Patents by Inventor Keiichi Takemoto
Keiichi Takemoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240074172Abstract: In one embodiment, a semiconductor storage device includes a lower electrode layer, a lower insulator, an upper electrode layer and an upper insulator along a first direction. The device further includes a first insulator provided on a side of a second direction of the upper electrode layer, and a second insulator provided between the upper electrode layer and the lower/upper/first insulator. The device further includes a charge storage layer, a third insulator and a semiconductor layer sequentially provided on a side of the second direction of the first insulator. A side face of the first insulator on a side of the upper electrode layer has a convex shape, the charge storage layer includes a first portion having a first thickness, and a second portion having a second thickness less than the first thickness, and the first portion is in contact with the first insulator.Type: ApplicationFiled: March 10, 2023Publication date: February 29, 2024Applicant: Kioxia CorporationInventors: Keiichi SAWA, Tomoyuki TAKEMOTO, Yuta KAMIYA, Hiroyuki YAMASHITA, Yuta SAITO, Tatsunori ISOGAI
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Patent number: 11909335Abstract: An electrostatic chuck includes a base body having a placement surface on which a suction target object is placed, and an electrode embedded in the base body. The base body is provided with a groove that opens to the placement surface-side and does not reach the electrode. Aloes-resistance region made of ceramics and a high-resistance region made of ceramics having a volume resistivity higher than the low-resistance region are sequentially arranged from a side close to the groove between a bottom surface of the groove and the electrode, in a thickness direction of the base body.Type: GrantFiled: December 14, 2021Date of Patent: February 20, 2024Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Takashi Onuma, Keiichi Takemoto
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Patent number: 11830752Abstract: There is provided a substrate fixing device. The substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate and configured to adsorb a subject by electrostatic force. The electrostatic chuck includes: an adsorptive layer configured to adsorb and retain the subject; and a heater layer that is provided between the adsorptive layer and the base plate and configured to heat the subject retrained by the adsorptive layer. A thickness of the heater layer is uniform over an entire area of the heater layer.Type: GrantFiled: June 14, 2021Date of Patent: November 28, 2023Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yoichi Harayama, Keiichi Takemoto
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Patent number: 11699612Abstract: A substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate to adsorb a substrate by electrostatic force. The electrostatic chuck includes: an adsorption layer that is formed of ceramic and that contacts the substrate to adsorb and hold the substrate; a first heating layer that is formed on the adsorption layer and that includes a first electrode; a second heating layer that is formed on the first heating layer and that includes a second electrode; and a via that is provided between the first electrode and the second electrode to electrically connect the first electrode and the second electrode to each other. The via includes a body portion, and an end portion that is connected to the body portion. A diameter of the end portion is larger than that of the body portion.Type: GrantFiled: November 11, 2021Date of Patent: July 11, 2023Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Keiichi Takemoto, Yoichi Harayama, Hiroyuki Asakawa, Takahiro Rokugawa
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Patent number: 11631598Abstract: A substrate fixing device includes a baseplate, an insulating layer over the baseplate, and an electrostatic chuck on the insulating layer. The insulating layer includes a heating element and a metal layer. The metal layer has a higher thermal conductivity than the insulating layer and is positioned closer to the electrostatic chuck than the heating element.Type: GrantFiled: November 22, 2019Date of Patent: April 18, 2023Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Nobuyuki Iijima, Hiroyuki Asakawa, Keiichi Takemoto, Yoichi Harayama
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Publication number: 20230057110Abstract: A base plate has one surface and the other surface opposite to the one surface. An electrostatic chuck is capable of being mounted on the one surface. The base plate includes a refrigerant flow path provided therein. An inner wall of the refrigerant flow path has an upper surface convex toward the one surface in a longitudinal sectional view in a direction intersecting with a direction in which refrigerant flows. An unevenness is formed on the upper surface.Type: ApplicationFiled: August 17, 2022Publication date: February 23, 2023Inventors: Ken Sato, Keiichi Takemoto, Tatsuya Nakamura
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Publication number: 20220310434Abstract: An electrostatic chuck includes: a base body having: a mounting thee on which an object to be adsorbed is to be mounted; and a back face that is opposite to the mounting face; an insulating layer that is formed on the back face; a heating element that is built in the insulating layer and configured to generate heat; and at least one thermal diffusion layer that is built in the base body and configured to diffuse the heat generated by the heating element. The at least one thermal diffusion layer is formed of a material higher in thermal conductivity than the base body.Type: ApplicationFiled: March 23, 2022Publication date: September 29, 2022Inventors: Yusuke Muramatsu, Keiichi Takemoto, Yoichi Harayama
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Publication number: 20220208593Abstract: An electrostatic chuck includes a base body having a placement surface on which a suction target object is placed, a thermal diffusion layer directly formed on a surface of the base body opposite to the placement surface, an insulation layer arranged to be in contact with the thermal diffusion, on a side of the thermal diffusion layer opposite to the base body, and a heat generating body embedded in the insulation layer, The thermal diffusion layer is formed of a material having a thermal conductivity higher than the insulation layer.Type: ApplicationFiled: December 22, 2021Publication date: June 30, 2022Inventors: Yusuke Muramatsu, Keiichi Takemoto
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Publication number: 20220190749Abstract: An electrostatic chuck includes a base body having a placement surface on which a suction target object is placed, and an electrode embedded in the base body. The base body is provided with a groove that opens to the placement surface-side and does not reach the electrode. Aloes-resistance region made of ceramics and a high-resistance region made of ceramics having a volume resistivity higher than the low-resistance region are sequentially arranged from a side close to the groove between a bottom surface of the groove and the electrode, in a thickness direction of the base body.Type: ApplicationFiled: December 14, 2021Publication date: June 16, 2022Inventors: Takashi Onuma, Keiichi Takemoto
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Publication number: 20220157636Abstract: A substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate to adsorb a substrate by electrostatic force. The electrostatic chuck includes: an adsorption layer that is formed of ceramic and that contacts the substrate to adsorb and hold the substrate; a first heating layer that is formed on the adsorption layer and that includes a first electrode; a second heating layer that is formed on the first heating layer and that includes a second electrode; and a via that is provided between the first electrode and the second electrode to electrically connect the first electrode and the second electrode to each other. The via includes a body portion, and an end portion that is connected to the body portion. A diameter of the end portion is larger than that of the body portion.Type: ApplicationFiled: November 11, 2021Publication date: May 19, 2022Inventors: Keiichi Takemoto, Yoichi Harayama, Hiroyuki Asakawa, Takahiro Rokugawa
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Publication number: 20210391203Abstract: There is provided a substrate fixing device. The substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate and configured to adsorb a subject by electrostatic force. The electrostatic chuck includes: an adsorptive layer configured to adsorb and retain the subject; and a heater layer that is provided between the adsorptive layer and the base plate and configured to heat the subject retrained by the adsorptive layer. A thickness of the heater layer is uniform over an entire area of the heater layer.Type: ApplicationFiled: June 14, 2021Publication date: December 16, 2021Inventors: Yoichi Harayama, Keiichi Takemoto
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Publication number: 20200176282Abstract: A substrate fixing device includes a baseplate, an insulating layer over the baseplate, and an electrostatic chuck on the insulating layer. The insulating layer includes a heating element and a metal layer. The metal layer has a higher thermal conductivity than the insulating layer and is positioned closer to the electrostatic chuck than the heating element.Type: ApplicationFiled: November 22, 2019Publication date: June 4, 2020Inventors: Nobuyuki IIJIMA, Hiroyuki ASAKAWA, Keiichi TAKEMOTO, Yoichi HARAYAMA
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Patent number: 10535545Abstract: A substrate fixing device includes a baseplate, an electrostatic chuck, and an insulating layer interposed between the baseplate and the electrostatic chuck. The insulating layer includes a heating element formed of a first material and a wiring line connected in series to the heating element. The wiring line includes a first conductive layer formed of the first material and a second conductive layer joined onto the first conductive layer. The second conductive layer is formed of a second material having a resistivity lower than the resistivity of the first material.Type: GrantFiled: July 26, 2017Date of Patent: January 14, 2020Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yoichi Harayama, Yoji Asahi, Keiichi Takemoto
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Patent number: 10361110Abstract: A substrate holding apparatus includes a baseplate, a heating unit disposed over the baseplate, and an electrostatic chuck disposed on the heating unit, wherein the heating unit includes a heating element having at least one roughened surface and an insulating layer enclosing the heating element, and the insulating layer and the electrostatic chuck are directly bonded to each other.Type: GrantFiled: July 28, 2017Date of Patent: July 23, 2019Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Keiichi Takemoto, Yoichi Harayama, Yoji Asahi, Shuzo Aoki
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Publication number: 20180047604Abstract: A substrate holding apparatus includes a baseplate, a heating unit disposed over the baseplate, and an electrostatic chuck disposed on the heating unit, wherein the heating unit includes a heating element having at least one roughened surface and an insulating layer enclosing the heating element, and the insulating layer and the electrostatic chuck are directly bonded to each other.Type: ApplicationFiled: July 28, 2017Publication date: February 15, 2018Inventors: Keiichi TAKEMOTO, Yoichi HARAYAMA, Yoji ASAHI, Shuzo AOKI
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Publication number: 20180040497Abstract: A substrate fixing device includes a baseplate, an electrostatic chuck, and an insulating layer interposed between the baseplate and the electrostatic chuck. The insulating layer includes a heating element formed of a first material and a wiring line connected in series to the heating element. The wiring line includes a first conductive layer formed of the first material and a second conductive layer joined onto the first conductive layer. The second conductive layer is formed of a second material having a resistivity lower than the resistivity of the first material.Type: ApplicationFiled: July 26, 2017Publication date: February 8, 2018Inventors: Yoichi HARAYAMA, Yoji ASAHI, Keiichi TAKEMOTO
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Patent number: 7276438Abstract: A method of manufacturing a wiring substrate of the present invention, includes a step of preparing a substrate containing a semi-cured resin layer or a thermo plastic resin layer, a step of forming a through hole that passes through the substrate, a step of inserting a conductive parts in the through hole, a step of curing the semi-resin layer or the thermo plastic resin layer in a state that the resin layer is made to flow by applying a thermal press to the substrate and filling a clearance between the through hole and the conductive parts with the resin layer, and a step of forming a wiring pattern, which is connected mutually via the conductive parts, on both surface sides of the substrate.Type: GrantFiled: May 24, 2005Date of Patent: October 2, 2007Assignee: Shinko Electric Industries Co., Ltd.Inventors: Yasuyoshi Horikawa, Keiichi Takemoto
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Publication number: 20050277282Abstract: A method of manufacturing a wiring substrate of the present invention, includes a step of preparing a substrate containing a semi-cured resin layer or a thermo plastic resin layer, a step of forming a through hole that passes through the substrate, a step of inserting a conductive parts in the through hole, a step of curing the semi-resin layer or the thermo plastic resin layer in a state that the resin layer is made to flow by applying a thermal press to the substrate and filling a clearance between the through hole and the conductive parts with the resin layer, and a step of forming a wiring pattern, which is connected mutually via the conductive parts, on both surface sides of the substrate.Type: ApplicationFiled: May 24, 2005Publication date: December 15, 2005Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yasuyoshi Horikawa, Keiichi Takemoto