which ring connection of the first ring oscillator is disconnected to connect a predetermined node of the second ring oscillator to a predetermined node of the first ring oscillator, and a second connection state in which connection between the first ring oscillator and the second ring oscillator is disconnected to connect the first ring oscillator in a ring.
    Type: Application
    Filed: December 28, 2010
    Publication date: April 21, 2011
    Applicant: PANASONIC CORPORATION
    Inventors: Masaya Sumita, Keiichi Fujimoto
  • Patent number: 7434857
    Abstract: A chuck device having a pair of arms rotatably supported by arm shafts and an operation member. One of the arms is provided with a roller shaft rotatable together with the arm about one of the arm shafts. The other arm is provided with an arm drive portion rotatable together with the arm. The arm drive portion is biased so as to press a second roller. Between the operation member and the roller shaft is provided a motion input mechanism for converting the motion of the operation member to rotational motion of the roller shaft about the arm shaft as the center of rotation. Between the roller shaft and the arm drive portion is provided an interlock mechanism that causes the arm drive portion to rotate about the arm shaft in conjunction with the motion of the roller shaft about the arm shaft as the center of rotation.
    Type: Grant
    Filed: December 26, 2003
    Date of Patent: October 14, 2008
    Assignee: Kirin Techno-System Corporation
    Inventors: Kiyoharu Nakajima, Kunihiko Kubota, Keiichi Fujimoto, Kazuhiro Horiuchi
  • Patent number: 7429356
    Abstract: A loading mechanism holds at least one extracting cartridge provided with a filter member, at least one waste liquid vessel for accommodating a discharged liquid of a sample liquid and a discharged liquid of a washing liquid, which discharged liquids have been discharged from the extracting cartridge, and at least one recovery vessel for accommodating a recovery liquid, which contains a recovered nucleic acid and has been discharged from the extracting cartridge. A pressurized air supplying mechanism introduces pressurized air into the extracting cartridge. A liquid injecting mechanism injects each of the washing liquid and the recovery liquid into the extracting cartridge.
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: September 30, 2008
    Assignee: FUJIFILM Corporation
    Inventors: Yoshihiro Seto, Takahiro Miyato, Keiichi Fujimoto
  • Patent number: 7354510
    Abstract: A mechanism for introducing pressurized air into an extracting cartridge comprises an air pump, an on-off valve, and a pressure sensor for detecting an internal pressure within the extracting cartridge. The on-off valve is turned on in order to introduce the pressurized air into the extracting cartridge. When the internal pressure detected by the pressure sensor has become equal to a predetermined pressure range for a pressurization upper limit, the on-off valve is turned off in order to confine the area within the extracting cartridge in the pressurized state, the pressure being thereby exerted upon a sample liquid, a washing liquid, or a recovery liquid having been injected into the extracting cartridge.
    Type: Grant
    Filed: August 18, 2004
    Date of Patent: April 8, 2008
    Assignee: Fujifilm Corporation
    Inventors: Keiichi Fujimoto, Nobuyuki Torisawa
  • Publication number: 20070209995
    Abstract: A loading mechanism holds at least one extracting cartridge provided with a filter member, at least one waste liquid vessel for accommodating a discharged liquid of a sample liquid and a discharged liquid of a washing liquid, which discharged liquids have been discharged from the extracting cartridge, and at least one recovery vessel for accommodating a recovery liquid, which contains a recovered nucleic acid and has been discharged from the extracting cartridge. A pressurized air supplying mechanism introduces pressurized air into the extracting cartridge. A liquid injecting mechanism injects each of the washing liquid and the recovery liquid into the extracting cartridge.
    Type: Application
    Filed: May 11, 2007
    Publication date: September 13, 2007
    Inventors: Yoshihiro Seto, Takahiro Miyato, Keiichi Fujimoto
  • Patent number: 7187002
    Abstract: A wafer collective reliability evaluation device comprises a wafer collective probe disposed so as to face a reliability evaluation wafer and including a wiring substrate, a conductive elastic sheet provided on a surface of the wiring substrate facing the reliability evaluation wafer and a plurality of metal terminals provided in a surface of the conductive elastic sheet and electrically connected to the reliability evaluation wafer. The reliability evaluation wafer comprises a plurality of reliability evaluation elements formed on a main body of a semiconductor wafer, a plurality of electrodes for applying voltage or current to the respective reliability evaluation elements via the respective metal terminals and a plurality of heating elements formed in the vicinity of the respective reliability evaluation elements and serving to control temperatures of the respective reliability evaluation elements.
    Type: Grant
    Filed: January 12, 2005
    Date of Patent: March 6, 2007
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventor: Keiichi Fujimoto
  • Publication number: 20060042911
    Abstract: A chuck device having a pair of arms rotatably supported by arm shafts and an operation member. One of the arms is provided with a roller shaft rotatable together with the arm about one of the arm shafts. The other arm is provided with an arm drive portion rotatable together with the arm. The arm drive portion is biased so as to press a second roller. Between the operation member and the roller shaft is provided a motion input mechanism for converting the motion of the operation member to rotational motion of the roller shaft about the arm shaft as the center of rotation. Between the roller shaft and the arm drive portion is provided an interlock mechanism that causes the arm drive portion to rotate about the arm shaft in conjunction with the motion of the roller shaft about the arm shaft as the center of rotation.
    Type: Application
    Filed: December 26, 2003
    Publication date: March 2, 2006
    Inventors: Kiyoharu Nakajima, Kunihiro Kubota, Keiichi Fujimoto, Kazuhiro Horiuchi
  • Publication number: 20050167783
    Abstract: A wafer collective reliability evaluation device comprises a wafer collective probe disposed so as to face a reliability evaluation wafer and including a wiring substrate, a conductive elastic sheet provided on a surface of the wiring substrate facing the reliability evaluation wafer and a plurality of metal terminals provided in a surface of the conductive elastic sheet and electrically connected to the reliability evaluation wafer. The reliability evaluation wafer comprises a plurality of reliability evaluation elements formed on a main body of a semiconductor wafer, a plurality of electrodes for applying voltage or current to the respective reliability evaluation elements via the respective metal terminals and a plurality of heating elements formed in the vicinity of the respective reliability evaluation elements and serving to control temperatures of the respective reliability evaluation elements.
    Type: Application
    Filed: January 12, 2005
    Publication date: August 4, 2005
    Inventor: Keiichi Fujimoto
  • Publication number: 20050161377
    Abstract: An extraction cartridge having a filter member extracts a specific material such as a nucleic acid. The specific material is caused to be adsorbed to the filter member by pressurizing a sample liquid containing a specific material. A pressurized-air supply mechanism for introducing pressurized air into a plurality of the extraction cartridges includes an air pump, opening and closing valves for individually starting or stopping supply of the pressurized air to the plurality of extraction cartridges, and pressure relief valves for individually relieving the pressures in the extraction cartridges to the atmosphere. These valves are disposed partway along a feed passage to the extraction cartridges. The extraction cartridges are supplied with pressurized air, and then sealed. Upon completion of the drainage of any one of the extraction cartridges, the pressure relief valve associated with the completely drained extraction cartridge is independently opened to relieve the pressurized air remaining therein.
    Type: Application
    Filed: January 24, 2005
    Publication date: July 28, 2005
    Inventors: Keiichi Fujimoto, Nobuyuki Torisawa
  • Publication number: 20050045538
    Abstract: A loading mechanism holds at least one extracting cartridge provided with a filter member, at least one waste liquid vessel for accommodating a discharged liquid of a sample liquid and a discharged liquid of a washing liquid, which discharged liquids have been discharged from the extracting cartridge, and at least one recovery vessel for accommodating a recovery liquid, which contains a recovered nucleic acid and has been discharged from the extracting cartridge. A pressurized air supplying mechanism introduces pressurized air into the extracting cartridge. A liquid injecting mechanism injects each of the washing liquid and the recovery liquid into the extracting cartridge.
    Type: Application
    Filed: August 18, 2004
    Publication date: March 3, 2005
    Inventors: Yoshihiro Seto, Takahiro Miyato, Keiichi Fujimoto
  • Publication number: 20050045533
    Abstract: A mechanism for introducing pressurized air into an extracting cartridge comprises an air pump, an on-off valve, and a pressure sensor for detecting an internal pressure within the extracting cartridge. The on-off valve is turned on in order to introduce the pressurized air into the extracting cartridge. When the internal pressure detected by the pressure sensor has become equal to a predetermined pressure range for a pressurization upper limit, the on-off valve is turned off in order to confine the area within the extracting cartridge in the pressurized state, the pressure being thereby exerted upon a sample liquid, a washing liquid, or a recovery liquid having been injected into the extracting cartridge.
    Type: Application
    Filed: August 18, 2004
    Publication date: March 3, 2005
    Inventors: Keiichi Fujimoto, Nobuyuki Torisawa
  • Patent number: 6784681
    Abstract: A semiconductor integrated circuit testing system for testing electric characteristics of a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer in the lump includes a wafer tray for holding the semiconductor wafer and an interconnect substrate facing the semiconductor wafer held on the wafer tray and having interconnect layers to which a testing voltage is externally input. A ring-shaped sealing member is provided between the wafer tray and the interconnect substrate so as to form a sealed space together with the wafer tray and the interconnect substrate. An elastic sheet is held on the interconnect substrate at the periphery thereof. A plurality of probe terminals electrically connected to the interconnect layers are provided on the elastic sheet in positions respectively corresponding to external electrodes of the plural semiconductor integrated circuit devices.
    Type: Grant
    Filed: September 28, 2001
    Date of Patent: August 31, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Keiichi Fujimoto, Yoshiro Nakata
  • Publication number: 20020105354
    Abstract: A semiconductor integrated circuit testing system for testing electric characteristics of a plurality of semiconductor integrated circuit devices formed on a semiconductor wafer in the lump includes a wafer tray for holding the semiconductor wafer and an interconnect substrate facing the semiconductor wafer held on the wafer tray and having interconnect layers to which a testing voltage is externally input. A ring-shaped sealing member is provided between the wafer tray and the interconnect substrate so as to form a sealed space together with the wafer tray and the interconnect substrate. An elastic sheet is held on the interconnect substrate at the periphery thereof. A plurality of probe terminals electrically connected to the interconnect layers are provided on the elastic sheet in positions respectively corresponding to external electrodes of the plural semiconductor integrated circuit devices.
    Type: Application
    Filed: September 28, 2001
    Publication date: August 8, 2002
    Inventors: Keiichi Fujimoto, Yoshiro Nakata
  • Patent number: 5803363
    Abstract: A liquid sprinkler having a substantially hemispherical shaped head at the upper end of a vertical rise pipe. The head is spaced above an area to be watered and has a plurality of nozzles on the hemispherical surface which are sized and positioned to afford even water distribution over the watered area.
    Type: Grant
    Filed: October 25, 1994
    Date of Patent: September 8, 1998
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Shunji Matsumura, Keiichi Fujimoto, Hiroshi Ota
  • Patent number: 5708293
    Abstract: In a unit part of a lead frame for mounting a semiconductor chip, connecting leads and supporting leads extending from a lead frame main body toward a semiconductor chip mounting region are formed. Between each supporting lead and the lead frame main body, a movable part and a spring part for elastically supporting the movable part are disposed. The tip portion of the supporting lead connected with the movable part extends to the inside of the semiconductor chip mounting region in the natural state of the movable part, so that the tip portion butts against the side face of a semiconductor chip when the semiconductor chip is mounted. Thus, the semiconductor chip can be supported and fixed by using a bias force applied by the spring part. The base portions of the supporting leads, the movable part and the spring part do not remain in a package, and hence do not cause a stress in the package and do not increase the volume of the package.
    Type: Grant
    Filed: December 30, 1996
    Date of Patent: January 13, 1998
    Assignee: Matsushita Electronics Corporation
    Inventors: Takao Ochi, Hisashi Funakoshi, Ichiro Okumura, Hajime Honma, Keiji Okuma, Keiichi Fujimoto