Abstract: Provided is a brake bleeding device for bleeding air accumulated in brake fluid inside a braking device provided in a vehicle. The brake bleeding device includes: a master cylinder constituting a part of the braking device and provided inside a front-side storage chamber, the master cylinder being configured to generate brake hydraulic pressure in accordance with a stroke of an input piston; a brake pedal unit provided inside the front-side storage chamber and configured to give pressing force in a stroke direction to the input piston when a link mechanism connected to the input piston via a rod is operated; and an operating lever attached to the link mechanism in a state where the link mechanism is operable by the operating lever. The operating lever extends downward to a position where the operating lever is accessible from outside the front-side storage chamber.

Abstract: Provided is a brake bleeding device for bleeding air accumulated in brake fluid inside a braking device provided in a vehicle. The brake bleeding device includes: a master cylinder constituting a part of the braking device and provided inside a front-side storage chamber, the master cylinder being configured to generate brake hydraulic pressure in accordance with a stroke of an input piston; a brake pedal unit provided inside the front-side storage chamber and configured to give pressing force in a stroke direction to the input piston when a link mechanism connected to the input piston via a rod is operated; and an operating lever attached to the link mechanism in a state where the link mechanism is operable by the operating lever. The operating lever extends downward to a position where the operating lever is accessible from outside the front-side storage chamber.

Abstract: An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask 7 is formed on the bump formation side 3a of a metal foil 3 having a thickness (t1+t2) equal to the sum of the thickness t1 of a wiring circuit 1 and the height t2 of the bumps 2 to be formed on a wiring circuit 1, the bumps 2 are formed by half-etching the metal foil 3 from the bump formation etching mask 7 side down to a depth corresponding to a predetermined bump height t2, and a metal thin film layer 10 composed of a different metal from the metal foil 3 is formed on the bump formation side of the metal foil 3, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

Abstract: An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask 7 is formed on the bump formation side 3a of a metal foil 3 having a thickness (t1+t2) equal to the sum of the thickness t1 of a wiring circuit 1 and the height t2 of the bumps 2 to be formed on a wiring circuit 1, the bumps 2 are formed by half-etching the metal foil 3 from the bump formation etching mask 7 side down to a depth corresponding to a predetermined bump height t2, and a metal thin film layer 10 composed of a different metal from the metal foil 3 is formed on the bump formation side of the metal foil 3, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

Abstract: An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask (7) is formed on the bump formation side (3a) of a metal foil (3) having a thickness (t1+t2) equal to the sum of the thickness t1 of a wiring circuit (1) and the height t2 of the bumps (2) to be formed on a wiring circuit (1), the bumps (2) are formed by half-etching the metal foil (3) from the bump formation etching mask (7) side down to a depth corresponding to a predetermined bump height t2, and a metal thin film layer (10) composed of a different metal from the metal foil (3) is formed on the bump formation side of the metal foil (3), thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

Abstract: Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask 7 is formed on a bump-forming surface 3a of a metal foil 3 which has a thickness that is the sum of the thickness t1 of the wiring circuit 1 and the height t2 of the bumps 2 which are to be formed on the wiring circuit 1 (t1+t2), and then the bumps 2 are formed by half-etching the metal foil 3 to a depth corresponding to the desired bump height t2 from the bump-formation etching mask 7 side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.

Abstract: Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask 7 is formed on a bump-forming surface 3a of a metal foil 3 which has a thickness that is the sum of the thickness t1 of the wiring circuit 1 and the height t2 of the bumps 2 which are to be formed on the wiring circuit 1 (t1+t2), and then the bumps 2 are formed by half-etching the metal foil 3 to a depth corresponding to the desired bump height t2 from the bump-formation etching mask 7 side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.

Abstract: Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask 7 is formed on a bump-forming surface 3a of a metal foil 3 which has a thickness that is the sum of the thickness t1 of the wiring circuit 1 and the height t2 of the bumps 2 which are to be formed on the wiring circuit 1 (t1+t2), and then the bumps 2 are formed by half-etching the metal foil 3 to a depth corresponding to the desired bump height t2 from the bump-formation etching mask 7 side, wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other complex processes are rendered unnecessary.

Abstract: An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask 7 is formed on the bump formation side 3a of a metal foil 3 having a thickness (t1+t2) equal to the sum of the thickness t1 of a wiring circuit 1 and the height t2 of the bumps 2 to be formed on a wiring circuit 1, the bumps 2 are formed by half-etching the metal foil 3 from the bump formation etching mask 7 side down to a depth corresponding to a predetermined bump height t2, and a metal thin film layer 10 composed of a different metal from the metal foil 3 is formed on the bump formation side of the metal foil 3, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

Abstract: A bump formation etching mask is formed on the bump formation side of a metal foil having a thickness (t1+t2) equal to the sum of the thickness t1 of a wiring circuit and the height t2 of the bumps to be formed on a wiring circuit. The bumps are formed by half-etching the metal foil from the bump formation etching mask side down to a depth corresponding to a predetermined bump height t2. A metal thin film layer formed of a different metal from the metal foil is formed on the bump formation side of the metal foil, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations, such as plating pretreatments.

Abstract: An object of the present invention is to manufacture a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments. A bump formation etching mask 7 is formed on the bump formation side 3a of a metal foil 3 having a thickness (t1+t2) equal to the sum of the thickness t1 of a wiring circuit 1 and the height t2 of the bumps 2 to be formed on a wiring circuit 1, the bumps 2 are formed by half-etching the metal foil 3 from the bump formation etching mask 7 side down to a depth corresponding to a predetermined bump height t2, and a metal thin film layer 10 composed of a different metal from the metal foil 3 is formed on the bump formation side of the metal foil 3, thereby providing a bump-attached wiring circuit board with which stable bump connections are possible, and there is no need for bothersome operations such as plating pretreatments.

Abstract: The non-flammable adhesive compositions contain 100 parts by weight of a brominated epoxy resin such as a bisphenol type brominated epoxy resin or a novolak type brominated epoxy resin; 40-80 parts by weight of an acrylic copolymer and 5-20 parts by weight of a brominated polyvinyl phenol, said acrylic copolymer being prepared by copolymerizing (a) 5-35% by weight of acrylonitrile, (b) 0.5-10% by weight of an ethylenically unsaturated compound having at least one functional group selected from carboxyl, hydroxyl and epoxy group, and (c) substantially the balance of an ester obtainable from an alcohol having from 1 to 6 carbon atoms and acrylic acid and/or methacrylic acid.

Abstract: A method for the manufacture of an adhesive suitable for use with polyvinylfluoride sheets which includes the steps of copolymerizing a vinyl compound and a vinyl compound having an epoxy group and then treating the copolymer thus produced with aqueous ammonia to aminate the epoxy group.

Abstract: A thermosetting resin composition having improved properties as an electrical insulating material and being particularly suited for use in printed circuit boards, consists essentially of an acryloyloxyl- or methacryloyloxyl- terminated butadiene homopolymer or copolymer, for example, with acrylonitrile or styrene, an ethylenically unsaturated monomer capable of copolymerizing with the terminating acryloyloxyl or methacryloyloxyl groups of the butadiene homopolymer or copolymer, and an acid anhydride containing at least one ethylenically unsaturated group in its molecule. In preferred compositions of the invention, there are from 1.5 to 3.0 terminating acryloyloxyl or methacryloyloxyl groups per molecule of the butadiene homopolymer or copolymer, and the amounts of the ethylenically unsaturated monomer and of the acid anhydride are from 50 to 200 weight percent and from 5 to 20 weight percent, respectively, based on the weight of the terminated butadiene homopolymer or copolymer.

Abstract: A flame retardant thermosetting resin composition having improved properties as an electrical insulating material and being particularly suited for use in printed circuit boards composed essentially of acryloyloxy- or methacryloyloxy-terminated butadiene homopolymer or butadiene copolymer with, for example, acrylonitrile or styrene, ethylenically unsaturated monomer capable of copolymerizing with the terminating acryloyloxy- or methacryloyloxy- groups of the butadiene homopolymer or copolymer, which monomer has a substantial amount of haloaryl, and acid anhydride having at least one ethylenically unsaturated group. In preferred compositions of the invention, there are from 1.5 to 3.