Patents by Inventor Keiichi Miyajima

Keiichi Miyajima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11955799
    Abstract: Provided is a supply-and-demand management apparatus including: a result management unit that manages a power supply result indicating a result of power supplied among a plurality of customers of a community; and a deriving unit that derives, based on power supply results from a first customer to other customers from among the plurality of customers, an incentive to supply power from the first customer to a second customer from among the other customers.
    Type: Grant
    Filed: September 3, 2020
    Date of Patent: April 9, 2024
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Takayuki Yamada, Koichiro Takemasa, Kazuyoshi Miyajima, Keiichi Takikawa, Yuiko Koga
  • Patent number: 11946847
    Abstract: An extracellular potential measurement device includes multiple insulating films each of which is made from an electric insulating material, the insulating films being stacked and bonded to each other; and multiple electrode wires each of which is made from an electroconductive material, the electrode wires being arranged in multiple heights. Each of the electrode wires is interposed between an upper insulating film and a lower insulating film. Each of the insulating films, except for a lowermost insulating film, has an opening penetrating the insulating film. The opening in a lower insulating film has a size that is less than that of the opening in an upper insulating film, the openings in the insulating films being overlapped to form a recess having a size reducing downward, the recess being adapted to store a collection of cells. Each of the electrode wires has an end that is located near an opening in an insulating film that is immediately below the electrode wire, the ends being exposed in the recess.
    Type: Grant
    Filed: October 1, 2020
    Date of Patent: April 2, 2024
    Assignees: NOK CORPORATION, THE UNIVERSITY OF TOKYO
    Inventors: Takayuki Komori, Keiichi Miyajima, SooHyeon Kim, Teruo Fujii, Shinji Okawa
  • Publication number: 20220397511
    Abstract: An extracellular potential measurement device includes multiple insulating films each of which is made from an electric insulating material, the insulating films being stacked and bonded to each other; and multiple electrode wires each of which is made from an electroconductive material, the electrode wires being arranged in multiple heights. Each of the electrode wires is interposed between an upper insulating film and a lower insulating film. Each of the insulating films, except for a lowermost insulating film, has an opening penetrating the insulating film. The opening in a lower insulating film has a size that is less than that of the opening in an upper insulating film, the openings in the insulating films being overlapped to form a recess having a size reducing downward, the recess being adapted to store a collection of cells. Each of the electrode wires has an end that is located near an opening in an insulating film that is immediately below the electrode wire, the ends being exposed in the recess.
    Type: Application
    Filed: October 1, 2020
    Publication date: December 15, 2022
    Inventors: Takayuki KOMORI, Keiichi MIYAJIMA, SooHyeon KIM, Teruo FUJII, Shinji OKAWA
  • Publication number: 20190138876
    Abstract: An IC tag is provided that reduces the size of a folded dipole antenna. The IC tag includes an IC chip and an antenna electrically connected with the IC chip. The antenna has a first linear portion, bent portions at both ends of the first linear portion, and second linear portions extending from the bent portions on both ends of the first linear portion, distal ends of the second-straight line portions face each other. Bent space portions are at both sides of space defined by the bent portions on both ends of the first linear portion, the first linear portion, and the second linear portions. A communication enhancer that tunes a resonant frequency to a desired frequency is provided near the distal ends of the second linear portions and provided at least inside or outside of space extending from one bent space portion to the other bent space portion.
    Type: Application
    Filed: March 27, 2017
    Publication date: May 9, 2019
    Inventors: Tomoko NAKANO, Takeshi YAMADA, Keiichi MIYAJIMA
  • Patent number: 10037485
    Abstract: Provided is an IC tag favorably applicable even to linen products. An IC tag 100 using a magnetic field type tag unit 110 in which an IC chip and a coil antenna to be electrically connected to the IC chip are embedded inside a hard resin material. The IC tag includes: a flexible film made of resin (a base film 121, a cover film 123, and a protective film 124); and an auxiliary antenna 122 formed on the film, wherein the magnetic field type tag unit 110 is fixed to the film by an adhesive 130 with elasticity at a position that enables communication by electromagnetic coupling between the coil antenna and the auxiliary antenna 122.
    Type: Grant
    Filed: December 17, 2014
    Date of Patent: July 31, 2018
    Assignee: NOK CORPORATION
    Inventors: Tomoko Nakano, Naohiro Fujisawa, Keiichi Miyajima
  • Publication number: 20170032233
    Abstract: Provided is an IC tag favorably applicable even to linen products. An IC tag 100 using a magnetic field type tag unit 110 in which an IC chip and a coil antenna to be electrically connected to the IC chip are embedded inside a hard resin material. The IC tag includes: a flexible film made of resin (a base film 121, a cover film 123, and a protective film 124); and an auxiliary antenna 122 formed on the film, wherein the magnetic field type tag unit 110 is fixed to the film by an adhesive 130 with elasticity at a position that enables communication by electromagnetic coupling between the coil antenna and the auxiliary antenna 122.
    Type: Application
    Filed: December 17, 2014
    Publication date: February 2, 2017
    Applicant: NOK CORPORATION
    Inventors: Tomoko NAKANO, Naohiro FUJISAWA, Keiichi MIYAJIMA
  • Patent number: 9324019
    Abstract: There is provided an IC tag that is simple in structure and in which concentration of stress in a portion near the connection of an IC chip and an antenna part can be reduced. The IC tag 100 includes a film member 10, an antenna part 20 provided on the film member 10, an IC chip 30 mounted on the film member 10 in such a way as to be connected with the antenna part 20. A slit 51 is provided at a position away from the antenna part 20 in the region on the film member 10 near the site at which the IC chip 30 is mounted, and a covering 41 made of an elastic material is provided to cover at least the entire area of the IC chip 30 and a portion of connection of the IC chip 30 and the antenna part 20.
    Type: Grant
    Filed: January 25, 2013
    Date of Patent: April 26, 2016
    Assignee: NOK CORPORATION
    Inventors: Tomoko Nakano, Keiichi Miyajima
  • Patent number: 9183484
    Abstract: The disclosure prevents, with improved reliability, an IC tag from being broken, while ensuring overall flexibility of the IC tag. The IC tag 100 is provided with a covering 140 made of an elastic material, which covers at least the side of the IC tag 100 on which an IC chip 130 is mounted and has a thickness that is larger in its portion 140a that covers a region about the IC chip 130 than in its portion 140b that covers a region outside the region about the IC chip 130. The covering 140 is configured in such a way that at least a part of a boundary of the portion 140a of the covering that covers the region about the IC chip 130 and the portion 140b of the covering that covers the region outside the region about the IC chip 130 has a curved shape.
    Type: Grant
    Filed: April 15, 2013
    Date of Patent: November 10, 2015
    Assignee: NOK CORPORATION
    Inventors: Tomoko Nakano, Naohiro Fujisawa, Keiichi Miyajima, Kenji Minoshima
  • Publication number: 20150294211
    Abstract: There is provided an IC tag that is simple in structure and in which concentration of stress in a portion near the connection of an IC chip and an antenna part can be reduced. The IC tag 100 includes a film member 10, an antenna part 20 provided on the film member 10, an IC chip 30 mounted on the film member 10 in such a way as to be connected with the antenna part 20. A slit 51 is provided at a position away from the antenna part 20 in the region on the film member 10 near the site at which the IC chip 30 is mounted, and a covering 41 made of an elastic material is provided to cover at least the entire area of the IC chip 30 and a portion of connection of the IC chip 30 and the antenna part 20.
    Type: Application
    Filed: January 25, 2013
    Publication date: October 15, 2015
    Inventors: Tomoko NAKANO, Keiichi MIYAJIMA
  • Publication number: 20150122891
    Abstract: The disclosure prevents, with improved reliability, an IC tag from being broken, while ensuring overall flexibility of the IC tag. The IC tag 100 is provided with a covering 140 made of an elastic material, which covers at least the side of the IC tag 100 on which an IC chip 130 is mounted and has a thickness that is larger in its portion 140a that covers a region about the IC chip 130 than in its portion 140b that covers a region outside the region about the IC chip 130. The covering 140 is configured in such a way that at least a part of a boundary of the portion 140a of the covering that covers the region about the IC chip 130 and the portion 140b of the covering that covers the region outside the region about the IC chip 130 has a curved shape.
    Type: Application
    Filed: April 15, 2013
    Publication date: May 7, 2015
    Inventors: Tomoko Nakano, Naohiro Fujisawa, Keiichi Miyajima, Kenji Minoshima
  • Patent number: 8833772
    Abstract: In order to enhance a shape retaining property of a gasket consisting only of a rubber, prevent damage to a casing for an electronic equipment due to high reactive force of the gasket, and make assembling of the casing easy, a seal structure comprises a gasket installed in a non-adhesion manner between a case and a lid to be interposed in a compressed state when the case and the lid are assembled, and a resin film integrated with the gasket to enhance the shape retaining property of the gasket, the gasket has a portion compressed between the case and the lid when they are assembled, and a portion not compressed between them when assembled and the resin film is integrated with the portion which is not compressed.
    Type: Grant
    Filed: August 6, 2009
    Date of Patent: September 16, 2014
    Assignee: Nippon Mektron, Ltd.
    Inventors: Takashi Sasaki, Tomoko Nakano, Naohiro Fujisawa, Keiichi Miyajima
  • Patent number: 8835761
    Abstract: To minimize thermal influence when integrally forming the sealing member on a flexible wiring board, a sealing structure includes a housing, a flexible wiring board inserted therethrough, and a sealing member integrally formed with the flexible wiring board to airtightly seal a gap between the housing and the flexible wiring board, the flexible wiring board includes a base substrate made of an elastic material, an electrically conductive printed wiring layer formed on a surface of the base substrate, and a cover film covering a surface of the printed wiring layer, and the printed wiring layer which crosses the sealing member is formed as a plurality of divided print wiring layers at only a crossing region with the sealing member and its vicinity.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: September 16, 2014
    Assignee: NOK Corporation
    Inventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
  • Patent number: 8575499
    Abstract: To provide a seal structure having seal members which can be easily inserted into insertion holes of a housing, and achieve an excellent sealing performance of the seal members, the seal structure is comprised of a housing provided with insertion holes to which a flexible wiring substrate is inserted, and seal members which are integrally formed on the flexible wiring substrate are made of a rubber elastic material in a bush-shape, and hermetically seal gaps between the insertion holes and the flexible wiring substrate, wherein projected portions are provided on parts of the flexible wiring substrate at positions where the seal members are integrally formed.
    Type: Grant
    Filed: April 26, 2010
    Date of Patent: November 5, 2013
    Assignee: Nippon Mektron, Ltd.
    Inventors: Takahiro Hayashi, Keiichi Miyajima
  • Patent number: 8178794
    Abstract: To eliminate rubber burr formation at the time of molding and to make sealing members to be surely integrated with the flexible wiring board, a sealing structure consists of housings to which the flexible wiring board is inserted, and sealing members integrally formed on the flexible wiring board to seal gaps between the housings and the flexible wiring board, the flexible wiring board consists of a base board made of an elastic material, a conductive printed wiring layer formed on the surface of the base board, and a cover film covering the surface of the printed wiring layer, and dummy printed wiring layers are arranged in regions where the sealing members are integrated with the flexible wiring board, so as to make a shape as if the printed wiring layer exists substantially over the entire base board in the width direction.
    Type: Grant
    Filed: March 7, 2008
    Date of Patent: May 15, 2012
    Assignee: NOK Corporation
    Inventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
  • Patent number: 8003898
    Abstract: To provide a seal structure which has a seal member integrally formed on a flexible wiring board without peeling off an insulating layer (top coat) of the flexible wiring board, has excellent sealing performance and can be manufactured at a low cost, the seal structure is composed of a housing, to which the flexible wiring board is inserted, and the seal member, which is integrally formed with the flexible wiring board and seals a gap between the housing and the flexible wiring board, the flexible wiring board is composed of a base FPC composed of an elastic material, a patterned copper foil and an adhesive layer, conductive electromagnetic shielding layers formed on surfaces of the base FPC, and insulating layers covering surfaces of the electromagnetic shielding layers, and the seal member is integrally formed directly on the insulating layers by using a self-adhesive liquid rubber.
    Type: Grant
    Filed: September 10, 2007
    Date of Patent: August 23, 2011
    Assignee: NOK Corporation
    Inventors: Takahiro Hayashi, Makoto Hora, Keiichi Miyajima
  • Publication number: 20110181003
    Abstract: To provide a seal structure having seal members which can be easily inserted into insertion holes of a housing, and achieve an excellent sealing performance of the seal members, the seal structure is comprised of a housing provided with insertion holes to which a flexible wiring substrate is inserted, and seal members which are integrally formed on the flexible wiring substrate are made of a rubber elastic material in a bush-shape, and hermetically seal gaps between the insertion holes and the flexible wiring substrate, wherein projected portions are provided on parts of the flexible wiring substrate at positions where the seal members are integrally formed.
    Type: Application
    Filed: April 26, 2010
    Publication date: July 28, 2011
    Applicant: NOK CORPORATION
    Inventors: Takahiro Hayashi, Keiichi Miyajima
  • Publication number: 20110140375
    Abstract: In order to enhance a shape retaining property of a gasket consisting only of a rubber, prevent damage to a casing for an electronic equipment due to high reactive force of the gasket, and make assembling of the casing easy, a seal structure comprises a gasket installed in a non-adhesion manner between a case and a lid to be interposed in a compressed state when the case and the lid are assembled, and a resin film integrated with the gasket to enhance the shape retaining property of the gasket, the gasket has a portion compressed between the case and the lid when they are assembled, and a portion not compressed between them when assembled and the resin film is integrated with the portion which is not compressed.
    Type: Application
    Filed: August 6, 2009
    Publication date: June 16, 2011
    Applicant: NOK CORPORATION
    Inventors: Takashi Sasaki, Tomoko Nakano, Naohiro Fujisawa, Keiichi Miyajima
  • Patent number: D712854
    Type: Grant
    Filed: October 17, 2013
    Date of Patent: September 9, 2014
    Assignee: NOK Corporation
    Inventors: Tomoko Nakano, Keiichi Miyajima
  • Patent number: D731990
    Type: Grant
    Filed: October 17, 2012
    Date of Patent: June 16, 2015
    Assignee: NOK CORPORATION
    Inventors: Tomoko Nakano, Naohiro Fujisawa, Keiichi Miyajima, Kenji Minoshima
  • Patent number: D770991
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: November 8, 2016
    Assignee: NOK Corporation
    Inventors: Tomoko Nakano, Naohiro Fujisawa, Keiichi Miyajima