Patents by Inventor Keiichi Kurashina
Keiichi Kurashina has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11024520Abstract: The substrate processing apparatus includes a processing chamber including an outer chamber configured to hold a processing liquid and an inner chamber capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted. The guide cover is located below an upper end of the outer chamber and above the inner chamber.Type: GrantFiled: September 30, 2019Date of Patent: June 1, 2021Assignee: EBARA CORPORATIONInventors: Keiichi Kurashina, Toshio Yokoyama
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Publication number: 20200335394Abstract: To prevent a tin alloy from coming into contact with a copper wiring layer when a tin alloy bump layer is reflowed. According to an aspect of the present invention, a method of manufacturing a substrate having a bump at a resist opening is provided. The method of manufacturing a substrate includes a step of forming a copper wiring layer on the substrate by plating at a first temperature, a step of forming a barrier layer on the copper wiring layer by plating at a second temperature that is approximately equal to the first temperature, and a step of forming a tin alloy bump layer on the barrier layer by plating.Type: ApplicationFiled: March 29, 2017Publication date: October 22, 2020Inventors: Keiichi KURASHINA, Taiki ISHITSUKA, Shinji OMATA, Mitsuhiro SHAMOTO, Makoto KUBOTA
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Publication number: 20200027758Abstract: The substrate processing apparatus includes a processing chamber including an outer chamber configured to hold a processing liquid and an inner chamber capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted. The guide cover is located below an upper end of the outer chamber and above the inner chamber.Type: ApplicationFiled: September 30, 2019Publication date: January 23, 2020Inventors: Keiichi Kurashina, Toshio Yokoyama
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Publication number: 20200027759Abstract: The substrate processing apparatus includes a processing chamber including an outer chamber configured to hold a processing liquid and an inner chamber capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted. The guide cover is located below an upper end of the outer chamber and above the inner chamber.Type: ApplicationFiled: September 30, 2019Publication date: January 23, 2020Inventors: Keiichi Kurashina, Toshio Yokoyama
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Patent number: 10468274Abstract: The substrate processing apparatus includes a processing chamber including an outer chamber configured to hold a processing liquid and an inner chamber capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted. The guide cover is located below an upper end of the outer chamber and above the inner chamber.Type: GrantFiled: March 21, 2016Date of Patent: November 5, 2019Assignee: EBARA CORPORATIONInventors: Keiichi Kurashina, Toshio Yokoyama
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Patent number: 10141211Abstract: A substrate processing apparatus comprises a transferring device including a grasping section configured to grasp a substrate holder, and a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented, and processing the substrate. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.Type: GrantFiled: August 29, 2017Date of Patent: November 27, 2018Assignee: EBARA CORPORATIONInventors: Toshio Yokoyama, Masahiko Sekimoto, Kenichi Kobayashi, Kenichi Akazawa, Takashi Mitsuya, Keiichi Kurashina
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Publication number: 20170358472Abstract: A substrate processing apparatus according to the present invention comprises a transferring device including a grasping section configured to grasp a substrate holder, and a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented, and processing the substrate. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.Type: ApplicationFiled: August 29, 2017Publication date: December 14, 2017Inventors: Toshio YOKOYAMA, Masahiko SEKIMOTO, Kenichi KOBAYASHI, Kenichi AKAZAWA, Takashi MITSUYA, Keiichi KURASHINA
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Patent number: 9786532Abstract: A substrate processing apparatus is described herein. The substrate processing apparatus comprises a transferring device including: a grasping section configured to grasp a substrate holder, a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.Type: GrantFiled: March 23, 2015Date of Patent: October 10, 2017Assignee: EBARA CORPORATIONInventors: Toshio Yokoyama, Masahiko Sekimoto, Kenichi Kobayashi, Kenichi Akazawa, Takashi Mitsuya, Keiichi Kurashina
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Patent number: 9633898Abstract: An etching liquid which can selectively remove only a copper layer in an etching process of a multilayer structure including a cobalt layer and the copper layer is disclosed. The etching liquid is an etching liquid for etching the copper layer in the multilayer structure including the copper layer and the cobalt layer. This etching liquid includes at least one acid selected from a group consisting of citric acid, oxalic acid, malic acid, and malonic acid, and hydrogen peroxide, the etching liquid having pH in a range of 4.3 to 5.5.Type: GrantFiled: October 22, 2015Date of Patent: April 25, 2017Assignee: Ebara CorporationInventors: Akira Susaki, Keiichi Kurashina
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Patent number: 9556533Abstract: A substrate processing apparatus includes a plurality of inlet pipes and a plurality of outlet pipes, connected to a processing tank and configured to be switched therebetween to create a flow of a processing liquid in the processing tank in a direction different from that of the processing liquid before the switching. The inlet pipes and the outlet pipes are each provided with a flow control device which is controlled by a control section so that upon the switching, a flow rate of the processing liquid flowing therethrough changes with time.Type: GrantFiled: August 13, 2012Date of Patent: January 31, 2017Assignee: EBARA CORPORATIONInventors: Keiichi Kurashina, Tsutomu Nakada
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Publication number: 20160284571Abstract: The substrate processing apparatus includes a processing chamber including an outer chamber configured to hold a processing liquid and an inner chamber capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted. The guide cover is located below an upper end of the outer chamber and above the inner chamber.Type: ApplicationFiled: March 21, 2016Publication date: September 29, 2016Inventors: Keiichi KURASHINA, Toshio YOKOYAMA
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Publication number: 20160042993Abstract: An etching liquid which can selectively remove only a copper layer in an etching process of a multilayer structure including a cobalt layer and the copper layer is disclosed. The etching liquid is an etching liquid for etching the copper layer in the multilayer structure including the copper layer and the cobalt layer. This etching liquid includes at least one acid selected from a group consisting of citric acid, oxalic acid, malic acid, and malonic acid, and hydrogen peroxide, the etching liquid having pH in a range of 4.3 to 5.5.Type: ApplicationFiled: October 22, 2015Publication date: February 11, 2016Inventors: Akira SUSAKI, Keiichi KURASHINA
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Publication number: 20150270151Abstract: A substrate processing apparatus according to the present invention comprises a transferring device including a grasping section configured to grasp a substrate holder, and a transferring section configured to transfer the substrate holder grasped by the grasping section, and a processing bath for storing a substrate held by the substrate holder so that a surface of the substrate is vertically oriented, and processing the substrate. The grasping section is configured to grasp the substrate holder with a surface of the substrate oriented horizontally. The transferring section is configured to transfer the substrate holder above the processing bath, with the surface of the substrate oriented horizontally.Type: ApplicationFiled: March 23, 2015Publication date: September 24, 2015Inventors: Toshio YOKOYAMA, Masahiko SEKIMOTO, Kenichi KOBAYASHI, Kenichi AKAZAWA, Takashi MITSUYA, Keiichi KURASHINA
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Publication number: 20150270147Abstract: A substrate processing apparatus capable of inhibiting diffusion of a chemical solution atmosphere around a processing bath. The substrate processing apparatus has a processing bath for storing a substrate holder holding a substrate and for processing the substrate, a lifter configured to support the substrate holder, store the substrate holder in the processing bath, and take out the substrate holder from the processing bath, and a cover configured to cover the periphery of the substrate holder taken out from the processing bath by the lifter.Type: ApplicationFiled: March 23, 2015Publication date: September 24, 2015Inventors: Kenichi KOBAYASHI, Masahiko SEKIMOTO, Toshio YOKOYAMA, Kenichi AKAZAWA, Keiichi KURASHINA, Takashi MITSUYA
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Publication number: 20150191830Abstract: An etching Liquid which can selectively remove only a copper layer in an etching process of a multilayer structure including a cobalt layer and the copper layer is disclosed. The etching liquid is an etching liquid for etching the copper layer in the multilayer structure including the copper layer and the cobalt layer. This etching liquid includes at least one acid selected from a group consisting of citric acid, oxalic acid, malic acid, and malonic acid, and hydrogen peroxide, the etching liquid having pH in a range of 4.3 to 5.5.Type: ApplicationFiled: January 5, 2015Publication date: July 9, 2015Inventors: Akira SUSAKI, Keiichi KURASHINA
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Publication number: 20130056361Abstract: A substrate processing apparatus can arbitrarily switch the flow direction of a processing liquid without causing a change in the overall flow rate of the processing liquid nor creating a non-uniform flow of the processing liquid. The substrate processing apparatus includes a plurality of inlet pipes and a plurality of outlet pipes, connected to a processing tank and to be switched therebetween to create a flow of a processing liquid in the processing tank in a direction different from that of the processing liquid before the switching. The inlet pipes and the outlet pipes are each provided with a flow control device which is controlled by a control section so that upon switching between the pipes, the flow rate of the processing liquid flowing therethrough changes with time.Type: ApplicationFiled: August 13, 2012Publication date: March 7, 2013Inventors: Keiichi KURASHINA, Tsutomu Nakada
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Patent number: 8029653Abstract: An electroplating apparatus can form a plated film having a more uniform thickness and good film quality over an entire surface of a substrate having a conductive layer (seed layer) whose resistivity is equal to or higher than that of copper.Type: GrantFiled: February 21, 2007Date of Patent: October 4, 2011Assignee: Ebara CorporationInventors: Satoru Yamamoto, Keiichi Kurashina, Takashi Kawakami, Tsutomu Nakada, Hiroyuki Kanda, Junji Kunisawa, Kunihito Ide
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Publication number: 20100219078Abstract: A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.Type: ApplicationFiled: April 30, 2010Publication date: September 2, 2010Inventors: Keiichi KURASHINA, Mizuki Nagai, Satoru Yamamoto, Hiroyuki Kanda, Koji Mishima, Shinya Morisawa, Junji Kunisawa, Kunihito Ide, Hidenao Suzuki, Emanuel Cooper, Philippe Vereecken, Brett Baker-O'Neal, Hariklia Deligianni
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Publication number: 20100163408Abstract: A plating apparatus can form a plated film having a more uniform thickness over an entire surface of a substrate and can securely fill interconnect recesses with the metal without forming voids in the embedded metal even when the substrate has a high sheet resistance in the surface. The plating apparatus includes a substrate holder for holding a substrate, a cathode portion including a cathode for contact with the substrate held by the substrate holder to feed electricity to the substrate, and an anode, partly or wholly having a high resistance, disposed opposite a surface of the substrate held by the substrate holder, wherein plating of the surface of the substrate is carried out while filling between the anode and the substrate held by the substrate holder with a plating solution.Type: ApplicationFiled: March 4, 2010Publication date: July 1, 2010Inventors: Keiichi Kurashina, Tsutomu Nakada, Takashi Kawakami, Satoru Yamamoto, Keisuke Hayabusa
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Patent number: 7736474Abstract: A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.Type: GrantFiled: October 7, 2005Date of Patent: June 15, 2010Assignees: Ebara Corporation, International Business Machines CorporationInventors: Keiichi Kurashina, Mizuki Nagai, Satoru Yamamoto, Hiroyuki Kanda, Koji Mishima, Shinya Morisawa, Junji Kunisawa, Kunihito Ide, Hidenao Suzuki, Emanuel Cooper, Philippe Vereecken, Brett Baker-O'Neal, Hariklia Deligianni