Abstract: In a planarization process with a CMP method for a work surface having very small protrusions and depressions thereon at a semiconductor process, a polishing method is provided which achieves high flatness by selectively polishing and removing the protrusions. Relating to the planarization process, such as a CMP processing or an aspheric lens polishing process, the polishing method is performed by forming an aggregation trace of particles on the work surface by irradiating laser light. More specifically, a region where the laser light to be irradiated is the depressions adjacent to the protrusions, and the irradiated laser light forms the aggregation trace of particles within the depression, thereby controlling the amount of removal material at a fine region to allow selective polishing of the protrusions.

Abstract: In a shoe press belt of a papermaking machine, the part of the paper web-facing layer in which water-holding grooves are formed is composed of a surface sublayer, having a relatively low hardness, and an underlying layer having a relatively high hardness. The higher hardness of the underlying layer prevents cracks from forming where the cross-sectional shape of the grooves tends to change as the belt is compressed. The lower hardness of the surface sublayer prevents the formation of cracks as a result of forces acting on the belt in the direction opposite to the machine direction at the nip location in a papermaking machine.

Abstract: A semiconductor device having a chip size package is disclosed. The chip size package comprises a semiconductor chip having at least a bonding pad, at least a terminal of said chip size package and a reroute trace formed between the bonding pad and the terminal on said chip size package. The reroute trace is formed to have a desired resistance.

Abstract: In planarization process with CMP method for a work surface having very small protrusions and depressions thereon at a semiconductor process, a polishing method is provided which achieves high flatness by selectively polishing and removing the protrusions. Relating to the planarization process such as CMP processing or an aspheric lens polishing process, the polishing method is performed by forming aggregation trace of particles on the work surface by irradiating laser light. More specifically, a region where the laser light to be irradiated is the depressions adjacent to the protrusions and forms the aggregation trace of particles within the depression, thereby controlling the amount of removal material at a fine region to allow selective polishing of the protrusions.

Abstract: In planarization process with CMP method for a work surface having very small protrusions and depressions thereon at a semiconductor process, a polishing method is provided which achieves high flatness by selectively polishing and removing the protrusions. Relating to the planarization process such as CMP processing or an aspheric lens polishing process, the polishing method is performed by forming aggregation trace of particles on the work surface by irradiating laser light. More specifically, a region where the laser light to be irradiated is the depressions adjacent to the protrusions and forms the aggregation trace of particles within the depression, thereby controlling the amount of removal material at a fine region to allow selective polishing of the protrusions.

Abstract: In a shoe press belt of a papermaking machine, the part of the paper web-facing layer in which water-holding grooves are formed is composed of a surface sublayer, having a relatively low hardness, and an underlying layer having a relatively high hardness. The higher hardness of the underlying layer prevents cracks from forming where the cross-sectional shape of the grooves tends to change as the belt is compressed. The lower hardness of the surface sublayer prevents the formation of cracks as a result of forces acting on the belt in the direction opposite to the machine direction at the nip location in a papermaking machine.

Abstract: In a Chemical Mechanical Polishing flattening processing against a surface with minute bumps and dips in a semiconductor process, this invention provides a method of polishing to be able to perform selective polishing of the bumps. A laser beam is irradiated selectively on the surface of a work piece in accordance with a shape of minute bumps and dips on the surface of the work piece, thereby performing a removal control for the minute region and enabling to selectively polish particularly surface bumps.

Abstract: In planarization process with CMP method for a work surface having very small protrusions and depressions thereon at a semiconductor process, a polishing method is provided which achieves high flatness by selectively polishing and removing the protrusions. Relating to the planarization process such as CMP processing or an aspheric lens polishing process, the polishing method is performed by forming aggregation trace of particles on the work surface by irradiating laser light. More specifically, a region where the laser light to be irradiated is the depressions adjacent to the protrusions and forms the aggregation trace of particles within the depression, thereby controlling the amount of removal material at a fine region to allow selective polishing of the protrusions.

Abstract: The present invention is to provide a travel insurance reception apparatus and method, which provide to a user an insurance product suitable for his or her travel plan in a convenient manner and to contract for the insurance product. A travel insurance reception apparatus 20: receives, by an insurance order receiving program 22a, data for destination and starting point from a navigation device 70; transmits, by a proposed insurance select program 22c, one or more insurance products, based on the destination and the starting point, to the navigation device 70 via a communication device 25; and receives, by a contract confirmation program 22e; receives contract agreement on the insurance product from the navigation device 70 as acceptance/rejection information by receiving data via the communication device 25.

Abstract: A vehicle control system includes a road data memory, current position sensor that detects a current position of a vehicle and a camera that takes a picture of the road ahead of the current position. At least one indicator line such as a lane dividing line on the road is shown in the picture. The picture changes as the vehicle moves forward along the road, during which increase in width of the indicator line or increase of distance between two indicator lines may be detected. By such detection, the vehicle position with respect to the indicator line is determined, the result of which is incorporated into control operation of an automatic transmission, for example.

Abstract: In a Chemical Mechanical Polishing flattening processing against a surface with minute bumps and dips in a semiconductor process, this invention provides a method of polishing to be able to perform selective polishing of the bumps. A laser beam is irradiated selectively on the surface of a work piece in accordance with a shape of minute bumps and dips on the surface of the work piece, thereby performing a removal control for the minute region and enabling to selectively polish particularly surface bumps.

Abstract: A navigation apparatus has a camera for taking images of a road on which the vehicle is traveling; means for detecting and monitoring lane markers on the road by processing the images; and road determining means for determining the road on which the vehicle is traveling just after passing a fork. This road determination is made based on predetermined conditions relating to the fork and the lane markers detected and monitored. According to the structure described above, it is possible for the navigation apparatus to know the road on which the vehicle is traveling immediately after passing the fork. Further, when the vehicle's actual location is displayed at a wrong position on the digital road map, the navigation apparatus can correct the position immediately after passing the fork. This is advantageous in that the driver can know its accurate location from the displayed information immediately after passing the fork.

Abstract: A navigation apparatus has a camera for taking images of a road on which the vehicle is traveling; means for detecting and monitoring lane markers on the road by processing the images; and road determining means for determining the road on which the vehicle is traveling just after passing a fork. This road determination is made based on predetermined conditions relating to the fork and the lane markers detected and monitored. According to the structure described above, it is possible for the navigation apparatus to know the road on which the vehicle is traveling immediately after passing the fork. Further, when the vehicle's actual location is displayed at a wrong position on the digital road map, the navigation apparatus can correct the position immediately after passing the fork. This is advantageous in that the driver can know its accurate location from the displayed information immediately after passing the fork.

Abstract: A joining product of oxide superconducting materials having a high current density and process for producing the same. A joining product comprising a plurality of oxide superconducting materials having an identical crystal orientation joined with each other through a superconducting phase of the same type as described above which has the same crystal orientation as the oxide superconducting materials and a lower peritectic temperature than the oxide superconducting materials.

Abstract: A holder which cleanly holds an article such as a semiconductor wafer and which is high in rigidity, light in weight, high in dimensional stability and excellent in dust resistance. The wafer holder includes a vacuum holding surface formed with a plurality of concentric or helical annular projections and annular vacuum holding grooves which are arranged at a given pitch. A plurality of vacuum holes for vacuum holding purposes are formed in the respective annular grooves so as to be arranged radially and each of the vacuum holes is subjected to pressure reduction by a vacuum source through the interior of the holder, thereby correcting the flatness of a wafer to conform with the upper surfaces of the annular projections. At least the portions of the holder which contact with the wafer (preferably the holder on the whole) are made of a sintered ceramic containing covalent bond-type conductive material such as a TiC-containing sintered Al.sub.2 O.sub.

Abstract: The present invention relates to an oxide superconductor comprising a composite oxide of RE , Ba and Cu, wherein the superconductor comprises a micro structure comprised of a monocrystalline REBa.sub.2 Cu.sub.3 O.sub.7-x phase (123 phase) and a RE.sub.2 BaCuO.sub.5 phase (211 phase) finely dispersed therein, the 123 phase being formed in a plurality of domains respectively for individual RE compositions and in the order of the 123 phase forming temperatures in respective layers.

Abstract: A probe has a vibration excitor including a core member made of a giant magnetostrictive material and magnetic field generation means for generating an alternating magnetic field having a randomly varying frequency to thereby expand and compress the core member to generate random vibration therein, and an impedance head for detecting an acceleration of the random vibration and a vibration stress created in organism tissue vibrated by the vibration excitor and generating electrical signals proportional thereto. A viscoelasticity measurement device using the above probe for the organism tissue is also disclosed.

Abstract: A valve apparatus comprising a valve housing defining a valve bore and a valve chamber through which an inflow pipe and an outflow pipe communicate at right angles with each other. A valve stem is disposed in the valve chamber to be axially reciprocable. The valve stem carries an elastic packing fitted on a head portion of the valve stem, the elastic packing being movable into and out of pressure contact with a valve seat defined at a connection between the valve bore and the valve chamber. A support plate is mounted at an inlet of the valve bore, which support plate defines flow-through openings and a non-circular support bore. The valve stem includes a forward portion having a sectional shape fitting with the non-circular support bore and extending into the non-circular support bore.

Abstract: A flow control valve, which supports a valve body movably to a valve shaft suported movably in a valve chamber, is provided at the valve shaft with flow grooves for allowing a fluid to flow therethrough even when the valve body operates for closing and a sealing member which closes the flow grooves when the valve shaft is further moved with respect to the valve body in condition of closing operation, thereby enabling a fluid passage to be open or closed in two steps.