Patents by Inventor Keiichi Nagasaki

Keiichi Nagasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8537351
    Abstract: An object mounting mechanism includes: a plate member on which an object is mounted. Bumps are arranged on an upper surface of the plate member which faces a reverse face of the object. In addition, the bumps are arranged sparsely in an area of a surrounding part of the plate member and densely toward an area of a center part of the plate member.
    Type: Grant
    Filed: May 16, 2012
    Date of Patent: September 17, 2013
    Assignee: Hitachi-High Technologies Corporation
    Inventors: Masami Ooyama, Kazuhiro Zama, Keiichi Nagasaki, Rieko Hachiya, Kimiko Hachiya
  • Publication number: 20120287425
    Abstract: An object mounting mechanism includes: a plate member on which an object is mounted. Bumps are arranged on an upper surface of the plate member which faces a reverse face of the object. In addition, the bumps are arranged sparsely in an area of a surrounding part of the plate member and densely toward an area of a center part of the plate member.
    Type: Application
    Filed: May 16, 2012
    Publication date: November 15, 2012
    Applicant: Hitachi High-Technologies Corporation
    Inventors: Masami OOYAMA, Masayuki HACHIYA, Rieko HACHIYA, Kimiko HACHIYA, Kazuhiro ZAMA, Keiichi NAGASAKI
  • Patent number: 8203705
    Abstract: The invention is directed to detect a warp amount in a real-time manner in a wafer rotating at high speed under inspection.
    Type: Grant
    Filed: January 8, 2009
    Date of Patent: June 19, 2012
    Assignee: Hitachi-High Technologies Corporation
    Inventors: Masami Ooyama, Masayuki Hachiya, Rieko Hachiya, legal representative, Kimiko Hachiya, legal representative, Kazuhiro Zama, Keiichi Nagasaki
  • Publication number: 20090187354
    Abstract: The invention is directed to detect a warp amount in a real-time manner in a wafer rotating at high speed under inspection.
    Type: Application
    Filed: January 8, 2009
    Publication date: July 23, 2009
    Inventors: Masami Ooyama, Masayuki Hachiya, Rieko Hachiya, Kimiko Hachiya, Kazuhiro Zama, Keiichi Nagasaki