Patents by Inventor Keiichi Kuniya

Keiichi Kuniya has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device having supporting electrode composite structure of metal containing fibers
    Patent number: 3969754
    Abstract: A semiconductor device comprising a semiconductor substrate and a supporting electrode disposed at least on one surface of the semiconductor substrate, in which the supporting electrode has such a composite structure that fibers having a coefficient of thermal expansion substantially equal to or lower than that of the semiconductor substrate are embedded in a matrix of a metal having electric and heat conductivities higher than those of the fibers. This supporting electrode has a satisfactorily high heat conductivity and the coefficient of thermal expansion thereof is freely adjustable.
    Type: Grant
    Filed: October 21, 1974
    Date of Patent: July 13, 1976
    Assignee: Hitachi, Ltd.
    Inventors: Keiichi Kuniya, Tomio Iizuka, Masateru Suwa, Tomio Yasuda, Takeshi Sasaki, Sakae Kikuchi, Hideo Suzuki