Patents by Inventor Keiichi Ookawa

Keiichi Ookawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Publication number: 20040150082
    Abstract: A semiconductor device, wherein a first metallic member is bonded to a first electrode of a semiconductor element via a first metallic body containing a first precious metal, and a second metallic member is bonded to a second electrode via a second metallic body containing a second precious metal.
    Type: Application
    Filed: January 16, 2004
    Publication date: August 5, 2004
    Inventors: Ryoichi Kajiwara, Masahiro Koizumi, Toshiaki Morita, Kazuya Takahashi, Munehisa Kishimoto, Shigeru Ishii, Toshinori Hirashima, Yasushi Takahashi, Toshiyuki Hata, Hiroshi Sato, Keiichi Ookawa