Patents by Inventor Keiichi Miyajima
Keiichi Miyajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11955799Abstract: Provided is a supply-and-demand management apparatus including: a result management unit that manages a power supply result indicating a result of power supplied among a plurality of customers of a community; and a deriving unit that derives, based on power supply results from a first customer to other customers from among the plurality of customers, an incentive to supply power from the first customer to a second customer from among the other customers.Type: GrantFiled: September 3, 2020Date of Patent: April 9, 2024Assignee: HONDA MOTOR CO., LTD.Inventors: Takayuki Yamada, Koichiro Takemasa, Kazuyoshi Miyajima, Keiichi Takikawa, Yuiko Koga
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Patent number: 11946847Abstract: An extracellular potential measurement device includes multiple insulating films each of which is made from an electric insulating material, the insulating films being stacked and bonded to each other; and multiple electrode wires each of which is made from an electroconductive material, the electrode wires being arranged in multiple heights. Each of the electrode wires is interposed between an upper insulating film and a lower insulating film. Each of the insulating films, except for a lowermost insulating film, has an opening penetrating the insulating film. The opening in a lower insulating film has a size that is less than that of the opening in an upper insulating film, the openings in the insulating films being overlapped to form a recess having a size reducing downward, the recess being adapted to store a collection of cells. Each of the electrode wires has an end that is located near an opening in an insulating film that is immediately below the electrode wire, the ends being exposed in the recess.Type: GrantFiled: October 1, 2020Date of Patent: April 2, 2024Assignees: NOK CORPORATION, THE UNIVERSITY OF TOKYOInventors: Takayuki Komori, Keiichi Miyajima, SooHyeon Kim, Teruo Fujii, Shinji Okawa
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Publication number: 20220397511Abstract: An extracellular potential measurement device includes multiple insulating films each of which is made from an electric insulating material, the insulating films being stacked and bonded to each other; and multiple electrode wires each of which is made from an electroconductive material, the electrode wires being arranged in multiple heights. Each of the electrode wires is interposed between an upper insulating film and a lower insulating film. Each of the insulating films, except for a lowermost insulating film, has an opening penetrating the insulating film. The opening in a lower insulating film has a size that is less than that of the opening in an upper insulating film, the openings in the insulating films being overlapped to form a recess having a size reducing downward, the recess being adapted to store a collection of cells. Each of the electrode wires has an end that is located near an opening in an insulating film that is immediately below the electrode wire, the ends being exposed in the recess.Type: ApplicationFiled: October 1, 2020Publication date: December 15, 2022Inventors: Takayuki KOMORI, Keiichi MIYAJIMA, SooHyeon KIM, Teruo FUJII, Shinji OKAWA
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Publication number: 20190138876Abstract: An IC tag is provided that reduces the size of a folded dipole antenna. The IC tag includes an IC chip and an antenna electrically connected with the IC chip. The antenna has a first linear portion, bent portions at both ends of the first linear portion, and second linear portions extending from the bent portions on both ends of the first linear portion, distal ends of the second-straight line portions face each other. Bent space portions are at both sides of space defined by the bent portions on both ends of the first linear portion, the first linear portion, and the second linear portions. A communication enhancer that tunes a resonant frequency to a desired frequency is provided near the distal ends of the second linear portions and provided at least inside or outside of space extending from one bent space portion to the other bent space portion.Type: ApplicationFiled: March 27, 2017Publication date: May 9, 2019Inventors: Tomoko NAKANO, Takeshi YAMADA, Keiichi MIYAJIMA
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Patent number: 10037485Abstract: Provided is an IC tag favorably applicable even to linen products. An IC tag 100 using a magnetic field type tag unit 110 in which an IC chip and a coil antenna to be electrically connected to the IC chip are embedded inside a hard resin material. The IC tag includes: a flexible film made of resin (a base film 121, a cover film 123, and a protective film 124); and an auxiliary antenna 122 formed on the film, wherein the magnetic field type tag unit 110 is fixed to the film by an adhesive 130 with elasticity at a position that enables communication by electromagnetic coupling between the coil antenna and the auxiliary antenna 122.Type: GrantFiled: December 17, 2014Date of Patent: July 31, 2018Assignee: NOK CORPORATIONInventors: Tomoko Nakano, Naohiro Fujisawa, Keiichi Miyajima
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Publication number: 20170032233Abstract: Provided is an IC tag favorably applicable even to linen products. An IC tag 100 using a magnetic field type tag unit 110 in which an IC chip and a coil antenna to be electrically connected to the IC chip are embedded inside a hard resin material. The IC tag includes: a flexible film made of resin (a base film 121, a cover film 123, and a protective film 124); and an auxiliary antenna 122 formed on the film, wherein the magnetic field type tag unit 110 is fixed to the film by an adhesive 130 with elasticity at a position that enables communication by electromagnetic coupling between the coil antenna and the auxiliary antenna 122.Type: ApplicationFiled: December 17, 2014Publication date: February 2, 2017Applicant: NOK CORPORATIONInventors: Tomoko NAKANO, Naohiro FUJISAWA, Keiichi MIYAJIMA
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Patent number: 9324019Abstract: There is provided an IC tag that is simple in structure and in which concentration of stress in a portion near the connection of an IC chip and an antenna part can be reduced. The IC tag 100 includes a film member 10, an antenna part 20 provided on the film member 10, an IC chip 30 mounted on the film member 10 in such a way as to be connected with the antenna part 20. A slit 51 is provided at a position away from the antenna part 20 in the region on the film member 10 near the site at which the IC chip 30 is mounted, and a covering 41 made of an elastic material is provided to cover at least the entire area of the IC chip 30 and a portion of connection of the IC chip 30 and the antenna part 20.Type: GrantFiled: January 25, 2013Date of Patent: April 26, 2016Assignee: NOK CORPORATIONInventors: Tomoko Nakano, Keiichi Miyajima
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Patent number: 9183484Abstract: The disclosure prevents, with improved reliability, an IC tag from being broken, while ensuring overall flexibility of the IC tag. The IC tag 100 is provided with a covering 140 made of an elastic material, which covers at least the side of the IC tag 100 on which an IC chip 130 is mounted and has a thickness that is larger in its portion 140a that covers a region about the IC chip 130 than in its portion 140b that covers a region outside the region about the IC chip 130. The covering 140 is configured in such a way that at least a part of a boundary of the portion 140a of the covering that covers the region about the IC chip 130 and the portion 140b of the covering that covers the region outside the region about the IC chip 130 has a curved shape.Type: GrantFiled: April 15, 2013Date of Patent: November 10, 2015Assignee: NOK CORPORATIONInventors: Tomoko Nakano, Naohiro Fujisawa, Keiichi Miyajima, Kenji Minoshima
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Publication number: 20150294211Abstract: There is provided an IC tag that is simple in structure and in which concentration of stress in a portion near the connection of an IC chip and an antenna part can be reduced. The IC tag 100 includes a film member 10, an antenna part 20 provided on the film member 10, an IC chip 30 mounted on the film member 10 in such a way as to be connected with the antenna part 20. A slit 51 is provided at a position away from the antenna part 20 in the region on the film member 10 near the site at which the IC chip 30 is mounted, and a covering 41 made of an elastic material is provided to cover at least the entire area of the IC chip 30 and a portion of connection of the IC chip 30 and the antenna part 20.Type: ApplicationFiled: January 25, 2013Publication date: October 15, 2015Inventors: Tomoko NAKANO, Keiichi MIYAJIMA
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Publication number: 20150122891Abstract: The disclosure prevents, with improved reliability, an IC tag from being broken, while ensuring overall flexibility of the IC tag. The IC tag 100 is provided with a covering 140 made of an elastic material, which covers at least the side of the IC tag 100 on which an IC chip 130 is mounted and has a thickness that is larger in its portion 140a that covers a region about the IC chip 130 than in its portion 140b that covers a region outside the region about the IC chip 130. The covering 140 is configured in such a way that at least a part of a boundary of the portion 140a of the covering that covers the region about the IC chip 130 and the portion 140b of the covering that covers the region outside the region about the IC chip 130 has a curved shape.Type: ApplicationFiled: April 15, 2013Publication date: May 7, 2015Inventors: Tomoko Nakano, Naohiro Fujisawa, Keiichi Miyajima, Kenji Minoshima
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Patent number: 8833772Abstract: In order to enhance a shape retaining property of a gasket consisting only of a rubber, prevent damage to a casing for an electronic equipment due to high reactive force of the gasket, and make assembling of the casing easy, a seal structure comprises a gasket installed in a non-adhesion manner between a case and a lid to be interposed in a compressed state when the case and the lid are assembled, and a resin film integrated with the gasket to enhance the shape retaining property of the gasket, the gasket has a portion compressed between the case and the lid when they are assembled, and a portion not compressed between them when assembled and the resin film is integrated with the portion which is not compressed.Type: GrantFiled: August 6, 2009Date of Patent: September 16, 2014Assignee: Nippon Mektron, Ltd.Inventors: Takashi Sasaki, Tomoko Nakano, Naohiro Fujisawa, Keiichi Miyajima
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Patent number: 8835761Abstract: To minimize thermal influence when integrally forming the sealing member on a flexible wiring board, a sealing structure includes a housing, a flexible wiring board inserted therethrough, and a sealing member integrally formed with the flexible wiring board to airtightly seal a gap between the housing and the flexible wiring board, the flexible wiring board includes a base substrate made of an elastic material, an electrically conductive printed wiring layer formed on a surface of the base substrate, and a cover film covering a surface of the printed wiring layer, and the printed wiring layer which crosses the sealing member is formed as a plurality of divided print wiring layers at only a crossing region with the sealing member and its vicinity.Type: GrantFiled: March 7, 2008Date of Patent: September 16, 2014Assignee: NOK CorporationInventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
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Patent number: 8575499Abstract: To provide a seal structure having seal members which can be easily inserted into insertion holes of a housing, and achieve an excellent sealing performance of the seal members, the seal structure is comprised of a housing provided with insertion holes to which a flexible wiring substrate is inserted, and seal members which are integrally formed on the flexible wiring substrate are made of a rubber elastic material in a bush-shape, and hermetically seal gaps between the insertion holes and the flexible wiring substrate, wherein projected portions are provided on parts of the flexible wiring substrate at positions where the seal members are integrally formed.Type: GrantFiled: April 26, 2010Date of Patent: November 5, 2013Assignee: Nippon Mektron, Ltd.Inventors: Takahiro Hayashi, Keiichi Miyajima
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Patent number: 8178794Abstract: To eliminate rubber burr formation at the time of molding and to make sealing members to be surely integrated with the flexible wiring board, a sealing structure consists of housings to which the flexible wiring board is inserted, and sealing members integrally formed on the flexible wiring board to seal gaps between the housings and the flexible wiring board, the flexible wiring board consists of a base board made of an elastic material, a conductive printed wiring layer formed on the surface of the base board, and a cover film covering the surface of the printed wiring layer, and dummy printed wiring layers are arranged in regions where the sealing members are integrated with the flexible wiring board, so as to make a shape as if the printed wiring layer exists substantially over the entire base board in the width direction.Type: GrantFiled: March 7, 2008Date of Patent: May 15, 2012Assignee: NOK CorporationInventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
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Patent number: 8003898Abstract: To provide a seal structure which has a seal member integrally formed on a flexible wiring board without peeling off an insulating layer (top coat) of the flexible wiring board, has excellent sealing performance and can be manufactured at a low cost, the seal structure is composed of a housing, to which the flexible wiring board is inserted, and the seal member, which is integrally formed with the flexible wiring board and seals a gap between the housing and the flexible wiring board, the flexible wiring board is composed of a base FPC composed of an elastic material, a patterned copper foil and an adhesive layer, conductive electromagnetic shielding layers formed on surfaces of the base FPC, and insulating layers covering surfaces of the electromagnetic shielding layers, and the seal member is integrally formed directly on the insulating layers by using a self-adhesive liquid rubber.Type: GrantFiled: September 10, 2007Date of Patent: August 23, 2011Assignee: NOK CorporationInventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
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Publication number: 20110181003Abstract: To provide a seal structure having seal members which can be easily inserted into insertion holes of a housing, and achieve an excellent sealing performance of the seal members, the seal structure is comprised of a housing provided with insertion holes to which a flexible wiring substrate is inserted, and seal members which are integrally formed on the flexible wiring substrate are made of a rubber elastic material in a bush-shape, and hermetically seal gaps between the insertion holes and the flexible wiring substrate, wherein projected portions are provided on parts of the flexible wiring substrate at positions where the seal members are integrally formed.Type: ApplicationFiled: April 26, 2010Publication date: July 28, 2011Applicant: NOK CORPORATIONInventors: Takahiro Hayashi, Keiichi Miyajima
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Publication number: 20110140375Abstract: In order to enhance a shape retaining property of a gasket consisting only of a rubber, prevent damage to a casing for an electronic equipment due to high reactive force of the gasket, and make assembling of the casing easy, a seal structure comprises a gasket installed in a non-adhesion manner between a case and a lid to be interposed in a compressed state when the case and the lid are assembled, and a resin film integrated with the gasket to enhance the shape retaining property of the gasket, the gasket has a portion compressed between the case and the lid when they are assembled, and a portion not compressed between them when assembled and the resin film is integrated with the portion which is not compressed.Type: ApplicationFiled: August 6, 2009Publication date: June 16, 2011Applicant: NOK CORPORATIONInventors: Takashi Sasaki, Tomoko Nakano, Naohiro Fujisawa, Keiichi Miyajima
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Patent number: D712854Type: GrantFiled: October 17, 2013Date of Patent: September 9, 2014Assignee: NOK CorporationInventors: Tomoko Nakano, Keiichi Miyajima
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Patent number: D731990Type: GrantFiled: October 17, 2012Date of Patent: June 16, 2015Assignee: NOK CORPORATIONInventors: Tomoko Nakano, Naohiro Fujisawa, Keiichi Miyajima, Kenji Minoshima
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Patent number: D770991Type: GrantFiled: May 1, 2014Date of Patent: November 8, 2016Assignee: NOK CorporationInventors: Tomoko Nakano, Naohiro Fujisawa, Keiichi Miyajima