Abstract: In a displacement detection device having an IC chip for a regulation plate, silicon broken pieces might drop from loose chippings during assembling or using the device and affect properties of the displacement detection device. By setting an angle of grinding traces on an IC chip wafer of chip with a vertical line on side ridges of the IC chip to less than 45 degrees, more preferably 10 to 45 degrees, the chippings including loose chippings can be reduced on the side ridges of the IC chip. Using of an IC chip having loose chippings on side ridges for a regulation plate can be avoided, and a highly reliable displacement detection device can be provided.