Patents by Inventor Keiichi Osamura

Keiichi Osamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150000824
    Abstract: An adhesive sheet for protecting the back face of a solar battery module includes a synthetic resin substrate layer, and an adhesive compound layer laminated on the back face side of the substrate layer, and the adhesive compound layer having an average thickness of 0.01 mm or greater and 1 mm or less.
    Type: Application
    Filed: September 12, 2014
    Publication date: January 1, 2015
    Inventors: Keiichi OSAMURA, Toshiro KOBAYASHI, Koji KAWASHIMA
  • Publication number: 20140130851
    Abstract: A tacky sheet for protecting a back face of a solar battery module includes a synthetic resin substrate layer, a tacky material layer laminated on one face side of the synthetic resin substrate layer, the tacky material layer having an average thickness of 0.01 mm or greater and 1 mm or less, and the tacky sheet being to be attached to a back face of a back sheet of a solar battery module via the tacky material layer.
    Type: Application
    Filed: January 16, 2014
    Publication date: May 15, 2014
    Applicant: Keiwa Inc.
    Inventors: Keiichi OSAMURA, Toshiro Kobayashi, Koji Kawashima
  • Publication number: 20110100415
    Abstract: An adhesive sheet for protecting the back face of a solar battery module includes a synthetic resin substrate layer, and an adhesive compound layer laminated on the back face side of the substrate layer, and the adhesive compound layer having an average thickness of 0.01 mm or greater and 1 mm or less.
    Type: Application
    Filed: November 1, 2010
    Publication date: May 5, 2011
    Inventors: Keiichi Osamura, Toshiro Kobayashi, Koji Kawashima
  • Publication number: 20110100425
    Abstract: A heat dissipation sheet for the back face of a solar battery module includes a heat dissipation film, and an adhesive compound layer laminated on one face side of the heat dissipation film. The heat dissipation film preferably has a fine bumpy shape on the entire surface of another face. The heat dissipation film preferably includes a substrate layer in which the adhesive compound layer is laminated on one face side, and a heat dissipation layer laminated on another face side of the substrate layer. The heat dissipation layer preferably includes fine particles, and a binder for the fine particles.
    Type: Application
    Filed: November 1, 2010
    Publication date: May 5, 2011
    Inventors: Keiichi Osamura, Toshiro Kobayashi, Koji Kawashima