Patents by Inventor Keiichi Ohuchi

Keiichi Ohuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device-cable assembly integrally molded with resin
    Patent number: 8242370
    Abstract: A device-cable assembly integrally molded with a resin according to the present invention comprises: the electric/electronic device; the cable including: a cable sheath which is the outermost layer of the cable, the cable sheath being made of a mixture of a fluorocarbon-based polymer and a polyolefin-based copolymer, and fine silica particles that are deposited on the surface of the cable sheath by CCVD (combustion chemical vapor deposition); and the molded resin which integrally covers the electric/electronic device and the cable together, the molded resin being made of a polyamide-based resin.
    Type: Grant
    Filed: May 7, 2010
    Date of Patent: August 14, 2012
    Assignee: Hitachi Cable, Ltd.
    Inventors: Akihiro Tanba, Keiichi Ohuchi
  • DEVICE-CABLE ASSEMBLY INTEGRALLY MOLDED WITH RESIN
    Publication number: 20110067919
    Abstract: A device-cable assembly integrally molded with a resin according to the present invention comprises: the electric/electronic device; the cable including: a cable sheath which is the outermost layer of the cable, the cable sheath being made of a mixture of a fluorocarbon-based polymer and a polyolefin-based copolymer, and fine silica particles that are deposited on the surface of the cable sheath by CCVD (combustion chemical vapor deposition); and the molded resin which integrally covers the electric/electronic device and the cable together, the molded resin being made of a polyamide-based resin.
    Type: Application
    Filed: May 7, 2010
    Publication date: March 24, 2011
    Inventors: Akihiro TANBA, Keiichi OHUCHI