Patents by Inventor Keiichi Shimada

Keiichi Shimada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive Polymer Fibers, Method And Device For Producing Conductive Polymer Fibers, Biological Electrode, Device For Measuring Biological Signals, Implantable Electrode, And Device For Measuring Biological Signals
    Publication number: 20240145112
    Abstract: Conductive polymer fibers 10, in which a conductor 12 containing a conductive polymer impregnates and/or adheres to base fibers 11, and the aforementioned conductive polymer is PEDOT-PSS.
    Type: Application
    Filed: October 30, 2023
    Publication date: May 2, 2024
    Applicant: NIPPON TELEGRAPH AND TELEPHONE CORPORATION
    Inventors: Shingo TSUKADA, Hiroshi NAKASHIMA, Akiyoshi SHIMADA, Koji SUMITOMO, Keiichi TORIMITSU
  • Semiconductor device
    Patent number: 9196609
    Abstract: A semiconductor device includes a first contact plug, a diametric dimension of an upper end portion thereof greater than the lower end portion thereof; a first insulating film above a substrate and covering the first plug; a second contact plug, a diametric dimension of an upper end portion thereof less than lower end portion thereof, the lower end portion contacting the upper end portion of the first plug; a second insulating film above the first insulating film and the first plug and covering the second plug; a wiring layer including a lower end portion contacting the upper end portion of the second plug; and a third insulating film above the second insulating film and the second plug and covering the wiring layer; wherein the upper end portion of the first plug displaced from the lower end portion of the second plug has a step.
    Type: Grant
    Filed: March 13, 2014
    Date of Patent: November 24, 2015
    Assignee: KABUSHIKI KAISHA TOSHIBA
    Inventors: Hajime Kaneko, Keiichi Shimada, Takamasa Usui
  • SEMICONDUCTOR DEVICE
    Publication number: 20150076708
    Abstract: A semiconductor device includes a first contact plug, a diametric dimension of an upper end portion thereof greater than the lower end portion thereof; a first insulating film above a substrate and covering the first plug; a second contact plug, a diametric dimension of an upper end portion thereof less than lower end portion thereof, the lower end portion contacting the upper end portion of the first plug; a second insulating film above the first insulating film and the first plug and covering the second plug; a wiring layer including a lower end portion contacting the upper end portion of the second plug; and a third insulating film above the second insulating film and the second plug and covering the wiring layer; wherein the upper end portion of the first plug displaced from the lower end portion of the second plug has a step.
    Type: Application
    Filed: March 13, 2014
    Publication date: March 19, 2015
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Hajime KANEKO, Keiichi Shimada, Takamasa Usui
  • IC card reader and writer
    Patent number: D437851
    Type: Grant
    Filed: May 2, 2000
    Date of Patent: February 20, 2001
    Assignee: Hitachi, Ltd.
    Inventors: Satoko Kojima, Masayuki Ohki, Takeshi Minemoto, Koji Suso, Keiichi Shimada