Patents by Inventor Keiichi Ohtsubo

Keiichi Ohtsubo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic package with plurality of solder-applied areas providing heat transfer
    Patent number: 6441312
    Abstract: An electronic package in which an electronic component (e.g., LSI chip module) includes a heat dissipating surface (e.g., metal layer) and is positioned on a printed wiring board such that the heat dissipating surface is located adjacent a heat transfer area on the board. The heat transfer area is in the form of a pattern of solder-applied areas from which the solder bonds to the heat dissipating layer to provide heat transfer from the component to the board. Through holes may also be used in the board to increase heat removal.
    Type: Grant
    Filed: June 26, 2001
    Date of Patent: August 27, 2002
    Assignee: International Business Machines Corporation
    Inventors: Hirotoshi Tanimura, Keiichi Ohtsubo, Shinji Ueno
  • Electronic package with plurality of solder-applied areas providing heat transfer
    Publication number: 20020050380
    Abstract: An electronic package in which an electronic component (e.g., LSI chip module) includes a heat dissipating surface (e.g., metal layer) and is positioned on a printed wiring board such that the heat dissipating surface is located adjacent a heat transfer area on the board. The heat transfer area is in the form of a pattern of solder-applied areas from which the solder bonds to the heat dissipating layer to provide heat transfer from the component to the board. Through holes may also be used in the board to increase heat removal.
    Type: Application
    Filed: June 26, 2001
    Publication date: May 2, 2002
    Applicant: International Business Machines Corporation
    Inventors: Hirotoshi Tanimura, Keiichi Ohtsubo, Shinji Ueno