Abstract: A card key has a molded body and an upper and a lower housings. The molded body has a circuit board, to which electronic parts for communicating with an in-vehicle equipment are mounted and which is covered with resin. The molded body is formed in a plate shape. The upper and the lower housings are fixed to each other so that the molded body is arranged between them. An external appearance of the card key is defined by the upper and the lower housings.

Abstract: A method of making an electronic circuit device includes placing a circuit board in a cavity of a mold such that one side of the circuit board is held in close contact with an inner surface of the cavity, and encapsulating the circuit board in a casing by filling the cavity with a resin material. The one side of the circuit board is exposed to one side of an outer surface of the casing to define part of the one side of the outer surface of the casing. The method further includes thinning the casing by machining the entire one side of the outer surface of the casing.

Abstract: A card key includes a circuit board and a plate-shaped key body. The circuit board is mounted with electronic parts that configure an electronic circuit for performing radio communication with an on-vehicle device. The key body is mounted with the circuit board which is covered with a resin material. The key body has a principal front surface on the side of which the electronic parts are mounted, and has a main body recess sunk to a predetermined depth level from the principal front surface and a key component accommodating recess further sunk to a level deeper than the main body recess and opened in a bottom surface of the main body recess. The key body forms an outline of the card key together with a sheet body fitted to the main body recess. The key component accommodating portion is formed between the sheet body and the key component accommodating recess.

Abstract: A card key has a molded body and an upper and a lower housings. The molded body has a circuit board, to which electronic parts for communicating with an in-vehicle equipment are mounted and which is covered with resin. The molded body is formed in a plate shape. The upper and the lower housings are fixed to each other so that the molded body is arranged between them. An external appearance of the card key is defined by the upper and the lower housings.

Abstract: A method of making an electronic circuit device includes placing a circuit board in a cavity of a mold such that one side of the circuit board is held in close contact with an inner surface of the cavity, and encapsulating the circuit board in a casing by filling the cavity with a resin material. The one side of the circuit board is exposed to one side of an outer surface of the casing to define part of the one side of the outer surface of the casing. The method further includes thinning the casing by machining the entire one side of the outer surface of the casing.

Abstract: A method of making an electronic circuit device includes placing a circuit board in a cavity of a mold such that one side of the circuit board is held in close contact with an inner surface of the cavity, and encapsulating the circuit board in a casing by filling the cavity with a resin material. The one side of the circuit board is exposed to one side of an outer surface of the casing to define part of the one side of the outer surface of the casing. The method further includes thinning the casing by machining the entire one side of the outer surface of the casing.

Abstract: A method of making an electronic circuit device includes expelling air from a gap between a circuit board and an electronic element mounted on only a first side of the circuit board by filling the gap with a filling member, placing the circuit board in a mold cavity such that a second side of the circuit board is held in close contact with an inner surface of the cavity. The method further includes encapsulating the circuit board with a resin material by injecting the resin material into the cavity.

Abstract: A card key includes a circuit board and a plate-shaped key body. The circuit board is mounted with electronic parts that configure an electronic circuit for performing radio communication with an on-vehicle device. The key body is mounted with the circuit board which is covered with a resin material. The key body has a principal front surface on the side of which the electronic parts are mounted, and has a main body recess sunk to a predetermined depth level from the principal front surface and a key component accommodating recess further sunk to a level deeper than the main body recess and opened in a bottom surface of the main body recess. The key body forms an outline of the card key together with a sheet body fitted to the main body recess. The key component accommodating portion is formed between the sheet body and the key component accommodating recess.

Abstract: A method of producing an electronic device includes a holding of a circuit board and a decoration sheet in a cavity of a mold, and a filling and solidifying of thermosetting resin in the cavity. A casing is molded by the solidified thermosetting resin so as to seal electronic parts and a first face of the circuit board having the electronic parts. Further, the decoration sheet is integrated with the casing by the solidified thermosetting resin. An outer surface of the casing is defined by a second face of the circuit board opposite from the first face and the decoration sheet.

Abstract: A method of producing an electronic device includes a molding of a first casing to seal a first face of a circuit board and electronic parts mounted on the first face. The producing method further includes a mounting of electronic parts on a second face of the circuit board opposite from the first face, after the molding of the first casing is finished. The producing method further includes a molding of a second casing to seal the second face of the circuit board and the electronic parts mounted on the second face. The molding of the second casing integrates the first casing and the second casing with each other.

Abstract: A method of producing an electronic device includes a molding of a first casing to seal a first face of a circuit board and electronic parts mounted on the first face. The producing method further includes a mounting of electronic parts on a second face of the circuit board opposite from the first face, after the molding of the first casing is finished. The producing method further includes a molding of a second casing to seal the second face of the circuit board and the electronic parts mounted on the second face. The molding of the second casing integrates the first casing and the second casing with each other.

Abstract: A method of producing an electronic device includes a holding of a circuit board and a decoration sheet in a cavity of a mold, and a filling and solidifying of thermosetting resin in the cavity. A casing is molded by the solidified thermosetting resin so as to seal electronic parts and a first face of the circuit board having the electronic parts. Further, the decoration sheet is integrated with the casing by the solidified thermosetting resin. An outer surface of the casing is defined by a second face of the circuit board opposite from the first face and the decoration sheet.

Abstract: A carbon dioxide adsorber for use at combustion of fossil fuel, comprising a compressed dry powder of plant fiber. Further, there is provided a fossil fuel characterized in that such a compressed dry powder of plant fiber is contained. The application of a carbon dioxide adsorber for use at combustion of fossil fuel, comprising a compressed dry powder of plant fiber is disclosed.

Abstract: A method of making an electronic circuit device includes preparing an electronic element having at least one projection, mounting the electronic element on only a first side of a circuit board in such a manner that the projection is substantially held in point contact with the first side of the circuit board to form a gap between the circuit board and the electronic element, placing the circuit board in a mold cavity in such a manner that a second side of the circuit board is held in close contact with an inner surface of the cavity. The method further includes encapsulating the circuit board in a casing by filling the cavity with a resin material so that the gap is filled with the resin material.

Abstract: A wireless transceiver includes a resin case having a hollow space that accepts the mechanical key, a mechanical key having a hook for engagement with the resin case, and a reinforcement made of a metal plate for reinforcing the resin case. The hollow space in the resin case is defined by a combination of a thin wall and a thick wall, and the resin case has a depression that accepts the hook on the mechanical key when the mechanical key is accepted in the hollow space. The reinforcement disposed in the proximity of the depression in the thin wall bridges the thin wall and the thick wall when the reinforcement is either embedded in or fixed on both of the thin wall and the thick wall.

Abstract: A wireless transceiver includes a mechanical key, a resin case having a hollow space that accepts the mechanical key and a reinforcement for reinforcing the resin case. The hollow space in the resin case is defined by a combination of a thin wall and a thick wall, and the resin case has the reinforcements made from a thin metal plate in the hollow space at two positions spaced by a predetermined length along a longitudinal direction of the mechanical key being accepted therein. Each of the reinforcements bridges the thin wall and the thick wall that is adjacent to the thin wall.

Abstract: A casing of an electronic key transmitting and receiving apparatus is formed to seal entire bodies of circuit parts, a mounting face of a printed board, on which the circuit parts are mounted, and parts of terminals while the other parts of the terminals are exposed. A rear face of the printed board opposite from the mounting face provides a part of an outer surface of the casing. When the printed board is provided in the casing through an insert molding process, the printed board is held in a cavity of a molding die such that the rear face of the printed board closely contacts an inner face of the cavity. Accordingly, deformation of the printed board due to pressure caused when the resin is poured or when the resin hardens is inhibited.

Abstract: A method of making an electronic circuit device includes preparing an electronic element having at least one projection, mounting the electronic element on only a first side of a circuit board in such a manner that the projection is substantially held in point contact with the first side of the circuit board to form a gap between the circuit board and the electronic element, placing the circuit board in a mold cavity in such a manner that a second side of the circuit board is held in close contact with an inner surface of the cavity. The method further includes encapsulating the circuit board in a casing by filling the cavity with a resin material so that the gap is filled with the resin material.

Abstract: A method of making an electronic circuit device includes expelling air from a gap between a circuit board and an electronic element mounted on only a first side of the circuit board by filling the gap with a filling member, placing the circuit board in a mold cavity such that a second side of the circuit board is held in close contact with an inner surface of the cavity. The method further includes encapsulating the circuit board with a resin material by injecting the resin material into the cavity.

Abstract: A method of making an electronic circuit device includes placing a circuit board in a cavity of a mold such that one side of the circuit board is held in close contact with an inner surface of the cavity, and encapsulating the circuit board in a casing by filling the cavity with a resin material. The one side of the circuit board is exposed to one side of an outer surface of the casing to define part of the one side of the outer surface of the casing. The method further includes thinning the casing by machining the entire one side of the outer surface of the casing.