Abstract: A resin composition for reflecting light of the present invention includes an epoxy resin B having a unit structure X of alicyclic acid anhydride and a unit structure Y of hydrogenated bisphenol, and a colorant. The epoxy resin B preferably further has a unit structure Z of bisphenol-type epoxy. In addition, the resin composition for reflecting light of the present invention preferably further includes an epoxy resin A having a structure represented by the following formula (1). Then, when a content of the epoxy resin A is M [% by mass], and a content of the epoxy resin B is N [% by mass], it is preferable to satisfy a relationship of 0.1?M/N?10. (In the formula (1), R represents a monovalent organic group having 2 to 10 carbon atoms, and n represents an integer of 3 to 50.

Abstract: Provided is a resin composition for encapsulation including: a curing resin; and an inorganic filler, in which the resin composition encapsulates a semiconductor element provided over a substrate and fills a gap between the substrate and the semiconductor element, and when a particle diameter at a cumulative frequency of 5% in order from the largest particle diameter in a volume particle diameter distribution of particles contained in the inorganic filler is represented by Rmax (?m), and when a maximum peak diameter in the volume particle diameter distribution of the particles contained in the inorganic filler is represented by R (?m), R<Rmax, 1 ?m?R?24 ?m, and R/Rmax?0.45.

Abstract: There is provided a circuit board manufacturing method that makes it possible to manufacture a next-generation semiconductor device in a stable manner and improve the yield during secondary mounting processing. A circuit board 11 with a thickness of 230 ?m manufactured using a cyanate-based prepreg 12 containing a resin composition with which a glass cloth is impregnated is heated at a higher temperature than a glass transition temperature of the resin composition after it is cured before reflow processing.

Abstract: Disclosed is a granular resin composition for encapsulating a semiconductor used for a semiconductor device obtained by encapsulating a semiconductor element by compression molding, satisfying the following requirements (a) to (c) on condition that ion viscosity is measured with a dielectric analyzer under a measurement temperature of 175° C. and a measurement frequency of 100 10 Hz: (a) the time from the initiation of the measurement until a decrease of the ion viscosity to the lowest ion viscosity is 20 seconds or shorter; (b) the lowest ion viscosity value is not more than 6.5; and (c) the time interval between the time from the initiation of the measurement until a decrease of the ion viscosity to the lowest ion viscosity and the time from the initiation of the measurement until the ion viscosity reaching 90% of an ion viscosity value measured at 300 seconds is 10 seconds or longer.

Abstract: Disclosed is a granular resin composition for encapsulating a semiconductor used for a semiconductor device obtained by encapsulating a semiconductor element by compression molding, satisfying the following requirements (a) to (c) on condition that ion viscosity is measured with a dielectric analyzer under a measurement temperature of 175° C. and a measurement frequency of 100 Hz: (a) the time from the initiation of the measurement until a decrease of the ion viscosity to the lowest ion viscosity is 20 seconds or shorter; (b) the lowest ion viscosity value is not more than 6.5; and (c) the time interval between the time from the initiation of the measurement until a decrease of the ion viscosity to the lowest ion viscosity and the time from the initiation of the measurement until the ion viscosity reaching 90% of an ion viscosity value measured at 300 seconds is 10 seconds or longer.

Abstract: There is provided a circuit board manufacturing method that makes it possible to manufacture a next-generation semiconductor device in a stable manner and improve the yield during secondary mounting processing. A circuit board 11 with a thickness of 230 ?m manufactured using a cyanate-based prepreg 12 containing a resin composition with which a glass cloth is impregnated is heated at a higher temperature than a glass transition temperature of the resin composition after it is cured before reflow processing.