Abstract: The present invention is to provide a method for producing a peptide containing an N-alkylamino acid, which comprises the following Steps (1) to (3). Step (1): a step of mixing an N-terminal protected amino acid or an N-terminal protected peptide with a carboxylic acid halide or a halogenated alkyl formate; Step (2): a step of mixing an amino acid or a peptide in which the N-terminal and the C-terminal are not protected with a trialkylsilylating agent; and Step (3): a step of mixing the product obtained in Step (1) with the product obtained in Step (2).

Abstract: A BMS for managing a battery assembly includes: a BMU that manages the battery assembly; a plurality of CMUs that monitor the battery assembly; and a setting circuit. The BMU wirelessly transmits, to the plurality of CMUs, a first signal including identification information of one CMU among the plurality of CMUs. Each of the plurality of CMUs includes identification information identifying itself, receives the first signal transmitted by the BMU, and outputs a second signal on condition that the first signal received matches the identification information. The setting circuit generates and outputs correspondence information that associates (i) position information of the one CMU, among the plurality of CMUs, that output the second signal with (ii) the identification information included in the first signal transmitted by the BMU.

Abstract: A BMS includes: a BMU that manages a battery assembly; and a plurality of CMUs that monitor the battery assembly. Among the plurality of CMUs, a first CMU includes a first wireless communication circuit and a first communication antenna for communicating with the BMU, and a second CMU includes a second wireless communication circuit and a second communication antenna for communicating with the BMU. The modulation scheme for wireless communication by the first wireless communication circuit is different from the modulation scheme for wireless communication by the second wireless communication circuit.

Abstract: A BMS for managing a battery assembly includes: a BMU that manages the battery assembly; and a plurality of CMUs that monitor the battery assembly. One CMU among the plurality of CMUs includes a wireless communication circuit and a timer circuit, and based on a timing at which the timer circuit times out, repeatedly transitions between a first state in which the wireless communication circuit is supplied with power and therefore capable of receiving a wake-up signal transmitted by the BMU, and a second state in which the wireless communication circuit is not supplied with power.

Abstract: A BMS includes: a BMU that manages a battery assembly; a first CMU that monitors one or more battery cells included in the battery assembly; and a second CMU that monitors the one or more battery cells monitored by the first CMU. The first CMU includes a wireless communication circuit and a communication antenna for communicating with the BMU. The second cell monitoring circuit CMU includes a power line communication circuit, for communicating with the BMU, that uses a power line in the battery assembly.

Abstract: A BMS for managing a battery assembly includes: a BMU that manages the battery assembly and includes a communication antenna; and one or more CMUs that monitor the battery assembly and each include a communication antenna that communicates with the communication antenna. A communication antenna group including the communication antenna and one or more communication antennas is arranged in a straight line. The BMS further includes a conductor that covers at least part of the communication antenna group. The conductor includes a recess that extends in the alignment direction of the communication antenna group and is recessed in a direction away from the communication antenna group in a cross-section orthogonal to the alignment direction.

Abstract: A method for manufacturing a vibration element that includes a base portion, a first vibration arm and a second vibration arm that extend from the base portion along a first direction and are arranged along a second direction intersecting the first direction, and bottomed grooves on both main surfaces of the first vibration arm and both main surfaces of the second vibration arm includes: a preparing step of preparing a crystal substrate; a protective film forming step of forming a protective film on the crystal substrate except for groove regions that are regions in which the grooves are formed; and a dry etching step of dry etching the crystal substrate through the protective film to form the grooves. The grooves provided in at least one of the first vibration arm and the second vibration arm include a first groove and a second groove arranged along the second direction.

Abstract: A method for manufacturing a vibrator device includes a first dry etching step of dry-etching a quartz crystal substrate having a first surface and a second surface from the side facing the first surface to form first grooves and part of the outer shapes of a first vibrating arm and a second vibrating arm, a second dry etching step of dry-etching the quartz crystal substrate from the side facing the second surface to form second grooves and part of the outer shapes of the first vibrating arm and the second vibrating arm, and thereafter, a wet etching step of wet-etching the side surfaces of the first vibrating arm and the second vibrating arm.

Abstract: An image pickup apparatus includes: an image pickup member having a first surface and a second surface, an external electrode being disposed on the second surface; a terminal where a core wire terminal is disposed on a first upper surface and a core wire electrode is disposed on a lower surface; a wiring layer including an insulation layer and a wiring, the wiring being in contact with the external electrode and the core wire electrode, a third surface being in contact with the second surface and the lower surface; a resin layer disposed on the third surface, an outer dimension of the resin layer being equal to an outer dimension of the wiring layer, the resin layer fixing the image pickup member and the terminal; and an electric cable including a core wire bonded to the core wire terminal.

Abstract: An image pickup unit includes: an image pickup substrate including a first principal surface and a second principal surface, a light receiving circuit being formed on the first principal surface and a through wiring being placed on an inner surface of a via hole including an opening in the second principal surface; a solder resist film placed around the via hole on the second principal surface and in the via hole in a range from a bottom face to a level not reaching the second principal surface; and a bonding terminal which is made of solder, covers a surface of the solder resist film placed in the via hole, and is bonded to the through wiring on an outer edge of the opening in the via hole, the through wiring being not covered with the solder resist film.

Abstract: An image pickup module includes: a lens unit including a first principal surface and a second principal surface; an image pickup unit including a third principal surface and a fourth principal surface on which an external electrode is disposed; a wiring board including a hole and a bonding electrode disposed on a bottom surface of the hole; a solder that bonds the bonding electrode and the external electrode; a rigid member that defines a spacing between the fourth principal surface and the bottom surface; and a second resin disposed between the fourth principal surface and the bottom surface.

Abstract: An analysis device according to the present disclosure, which obtains data about a sample, is characterized by comprising: a placement unit on which the sample is placed; a data obtaining unit which obtains data about the sample; a user interface unit which allows a user to make access to processing of the analysis device; a communication unit which communicates with an online authentication unit that authenticates the user online; an offline authentication unit which authenticates the user offline when the communication unit cannot communicate with the online authentication unit; and a restriction unit which restricts the processing accessible to the user when the user is authenticated by the offline authentication unit as compared to when the user is authenticated by the online authentication unit.

Abstract: An endoscope comprising: an objective optical system; an imager having a light receiving plane that faces an emitting plane of the objective optical system; a semiconductor device provided so as to face a plane, of the imager, opposite to the light receiving plane; and a conductive member that covers the objective optical system, the imager, and the semiconductor device, the conductive member having an external dimension that is identical between a side of the objective optical system and a side of the imager. A distance from an end portion of the semiconductor device in a direction orthogonal to an optical axis of the objective optical system to an inner wall of the conductive member is shorter than a distance from an end portion of the imager in the direction orthogonal to the optical axis of the objective optical system to the inner wall of the conductive member.

Abstract: In an exemplary embodiment, a vibration waveform sensor includes a pair of conductive pads 22, 23, and a piezoelectric element 30 whose terminal electrodes are connected thereto, which are provided on a board 20, and these are surrounded by a conductive ring-like spacer 40. On the interior side of the spacer 40, a cover part 44 substantially like a disk is provided in a manner covering over the pair of conductive pads 22, 23 and the piezoelectric element 30. The cover part 44 cuts off any humming noise from the top face of the piezoelectric element 30 over a continuous surface, which results in a reduction of humming noise.

Abstract: An endoscope includes an opto-electric composite module, an optical fiber, and a plurality of electric cables each including a core wire and a shielding wire. The opto-electric composite module includes a light emitting device, a wiring board including a plurality of bonding electrodes to which the plurality of core wires are bonded, a ferrule causing the optical fiber inserted into a first through hole to be optically coupled to the light emitting device, and a cable holder having grooves to which the plurality of core wires are fixed with the plurality of core wires so disposed as to be bonded to the plurality of respective bonding electrodes. The cable holder is a holder conductor electrically connected to a ground potential electrode of the image pickup device, and the shielding wires in the electric cables are bonded to the holder conductor of the cable holder via an electrically conductive member.

Abstract: An image pickup apparatus includes: an image pickup member having a first surface and a second surface, an external electrode being disposed on the second surface; a terminal where a core wire terminal is disposed on a first upper surface and a core wire electrode is disposed on a lower surface; a wiring layer including an insulation layer and a wiring, the wiring being in contact with the external electrode and the core wire electrode, a third surface being in contact with the second surface and the lower surface; a resin layer disposed on the third surface, an outer dimension of the resin layer being equal to an outer dimension of the wiring layer, the resin layer fixing the image pickup member and the terminal; and an electric cable including a core wire bonded to the core wire terminal.

Abstract: An image pickup apparatus includes an image pickup module in which an image pickup device is laminated, a relay board having a plurality of flying leads which are electrically connected to a proximal end face of the image pickup module through ultrasonic wire bonding, and a plurality of cables electrically connected to a plurality of connection lands of the relay board, and a bent portion is formed on the relay board so that the plurality of cables are fitted within a projection surface of the proximal end face of the image pickup module.

Abstract: In an embodiment, a sensor module 10 includes a piezoelectric element 30 placed on the principal face of a board 20, which piezoelectric element is surrounded by a vibration ring 40 and installed in an appropriate position on a person's arm, neck, etc., using a medical fixing tape, etc., with the vibration ring 40 contacting the person's skin. When a pulse wave is transmitted to the vibration ring 40 from the skin, the board 20 also vibrates and this vibration is transmitted to the piezoelectric element 30. Then, the piezoelectric element 30 is displaced and the pulse wave vibration is converted to an electrical signal. The resulting electrical signal is amplified by an amplifier on the board 20 and input to the vibration analysis device 100, where prescribed calculations are run to perform waveform analysis. The vascular state, etc., can be known from pulse waveforms.

Abstract: Pulse waves and ballistocardiac waves propagate to a piezoelectric vibration sensor 110 attached to a seating surface 102 of a chair 100, and are output after being converted to electrical signals. Thereafter, the electrical signals are filtered by a low-pass digital filter 202P and a band-pass digital filter 202B, with the pulse waves GP output from the low-pass digital filters 202P and the ballistocardiac waves GB output from the band-pass digital filter 202B. These pulse waves GP and ballistocardiac waves GB are processed by absolute value circuits 212P, 212B and low-pass filters 214P, 214B of envelope-processing circuits 210P, 210B, to obtain envelopes. Then, pulse wave propagation velocity PWV is calculated based on the difference between the peaks of the obtained envelopes. The pulse waves/their velocity can be detected/obtained even when the piezoelectric vibration sensor is not attached directly to the human body.

Abstract: An optical transmission module includes: an optical fiber a cross section of which has a circular shape and an end surface of which is an inclined surface; and an optical element part including an optical element, wherein a cutout surface extending in an optical axis direction is formed in an outer circumference of an end portion of the optical fiber, and the angle of the inclined surface with respect to the main surface of the optical element is defined by the cutout surface, such that light guided through the optical fiber is optically coupled to the optical element.